• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1993년도 한국자동제어학술회의논문집(국내학술편); Seoul National University, Seoul; 20-22 Oct. 1993
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• pp.754-759
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• 1993

An adaptive model predictive control (AMPC) strategy using auto-regression moving-average (ARMA) models is presented. The characteristic features of this methodology are the small computer memory requirement, high computational speed, robustness, and easy handling of nonlinear and time varying MIMO systems. Since the process dynamic behaviors are expressed by ARMA models, the model parameter adaptation is simple and fast to converge. The recursive least square (RLS) method with exponential forgetting is used to trace the process model parameters assuming the process is slowly time varying. The control performance of the AMPC is verified by both comparative simulation and experimental studies on distillation column control.

• 시스템엔지니어링학술지
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• 제8권2호
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• pp.1-10
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• 2012

This paper aims to analyze the result of SE Process Implementation on Light Rail Transit(LRT) Project. Currently the Light Rail Transit Project of Korea applies SE to the intermediate phase, that is, E&M phase which is a manufacturing and designing procedure. More seriously, the application effect of SE is not remarkable because it applies to some specific engineering fields like RAMS and it depends on superficial consulting of foreign companies with low SE support capability and investment capital. This study points out that the "Requirement Analysis" and "System Alternative Review" has not been conducted from the initial phase (basic plan and basic design) of the LRT projects. Several projects indicate that the amount of investments for SE activities through the Korea LRT project is relatively very small in comparison with the global capital which is about 10% of total project budget. Furthermore, Korea LRT projects have very few SE professionals and weak SE organization with no government directions and guide book for the efficient implementation of SE for the LRT projects.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• International Journal of Quality Innovation
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• 제3권2호
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• pp.74-83
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• 2002

Process capability indices as an important kind of indices are intended to provide single-number assessments of the inherent process capability to meet specification limits on quality characteristic(5) of interest. In this paper the condition for the application of process capability indices is analyzed. On the basis of process capability indices, dynamic process capability indices as a new kind of indices to show the current process capability are discussed and the condition for the application of dynamic process capability indices is exhibited. Comparison between process capability index and dynamic process capability index and comparison between $D_p$ and $D_pk$ are made and the conclusions provide the approach for process control. According to the requirement of process capability indices provided by customer, quality control based on process capability indices dynamic process capability indices is discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.141-143
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• 2002

Litrex Ink Jet equipment offers prospect for reliable and low cost manufacturing process for PLED technology. The design concept of 140P system that we are developing meets requirement of process/equipment for PLED manufacturing line in terms of higher mechanical accuracy, in-line monitoring system of print head, high precision of process capability, reasonable through-put, high reliability/easier maintenance and no particle generation.

• 산업경영시스템학회지
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• 제38권4호
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• pp.22-29
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• 2015

Many enterprises have been adopting management systems good enough for them and operating the schemes to have competitive edge better than their competitor. One of the finest systems that most companies have been selecting is ISO 14001. ISO 14001, environment management system, is widely known as advancing internal efficiency and productivity in the various industries. As a result, the number of companies that have adopted ISO 14001's certification have been increasing continuously year by year since ISO 14000 standard was called in 1994s from ISO 18000 standard that originally used. The purpose of this study is to present that ISO 14001's requirement execution influences on management performance in the small manufacturer. In order to carry out this research, we obtained 96 survey sheets and inspected ten assumptions based on the reliability, validity of the questionnaires. The results of regression analysis are summarized as follows; First, the three factors of ISO 14001 requirement, plan, implementation and operation and management consideration, have an important effect on the operational performance. Second, the three elements of ISO 14001 requirement, environment policy, implementation and operation and management consideration, affect to the financial performance significantly. Based on the results, it is sure that the companies that execute the factors of implementation and operation and management policy have a good performance to achieve operational and financial performance so that it is important to clarify the member's role, authority and follow the procedure by a company's process. Also, the truth shows CEO's continuous will and periodical review of ISO 14001 influence on management performance as well.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 춘계학술대회 논문집 전기기기 및 에너지변환시스템부문
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• pp.381-383
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• 2001

A system engineering play a key role in new signalling system development. The signalling system development process consists several phases which are requirement analysis, functional analysis, system synthesis and system analysis. Each phase of the development are decomposed according to system engineering process. The key topics to be considered are shown in the each phase such as safety. This paper shows the application of system engineering process to a signalling system development.

• 정보처리학회논문지D
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• 제9D권4호
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• pp.651-658
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• 2002

본 논문에서는 명세를 기반으로 한 통합 테스트를 수행할 때 사용되는 시나리오 작성지원 절차를 제시하고, 시나리오 작성지원 도구를 구현하였다. 이를 위해 기본적으로 요구사항 정의테이블, 프로세스 정의테이블, 프로그램 대 테이블 상관도를 사용한다. 추가로 앞의 3가지 테이블 기능을 요구분석, 설계, 테스트 단계별로 나누어 한곳에서 신속·정확하게 체크할 수 있는 요구사항 추적테이블을 생성한다. 본 연구의 통합 테스트를 위한 시나리오 작성지원 도구의 출력물은 시나리오 작성을 위한 지침서 역할을 한다. 그 결과 검사팀의 시나리오 작성노력을 상당부분 줄일 수 있을 뿐만 아니라 요구사항의 누락을 방지하고, 해당 프로세스에 대한 테이블 정보를 알 수 있으므로 테스트할 때 잘못된 값을 입력하는 것도 방지할 수 있다.

• 한국IT서비스학회지
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• 제9권4호
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• pp.169-185
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• 2010

According to software growth, also software maintenance has been continuously improving. In addition, the existing concept of software maintenance process demands operational management and improvement of service task. However, when we perform maintenance task, we have several constraints about applying service based requirement to system. Therefore, in order to solve these problems, we need a study of task of process for service based maintenance. In this paper, we propose a Service based Software Maintenance Process. Proposed process based on MaRMI-RE standard for software development and maintenance and compares it with the service based representative standards. In a related works, we study activity of ITIL and identify activities and tasks for maintenance. After this, identified activities and tasks compare with activities of MaRMI-RE. And then, we derive activities and tasks of a Service based Software Maintenance Process. Finally, we validate a result by comparing the proposed process with a general service operational process.