• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2008년도 춘계학술대회 논문집
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• pp.3-5
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• 2008

The $SrBi_2Ta_2O_9$ thin films are deposited on Pt-coated electrode(Pt/$TiO_2/SiO_2$/Si) using RF magnetron sputtering method. The ferroelectric properties of SBT capacitors with annealing temperatures were studied. Through the x-ray diffraction analysis and the scanning electron microscopy (SEM), it could be observed that crystallization of the SBT thin film started around $650^{\circ}C$ and complete crystallization was accomplished around $750^{\circ}C$ and grains grew from a small spheric form to rod-like. For the leakage current density of the SBT capacitor depending upon various annealing atmospheres, capacitor annealed in the oxygen atmosphere showed the most excellent characteristic, and they were respectively about $2.13\times10^{-9}[A/cm^2]$ at 5V and 340.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제26권1호
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• pp.56-63
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• 2013

IGZO thin films have been prepared by RF magnetron sputtering. The structural, electrical and optical properties of the IGZO thin films have been investigated as a function of deposition condition. XRD analysis of IGZO thin films showed a typical crystallographic orientation with c-axis perpendicular regardless of deposition conditions. The carrier mobility, carrier concentration and resistivity of the IGZO films sputtered at 200 W, 1mTorr and $300^{\circ}C$ were $28.5cm^2/V{\cdot}sec$, $2.6{\times}10^{20}cm^3$, $8.8{\times}10^{-4}{\Omega}{\cdot}cm$ respectively. The optical transmittance were higher than 80% at visible region regardless of the deposition conditions under the experiments above, and specifically higher than 90% at wave length over 500 nm. The absorption edge was shifted to shorter wavelength with increase of carrier concentration.

• Applied Science and Convergence Technology
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• 제23권5호
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• pp.279-283
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• 2014

Al doped ZnO thin films have been deposited by a RF magnetron sputtering technique from a ZnO (2 wt.% $Al_2O_3$) target onto glass substrates heated at temperature ranging from RT to $400^{\circ}C$. X-ray diffraction analysis shows that the deposits have a preferential growth along the c-axis of a hexagonal structure. The full with at half maximum decreases from 0.45 to $0.43^{\circ}$ in the studied temperature range. The root main square surface roughness increases with substrate temperature from 1.89 to 2.67 nm. All films are transparent up to 80% in the visible wavelength range and the adsorption edge is red-shifted with substrate temperature from RT to $400^{\circ}C$. The sheet resistance increases from 92 ohm/sq to 419 ohm/sq when the deposition temperature increases from RT to $400^{\circ}C$. The increment of sheet resistance is caused by lowered carrier concentration resulting from an increase in surface roughness.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.176-176
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• 2010

전자기술이 발전함에 따라 전자부품 소자는 소형화, 다기능화, 고집적화, 대용량화 되고 있다. 그에 따른 부품들의 고밀도화는 높은 열을 발생시켜 각종 전자부품을 기판으로부터 단락 시키거나 기능을 상실하게 하는 문제점이 발생된다. 이와 같은 문제점을 해결하기 위해서는 발생된 열을 가능한 빠르게 방열 시켜주는 것이 대단히 중요하고 높은 방열 특성을 가지는 금속 PCB기판의 중요성이 높아지고 있다. 하지만 금속을 PCB에 적용하기 위해서는 금속기판과 회로전극사이에 절연층이 반드시 필요하다. 본 실험에서는 RF-Magnetron Sputtering 방법을 이용하여 AlN(질화알루미늄)을 절연물질로 사용, Aluminum기판위에 후막을 제작하여 열적 전기적 구조적 특성을 분석 하였다. 스퍼터링시 아르곤과 질소 분압비에 따른 특성과 후막의 두께에 따른 열적, 전기적, 구조적 특성을 측정 분석하였고, 후열처리를 통하여 AlN 후막의 특성 측정 결과 $200^{\circ}C$로 후열처리 했을 경우 절연파괴전압이 후열처리 전 0.56kV보다 1.125kV로 높아지고 SEM 이미지 상의 AlN 입자 밀도가 더욱 조밀해지는 것으로 확인 하였다. 결론적으로 AlN를 RF-Magnetron Sputtering 방법으로 증착 금속 PCB의 절연물질로 적용하기 위해서는 적정한 가스분압비와 후열처리가 필요하며 이를 통하여 금속 PCB의 절연층으로 응용 가능성이 높을 것으로 사료된다. 본 연구는 한국 산업기술 진흥원의 사업화 연계 연구개발(R&BD)사업의 연구비 지원에 의한 것입니다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제35권2호
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• pp.172-177
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• 2022

