• 한국생산제조학회지
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• 제21권4호
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• pp.658-665
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• 2012

Micro-EDM is widely used in metallic pattern, electronics, nuclear power and industry in the form of precision process. The improvement of Electro Discharge Machining has been on a steady progress since $19^{th}$ century. The technology has overcome the limits of the traditional precision process, enabling micro-EDM, micro electrolytic machining, micro drilling, micro punching and laser beam machining, which create versatile products with smaller sizes. What have been known about the major feature of Micro-EDM is high thermal energy so that their products are free from the hardness of their products as long as they are electrical conductor. However, each metal is suspected to have different features and natures even if they are created through the same procedure. In this thesis, the methodology of Micro-EDM and how to categorize them are explained. Also, the nature of the examined materials with surface shape and surface roughnes are analyzed. The results of the experiments are expected to understand surface roughness and workability of other materials for Micro-EDM.

• 한국기계가공학회지
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• 제13권2호
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• pp.41-48
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• 2014

Direct writing(DW) is a method of patterning materials to a substrate directly, without a mask. It can use a variety of materials and be applied to various fields. Among DW systems, the flow-based type, using a syringe pump and nozzle, is simpler than other types. Furthermore, the range of materials is exceptionally wide. In additive processes, a three dimensional structure is made of stacking layer. Each layer is made of several lines. In this regard, good surface roughness of fabricated layers is essential to three dimensional fabrication. The surface roughness of any fabricated layer tends to change with the dispensing pattern. When multiple layers fabricated by a nozzle dispensing system are stacked, control of the nozzle position from the substrate is important in order to avoid interference between the nozzle and the fabricated layer. In this study, a fluid direct writing system for three dimensional structure fabrication was developed. Experimentsto control the position of the nozzle from substrate were conducted in order to examine the characteristics of the material used in this system.

• 한국기계가공학회지
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• 제19권11호
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• pp.102-108
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• 2020

The demand for lightweight materials and high-strength steel has rapidly increased to help reduce the weight of a vehicle body; it improves the fuel efficiency of automobiles and provides passenger safety. Additionally, as the material becomes thinner, the demand for its resistance against corrosion becomes higher. Hence, the application of the surface-treated steel sheet has surged rapidly. In this study, a weld bonding experiment using a delta spot welding machine is performed on a thin sheet of a different material (Al6061-T6/GA440). The thickness of the material was kept at 1 mm to reduce the weight of the automobile body parts. Additionally, the purpose of this study is to control the heat input by applying the welding conditions of a multi-stage pressure pattern to improve corrosion resistance shear strength. The analysis of nugget diameter measurement, shear tensile test, and salt spray test was performed to achieve the aim.

• 한국전기전자재료학회논문지
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• 제35권1호
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• pp.32-36
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• 2022

AGZO thin films were deposited on glass substrates using RF magnetron sputtering system under Ar flow rates, and their structural, electrical, and optical properties were analyzed systematically. As a result of the XRD pattern, the peak of the (002) (2θ≈33.7˚) orientation was observed, and it was found to have a hexagonal wurtzite structure. The sheet resistance of Ar 5 sccm was 3.073×10² Ω/sq and showed the best electrical properties because of the improvement of mobility due to the increase of the grain size and the variation of RMS roughness. In addition, the average transmittance was more than 90% for all samples, which demonstrated good optical properties. It is expected that the TCO characteristics can be improved by controlling Ar flow rates, and this will increase the efficiency of photoelectronic devices such as OLED and solar cells.

