• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.1
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• pp.198-204
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• 2001

The shot peening is largely used for a surface treatment of metallic components where small spherical pellets called shots are blasted onto the surface with velocities up to 100 m/s. This treatment leads to improvement of fatigue behavior due to the developed compressive residual stresses, and so it has gained widespread acceptance I the automobile and aerospace industries. The residual stress profile on surface layer depends on the parameters of shot peening, which are, shot velocity, shot diameter, coverage, impact angle, material properties etc. and the method to confirm this profile is the measurement by X-ray diffractometer only. Despite the importance to automobile ad aerospace industries, little attention has been devoted to the accurate modelling of the process. In this paper, the simulation technique is applied to predict the magnitude ad distribution of the residual stress and plastic deformation caused by shot peening with the help of the finite element analysis.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.218-223
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• 2000

The shot peening is largely used for a surface treatment in which small spherical parts called shots are blasted on a surface of a metallic components with velocities up to 100m/s. This treatment leads to an improvement of fatigue behavior due to the developed compressive residual stresses, and so it has gained widespread acceptance in the automobile and aerospace industries. The residual stress profile on surface layer depends on the parameters of shot peening, which are, shot velocity, shot diameter, coverage, impact angle, material properties etc. and the method to confirm this profile is only measurement by X-ray diffractometer. Despite its importance to automobile and aerospace industries, little attention has been devoted to the accurate modelling of the process. In this paper, the simulation technique is applied to predict the magnitude and distribution of the residual stress and plastic deformation caused by shot peening with the help of the finite element analysis.

• Journal of the Korean Society for Heat Treatment
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• v.10 no.1
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• pp.40-46
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• 1997

Although functionally gradient materials(FGM) has been developed so as to decrese the thermal stress induced by the high temperature difference between metal and ceramic, it is necessary to analyze the residual thermal stress for the fabrication of FGM. In order to reduce the residual thermal stress, compositional profile of SUS/PSZ(FGM) was suggested using finite element method(FEM). The stress analysis was made on the shape of cylinder with axial symmetry using two dimensional triangular element. For the case of various cylinder with different compositional gradient, calculated stress components were in reasonably good agreement with the expected ones. And the qualitative profile was suggested.

• Journal of Welding and Joining
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• v.35 no.1
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• pp.55-60
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• 2017

There are many Industry Code and Standard (ICS) for Structural Integrity Assessment (SIA) on welded structure with defect. The general ICSs, such as R6, BS 7910 and API 579-1/ASME FFS-1, provide equations to determine the upper bound residual stress profiles based on collections from many literatures. However, these residual stress profiles used in the SIA cause the conservative design for welded structures. In this study, the structural integrity assessment for girth weld in pipeline has been conducted based on fracture mechanics. In addition, thermo-elastic plastic FE analysis was performed for evaluating the residual stress of girth weld in pipeline. The weight function solution is used to determine the stress intensity factor using the residual stress profile obtained by the FE analysis. This approach can account for redistribution and relaxation of residual stress as the defects grow. In order to the evaluate quantitative comparison between BS 7910 and weight function solution, structural integrity assessment determining allowable crack size on cracked pipe was performed with failure assessment diagram.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.11
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• pp.58-68
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• 1997

The residual stresses in injection-molded plastic parts can be divided into two, i.e., the flow-induced residual stress produced in flowing stage and the thermally-induced residual stress produced in cooling stage. Especially, the main source for the defect in the final parts, such as warpage, is known to be the thermally-induced stresses. For the freely quenched samples the structures of residual stresses and bire-fringence have been investigated by many researchers extensively. However, the boundary condition for free quenching was found to be improper to study actual injection molding process. In the present study a datailed structure of the residual stresses and birefringence produced under constrained quenching has been investigated experimentally. In constrained quenched samples a similar pattern but much less stress values than that for the freely quenched samples has been found in the case of the thickness of 1.0 mm. Howvere, in the case of the thickness of 4.0mm, totally different stress profile has been found experimentally. Suprisingly uniform birefringence throughout whole thickness has been found for all the cases of constrained quenching. Finally, to explain the mechanism to produce the final residual stresses and bire-fringence some preliminary numerical results including free volume theory have been introduced briefly.

• Proceedings of the KIEE Conference
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• 1994.07a
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• pp.72-75
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• 1994

In this paper, a novel method to figure out the relative residual stress distribution along the depth of silicon diaphragms is presented Cantilevers with various thickness are fabricated by the time controlled etching method using EPW as an etchant. The boron concentration along the depth of the cantilevers is obtained by the TSUPREM IV simulation, and the etching time to get the proper thickness is calculated. By measuring deflections of the p+ silicon cantilevers the stress profile along the depth of diaphragm is calculated. The obtained stress profile is reasonable and useful to expect the deflection of cantilevers and the buckling of diaphragms.

• Transactions of Materials Processing
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• v.25 no.1
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• pp.61-66
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• 2016

In the current study, we present a new model for the prediction of the strip profile and the residual stresses. This new approach is an analytical model that predicts the residual stresses from the effect of post-deformation. Since the residual stress cannot exceed the yield strength of the material, post-yielding may possibly occur in the post-deformation zone prior to the strip reaching the steady-state zone. The prediction accuracy of the proposed model is examined through comparison with the predictions from 3-D finite element (FE) simulations.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.5
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• pp.149-157
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• 2004

Residual stresses can have a significant influence on the fatigue lives of structural engineering components. For the accurate assessment of fatigue lifetimes a detailed knowledge of the residual stress profile is required. Significant advances have been made in recent years fur obtaining accurate and reliable determinations of residual stress distributions. These include both experimental and numerical methods. The purpose of this study is to simulate peening process with the help of the finite element method in order to predict the magnitude and distribution of the residual stresses in accordance with the parameters, which are, e.g. shot velocity, shot diameter, shot impact angle, shot shape, distance between two impinging shots, and material parameters.

• Journal of Information Display
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• v.4 no.3
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• pp.12-16
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• 2003

In connection with the ion exchange strengthening on soda-lime-silicate, substrate glass for display use was investigated. In the processing, the temperature was varied during the ion exchange in order to make stress profile and to determine optimum condition. In the present work, we found that the maximum value of strength was 617.8 MPa after an ion exchange process at 470 $^{\circ}C$ for 1h, and then, at 450 $^{\circ}C$ for 24h. Also, the effect of residual stress placed on the near surface was measured by analyzing the number of crack branches and brittleness. This approach allowed us the residual stress profile to be engineered to improve mechanical reliability.

• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.413-415
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• 1994

In this paper, a new technique for quantitative estimation of the stress profile along the depth of $p^+$ silicon films is presented. The $p^+$ silicon cantilevers with various beam thickness and a rotating beam supported by two cantilevers are used for estimating the stress profile of the films. The average of the residual stress distribution is estimated to be 50MPa. Most of $p^+$ silicon films are subjected to the tensile stress, except the region near the frontside.