The quench voltage of the second-generation superconducting wire is affected by the resistivity characteristics of the stabilization layer. The specific resistance of the stabilization layer can be changed by the deposition process using RF magnetron sputtering. In this paper, a thin film made of a homogeneous material (Ag) and a dissimilar material (Cu) was deposited on the stabilization layer of the second-generation superconducting wire through RF magnetron sputtering. We found that the specific resistance was reduced by increasing the thickness of the stabilization layer. The reduction in the resistivity of the stabilization layer led to a decrease in the quench voltage of the second-generation superconducting wire. We suggest that various characteristic changes of the second-generation superconducting wire can be expected through the successful change in the resistivity of the stabilization layer of the proposed deposition process.

• Journal of Ceramic Processing Research
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• 제13권spc2호
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• pp.407-410
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• 2012

The properties of Al-doped ZnO (AZO) films were investigated as a function of H2/(Ar + H2) gas ratio using an AZO (2 wt% Al2O3) ceramic target in a radio frequency (RF) magnetron sputtering system. The deposition process was done at 200 ℃ and in 2 × 10-2Torr working pressure and with various ratios of H2/(Ar + H2) gas. During the AZO film deposition process, partial H2 gas affected the AZO film characteristics. The electron resistivity (~ 9.21 × 10-4 Ωcm) was lowest and mobility (~17.8 ㎠/Vs) was highest in AZO films when the H2/(Ar + H2) gas ratio was 2.5%. When the H2/(Ar + H2) gas ratio was increased above 2.5%, the electron resistivity increased and mobility decreased with increasing H2/(Ar + H2) gas ratio in AZO films. The carrier concentration increased with increasing H2/(Ar + H2) gas ratio from 0% to 7.5%. This phenomenon was explained by reaction of hydrogen and oxygen and additional formation of oxygen vacancy. The average optical transmission in the visible light wavelength region over 90% and an orientation of the deposition was [002] orientation for AZO films grown with all H2/(Ar + H2) gas ratios.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.209-209
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• 1999

현재 magnetron sputter는 반도체, LCD 등을 포함하는 microelectronics 산업에서 박막형성을 위한 주요 장비로 널리 쓰이고 있으며, 소자의 고집적화 및 대형화 추세에 따라 그 이용가치는 더욱 증대되고 있다. 본 연구엣는 TFT-LCD용 Color Filter 제조시 ITO박막형성을 위해 사용하는 magnetron sputter 내부의 플라즈마 분포 및 ion kinetic energy에 대한 해석을 실시하였으며, ITO target의 erosion 형상의 원인을 실험결과와 비교하였다. Magnetron sputtering은 target에 가해지는 bias 전압(DC 혹은 RF)에 의해 target과 shield 혹은 target과 substrate 사이에서 생성될 수 잇는 플라즈마를 target 및 부분에 붙어있는 영구자석을 이용하여 target 근처에 집중시키고, target 표면과 플라즈마 사이의 전위차에 의해 가속된 이온들이 target 표면과 충돌하여 이차 전자방출을 일으킴과 동시에 target 표면에서 sputtering을 일으키고, 이들 sputtered 된 중성의 atom 들이 substrate로 날아가 박막을 형성하는 원리로 작동된다. 이때 target에서 방출되는 이차전자들은 영구자석에 의한 자기장 효과에 의해 target 근처에 갇히게 되어 중성 기체분자들과 이온화반응을 통해 플라즈마를 유지하고 그 밀도를 높혀주는 역할을 담당하게 된다. 즉 낮은 압력 및 bias 전압에서도 플라즈마 밀도를 높일수 있고 sputtering 공정이 가능한 장점을 가지고 있다. Magnetron sputtering 현상에 대한 시뮬레이션은 크게 magnetron discharge와 sputtering에 대한 해석 두가지로 나누어 볼 수 있는데, sputtering 현상 자체를 수치묘사할 수 있는 정량적인 모델은 아직까지 명확하게 정립되어 있지 않다. 따라서 본 연구에서는 magnetron plasma 자체에 대한 수치해석에 주안점을 두고 아울러 bulk plasma 영역에서 target으로 입사하는 이온들의 입사에너지 및 입사각도 등을 Monte Carlo 방법으로 추적하여 sputtering 현상을 유추해보았다. Sputtering 현상을 살펴보기 위해 magnetron sputter 내 플라즈마 밀도, 전자온도, 특히 target 및 substrate를 충돌하는 이온의 입사에너지 및 입사각 분포등을 계산하는데 hybrid 방법으로 시뮬레이션을 하였다. 즉 ion과 bulk electron에 대해서는 fluid 방식으로 접근하고, 이차전자 운동과 그로 인한 반응관계 및 target으로 입사하는 이온의 에너지와 입사각 분포는 Monte-Carlo 방법으로 처리하였다. 정지기장해석의 경우 상용 S/W인 Vector Fields를 사용하였다. 이를 통해 sputter 내 플라즈마 특성, target으로 입사하는 이온에너지 및 각 분포, 이들이 target erosion 형상에 미치는 영향을 살펴보았다. 또한 이들 결과로부터 간단한 sputtering 모델을 사용하여 target으로부터 sputter된 입자들이 substrate에 부착되는 현상을 Monte-Carlo 방법으로 추적하여 성막특성도 살펴보았다.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.360.2-360.2
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• 2016