• 한국항만학회지
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• 제12권1호
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• pp.95-104
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• 1998

Water pollution in a semi-enclosed sea area such as a bay due to stagnancy of water has been a serious water environmental problem. Recently, some kinds of new methods to activate the tidal exchange between an inner bay and an outer sea area by control of a tidal residual current have been proposed. However, these methods have several problems, that is, I). deterioration in a natural view due to building of huge structures, II). increase of risk of navigation in case of a submerged structure, III). limition of sea area where a tidal current can be controlled and IV). difficulty in removing those structures in case of occurrence of an unexpected impact on water environment. In this paper, a new method is proposed, which can solve all the above problems, to purify water quality in a semi-enclosed bay by creation and control of a pattern of a tidal residual current. The tidal residual current is controlled by unsymmetric structures, which change the properties of resistance according to the direction of flow, arranged on the sea bottom. In this study, several numerical and hydraulic experiments of tidal current and particle-tracking for various arrangements of bottom roughness in a semi-enclosed model bay were carried out. As a result of experiments, it becomes clear that it is possible to generate a new tidal residual current and to activate a tidal exchange by only operation of bottom roughness arrangement.

• 분석과학
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• 제5권3호
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• pp.303-308
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• 1992

Ti과 Si의 초기 반응이 Titanium Silicide의 표면 거칠기 (Surface roughness)를 고찰하기 위해 연구하였다. 형성기구는 In-situ AES와 LEED의 측정장비로 연구하였다. Ti의 하나나 두 원자층이 초고진공에서 원자적으로 깨끗한 Si 기판 위에 증착되었다. Reconstruction이 된 $7{\times}7$ Si(111) 표면이 초 고진공하에서 얻어졌으며 박막의 증착은 Quartz Crystal Oscillator로 측정되었다. In-situ 측정 결과 Ti과 Si의 초기 반응이 실온에서 일어났으며 Disorder막을 형성하였다. 낮은 온도($200^{\circ}C{\sim}300^{\circ}C$)에서 Ti과 Si의 Intermixing이 고찰되었고 $400^{\circ}C$ 근처에서 $1{\times}1$ Si(111) LEED 패턴이 관찰되었다. 이것은 Disorder막이 Order막으로 변화가 생긴 것을 나타낸다. 더 높은 온도에서 $7{\times}7$ Si(111) LEED 패턴이 재관찰되었는데 이것은 3차원적인 $TiSi_2$의 형성을 증명하는 것이다.

• Tribology and Lubricants
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• 제32권4호
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• pp.119-124
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• 2016

In the sapphire wafering process, lapping is a crucial operation in order to reduce the damaged layer and achieve the target thickness. Many parameters, such as pressure, velocity, abrasive, slurry and plate, affect lapping characteristics. This paper presents an experimental investigation on the effect of the plate groove on the material removal rate and roughness of the wafer. We select the spiral pattern and rectangular type as the groove shapes. We vary the groove density by controlling the groove shape dimension, i.e., the groove width and pitch. As the groove density increases to 0.4, the material removal rate increases and gradually reaches a saturation point. When the groove density is low, the pressing load is mostly supported by the thick film, and only a small amount acts on the abrasives resulting to a low material removal rate. The roughness decreases on increasing the groove density up to 0.3 because thick film makes partial participations of large abrasives which make deep scratches. From these results, we could conclude that the groove affects the contact condition between the wafer and plate. At the same groove density, the pitch has more influence on reducing the film thickness than the groove width. By decreasing the groove density with a smaller pitch and larger groove width, we could achieve a high material removal rate and low roughness. These results would be helpful in understanding the groove effects and determining the appropriate groove design.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.458-458
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• 2010

