• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.104-107
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• 2000

We designed and implemented the RFIC(RF front-end IC) for DTV(Digital TV) tuner. The DTV tuner RF front-end consists of low noise IF amplifier fur the amplification of 900 MHz RF signal and down conversion mixer for the RF signal to 44MHz IF conversion. The RFIC is implemented on ETRI 0.8u high resistive (2㎘ -cm) and evaluated by on wafer, packaged chip test. The gain and IIP3 of IF amplifier are 15㏈ and -6.6㏈m respectively. For the down conversion mixer gain and IIP3 are 13㏈ and -6.5㏈m. Operating voltage of the IF amplifier and the down mixer is 5V, current consumption are 13㎃ and 26㎃ respectively.

• Journal of electromagnetic engineering and science
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• v.4 no.2
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• pp.56-62
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• 2004

We present a multi-Gbit/s digital I/O interface based on RF-modulation and capacitive-coupling over an impedance matched transmission line. The RF-interconnect(RFI) can greatly reduce the digital switching noise and eliminate the dc power dissipation over the channel. It also enables reduced signal amplitude(as low as 200 ㎷) with enhanced data rate and affordable circuit overhead. This paper addresses the system advantages and implementation issues of RFI. A prototype on-chip RFI transceiver is implemented in 0.18-${\mu}{\textrm}{m}$ CMOS. It demonstrates a maximum data rate of 2.2 Gbit/s via 10.5-㎓ RF-modulation. The RFI can be very instrumental for future high-speed inter- and intra-ULSI data links.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.1
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• pp.117-122
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• 2016

In this paper, we propose 24-GHz CMOS radio frequency (RF) power amplifier for short-range automotive collision avoidance radars. This circuit contains common source stage with inter-stages conjugate matching circuit as a class-A mode amplifier. The proposed circuit is designed using TSMC $0.13-{\mu}m$ mixed signal/RF CMOS process ($f_T/f_{MAX}=120/140GHz$). It operates at the supply voltage of 2V, and it is designed to have high power gain, low insertion loss and low noise figure in the low supply voltage. To reduce total chip area, the circuit used transmission lines instead of the bulky real inductor. The designed CMOS power amplifier showed the smallest chip size of $0.1mm^2$, the lowest power consumption of 40mW, the highest power gain of 26.5dB, the highest saturated output power of 19.2dBm and the highest maximum power-added efficiency of 17.2% as compared to recently reported results.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.941-944
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• 2005

In this paper, the analysis of input power matching for CMOS RF Low Noise Amplifier (LNA) design is introduced. With two input power matching techniques, the performance of LNAs is estimated according to gain and noise figure. This process can be expressed easily by theoretical method and using simulation. These analytical methods are useful in that they can provide enough insights for designing CMOS RF LNAs.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.3
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• pp.401-410
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• 2017

In this work, we show that the excessive lattice heating problem due to parasitic pnp transistor action in the diode electrostatic discharge (ESD) protection device in the diode input protection circuit, which is favorably used in CMOS RF ICs, can be solved by adopting a symmetrical cathode structure. To explain how the recipe works, we construct an equivalent circuit for input human-body model (HBM) test environment of a CMOS chip equipped with the diode protection circuit, and execute mixed-mode transient simulations utilizing a 2-dimensional device simulator. We attempt an in-depth comparison study by varying device structures to suggest valuable design guidelines in designing the protection diodes connected to the $V_{DD}$ and $V_{SS}$ buses. Even though this work is based on mixed-mode simulations utilizing device and circuit simulators, the analysis given in this work clearly explain the mechanism involved, which cannot be done by measurements.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.3
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• pp.326-332
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• 2017

A switched VCO-based UWB transmitter for 3-5 GHz is implemented using $0.18{\mu}m$ CMOS technology. Using RF switch and timing control of DPGs, the uniform RF power and low power consumption are possible regardless of carrier frequency. And gate control of RF switch enables the undesired side lobe rejection sufficiently. The measured pulse width is tunable from 0.5 to 2 ns. The measured energy efficiency per pulse is 4.08% and the power consumption is 0.6 mW at 10 Mbps without the buffer amplifier.

• Journal of electromagnetic engineering and science
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• v.8 no.3
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• pp.96-99
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• 2008

This paper describes a $0.13-{\mu}m$ CMOS RF switch for $3{\sim}5$ GHz UWB band(mode 1). It can improve isolation characteristics between ports by using deep n-well RF devices while their source and body terminals are separated. From the measurement results, the proposed T/R switch is comparative to the on-wafer probing measurement results of the series-shunt T/R switches. When the proposed T/R switch operates as Tx mode, measured insertion loss from Tx to output port is less than 1.5 dB and isolation between Tx and Rx is more than 27 dB for $3{\sim}5$ GHz. Return loss for the Tx port is more than -10 dB and input P1dB is +10 dBm.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.4
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• pp.277-282
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• 2008

A fully integrated inductorless CMOS impulse radio ultra-wideband (IR-UWB) receiver is implemented using $0.18\;{\mu}m$ CMOS technology for 3-5 GHz application. The UWB receiver adopts the non-coherent architecture, which removes the complexity of RF architecture and reduces power consumption. The receiver consists of inductorless differential three stage LNA, envelope detector, variable gain amplifier (VGA), and comparator. The measured sensitivity is -70 dBm in the condition of 5 Mbps and BER of $10^{-3}$. The receiver chip size is only $1.8\;mm\;{\times}\;0.9\;mm$. The consumed current is 15 mA with 1.8 V supply.

• Journal of electromagnetic engineering and science
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• v.8 no.1
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• pp.34-39
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• 2008

An RF front-end dual-conversion receiver for $3{\sim}5\;GHz$ MB-OFDM UWB systems is implemented in $0.18\;{\mu}m$ CMOS technology. The receiver includes a two-stage UWB LNA, an RF mixer, an IF I/Q mixer, and a frequency synthesizer. The proposed receiver adopts the dual-conversion architecture to mitigate the burden of design of the frequency synthesizer. Accordingly, the proposed frequency synthesizer generates four LO tones from only one VCO. The receiver front-end achieves power gain of 16.3 to 21 dB, NF of 7 to 7.6 dB over $3{\sim}5\;GHz$, and IIP3 of -21 dBm, while consuming 190 mW from a 1.8 V supply.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.1
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• pp.114-121
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• 2003

In this paper, low voltage and two stage CMOS Class E RF power amplifier for ISM(Industrial/Scientific/Medical) Open Band is presented. The power amplifier operates at 2.4GHz frequency, and is designed and simulated with a 0.35um CMOS technology and HSPICE simulator. The power amplifier is simple structure of two stage Class E power amplifier. The design procedure determing matching network was presented. The power amplifier is composed of input stage matching network, preamplifier, interstage matching network, power amplifier, and output stage matching network. The matching networks of input stage and interstage were constituted by pi($\pi$) type and L type respectively. At 2.4GHz operating frequency, and with a 2.5V supply voltage, the power amplifier delivers 23dBm output power to a 50${\Omega}$ load with 39% power added efficiency(PAE).