CuSn thin films were fabricated by rf magnetron co-sputtering method on the Si(100) substrate for evaluation of the antibacterial effect. The co-sputtering process was performed with different rf powers and sputtering times to regulate the thickness of the films and relative atomic ratio of Cu to Sn. The physicochemical properties of the CuSn thin films were characterized by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), X-ray induced Auger electron spectroscopy (XAES), Optical microscope (OM), 4-point probe, and antibacterial test. An antibacterial test was conducted with Escherichia coli (E. coli) and Staphylococcus aureus (S. aureus) as changing contact times between CuSn fillms and bacteria suspension. We compared to the crystalline structures of films before sterilization and after sterilization by XRD measurement. The changes of oxidation states of Cu and Sn and the chemical environment of films before and after antibacterial test were investigated with high resolution XPS spectra in the regions of Cu 2p, Cu LMM, and Sn 3d. After antibacterial test, the morphology of the films was checked with an OM images. The electrical properties of the CuSn films such as surface resistance and conductivity were measured by using 4-point probe.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제24권2호
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• pp.126-130
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• 2011

In this study, off-axis magnetron sputtering was used for the crystallized ITO thin films at a low temperature of about $120^{\circ}C$ instead of the conventional RF sputtering because the off-axis sputtering can avoid the damage for the plasma as well as fabrication of thin films with a high quality. The ITO thin films grown on PET substrate at $120^{\circ}C$ were crystallized with a (222) preferred orientation. 58-nm thick ITO films showed a resistivity of about $2{\times}10-4{\Omega}{\cdot}cm$ and a transmittance of about 75% at a wavelength of 550 nm. The transmittance of the ITO thin films by an insertion of SiO2 thin films on ITO films was improved.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제25권3호
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• pp.204-208
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• 2012

$TiO_2$ ($Ti_{1-x}Nb_xO_2$, x= 0.04~0.06) transparent conducting oxide film was fabricated by RF magnetron sputtering process and their electrical, optical, stability properties were studied. When the Nb 4 at% sputtering target was used with RF power 120 W, pressure 8 mTorr, post-annealing temperature $600^{\circ}C$, the resistivity of TNO film was $4{\times}10^{-4}\;{\Omega}-cm$. The optical transmittance in the visible wavelength was ca. 86%. TNO films require heat treatment during or after the deposition process. When the film was deposited at room temperature and post-annealed at $600^{\circ}C$, the lowest resistivity was obtained. When the TNO film was exposed to high temperature and humidity, the resistivity of the film was rather decreased. The stability to temperature and humidity implies that the TNO film could be a appropriate candidate for In-free, ZnO-free transparent conducting oxide materials.