The process window for the etch selectivity of silicon nitride ($Si_3N_4$) layers to extreme ultra-violet (EUV) resist and variation of line edge roughness (LER) of EUV resist were investigated durin getching of $Si_3N_4$/EUV resist structure in a dual-frequency superimposed capacitive coupled plasma (DFS-CCP) etcher by varying the process parameters, such as the $CH_2F_2$ and $N_2$ gas flow rate in $CH_2F_2/N_2$/Ar plasma. The $CH_2F_2$ and $N_2$ flow rate was found to play a critical role in determining the process window for infinite etch selectivity of $Si_3N_4$/EUV resist, due to disproportionate changes in the degree of polymerization on $Si_3N_4$ and EUV resist surfaces. The preferential chemical reaction between hydrogen and carbon in the hydrofluorocarbon ($CH_xF_y$) polymer layer and the nitrogen and oxygen on the $Si_3N_4$, presumably leading to the formation of HCN, CO, and $CO_2$ etch by-products, results in a smaller steady-state hydrofluorocarbon thickness on $Si_3N_4$ and, in turn, in continuous $Si_3N_4$ etching due to enhanced $SiF_4$ formation, while the $CH_xF_y$ layer is deposited on the EUV resist surface. Also critical dimension (and line edge roughness) tend to decrease with increasing $N_2$ flow rate due to decreased degree of polymerization.

• The Journal of Advanced Prosthodontics
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• 제14권6호
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• pp.335-345
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• 2022

PURPOSE. This in vitro study aimed to evaluate the surface characteristics of a full veneer crown fabricated chairside (CS) from a (Y, Nb)-TZP zirconia block in response to conventional zirconia grinding and polishing. MATERIALS AND METHODS. Zirconia crowns (n = 40) were first prepared and divided into two groups of materials: Labside (LS) and CS, after which each specimen went through a five-step grinding and polishing procedure. Following each surface treatment, surface characteristics were analyzed using confocal laser microscopy (CLSM), average surface roughness (Ra) values were processed from the profile data through Gaussian filtering, and X-ray diffraction pattern analysis was performed to evaluate the monoclinic (M) phase content. Then, a representative specimen was selected for field-emission scanning electron microscopy (FE-SEM), followed by a final analysis of the roughness and X-ray diffraction of the specimens using the independent t-test and repeated measures analysis of variance (RM-ANOVA). RESULTS. In every group, polishing significantly reduced the Ra values (P < .001). There was no significant difference in Ra between the polished state CS and LS. Furthermore, CLSM and FE-SEM investigations revealed that even though grain exposure was visible in CS specimens throughout the as-delivered and ground states, the exposure was reduced after polishing. Moreover, while no phase transformation was visible in the LS, phase transformation was visible in CS after every surface treatment, with the M phase content of the CS group showing a significant reduction after polishing (P < .001). CONCLUSION. Within the limits of this study, clinically acceptable level of surface finishing of (Y, Nb)-TZP can be achieved after conventional zirconia polishing sequence.

• 전자공학회논문지D
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• 제35D권9호
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• pp.20-25
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• 1998

대면적 평탄화 및 미세패턴형성기술로 각광받고 있는 CMP(chemical mechanical polishing) 공정을 이용하여 SiO₂ trench 패턴의 피치크기와 밀도에 따른 Cu의 평탄화 과정과 평탄화 이후의 표면 profile을 AFM(atomic forced microscopy)으로 측정하고 분석하였다. 실험결과, 평탄화 초기 연마율은 패턴밀도가 높고 피치크기가 작을수록 연마율이 증가하였으며, 초기 평탄화 이후 연마율이 급속히 감소함을 알 수 있었다. 말기 평탄화 이후, 전체 패턴의 평균 rms roughness는 120Å이었다. 그러나, 패턴피치 크기가 2㎛ 이하이고, 50% 패턴밀도를 갖는 패턴의 경우에는 Cu의 일부분이 120∼330Å 정도의 깊이로 떨어져 나가는 현상과 SiO₂와 Cu의 경계면에 oxide erosion 현상이 나타났으며, 패턴 피치 크기가 10㎛ 및 15㎛에서는 Cu와 SiO₂경계면 부분에 Cu가 260∼340Å 정도로 trench 되어 있는 것을 볼 수 있었다. 또한, SiO₂와 Cu의 패턴내부 및 접합면에서 생기는 수백 Å이하의 peeling 및 deeping 현상의 원인과 해결방안에 대해 논의하였다.