• Advances in nano research
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• v.5 no.3
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• pp.203-214
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• 2017

In this study we present the reaction mechanism of $Cu_2ZnSnSe_4$ (CZTSe) nanoparticles synthesized by microwave-assisted chemical synthesis. We performed reactions every 10 minutes in order to identify different phases during quaternary CZTSe formation. The powder samples were analyzed by x-ray diffraction (XRD), Raman spectroscopy, energy dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM). The results showed that in the first minutes copper phases are predominant, then copper and tin secondary phases react to form ternary phase. The quaternary phase is formed at 50 minutes while ternary and secondary phases are consumed. At 60 minutes pure quaternary CZTSe phase is present. After 60 minutes the quaternary phase decomposes in the previous ternary and secondary phases, which indicates that 60 minutes is ideal reaction time. The EDS analysis of pure quaternary nanocrystals (CZTSe) showed stoichiometric relations similar to the reported research in the literature, which falls in the range of Cu/(Zn+Sn): 0.8-1.0, Zn/Sn: 1.0-1.20. In conclusion, the evolution pathway of CZTSe synthesized by this novel method is similar to other synthesis methods reported before. Nanoparticles synthesized in this study present desirable properties in order to use them in solar cell and photoelectrochemical cell applications.

• Corrosion Science and Technology
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• v.8 no.6
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• pp.238-242
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• 2009

Corrosion of metallic materials occurs by the reaction with corrosive environment. In general, corrosive environments are classified as atmospheric, marine, soil etc. and regardless of any corrosive environments, reduction of thickness and cracking and degradation are induced by corrosion. Among several corrosive environments, knowing the atmospheric corrosiveness of a region, city, or country is considered of ultimate importance for major industrialists and investors who require knowledge of the corrosive impact of the atmosphere on everyday materials such as carbon steel, weathering steel, zinc, copper, and aluminium. This is why the atmospheric corrosiveness map is needed. This paper dealt with corrosion properties between several waters in the region and carbon steel, weathering steel, galvanized steel, pure copper, and pure aluminium at the representative rural area of Korea - Andong.

• Korean Journal of Environmental Agriculture
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• v.16 no.1
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• pp.48-54
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• 1997

This study was performed to develop the biological treatment technology of wastewater polluted with heavy metals. The copper-tolerant bacteria, Pseudomonas stutzeri which possessed the ability to accumulate copper, was isolated from mine wastewaters polluted with various heavy metals. The characteristics of copper accumulation in the cells and the recovery of the copper from the cells accumulating zinc, were investigated. Removal rate of copper from the solution containing 100mg/l of copper by copper-tolerant bacteria was more than 78% at 2 days after inoculation with the cells. A large number of the electron-dense granules were found mainly on the cell wall and cell membrane fractions, when determined by transmission electron microscopy. Energy dispersive X-ray spectroscopy revealed that the electron-dense granules were copper complex with the substances binding copper. The copper accumulated into the cells was not desorbed by deistilled water, but more than 80% of the copper accumulated was desorbed by 0.1M-EDTA solution. The residues of the cells after combustion at $550^{\circ}C$ amounted to about 23.2% of the dry weight of the cells. EDS analysis showed that residues were relatively pure copper compound containing more than 78.4% of copper.

• Journal of the Korean Magnetics Society
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• v.15 no.3
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• pp.198-201
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• 2005

We investigated the effects of organic additives on the properties of nickel-copper thin films prepared by electroplating. Compared with thin films fabricated by pure electrolyte only, the films utilizing organic additives show different crystalline orientations. With no alteration of plating conditions simply adding the organic materials changed the composition of copper and nickel. The concentration of nickel could be varied to $65-95\%$ depending on the species and concentration of the additives. The change of material property has contributed to the increase or decrease of the magnetoresistance.

• Bulletin of the Korean Chemical Society
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• v.30 no.4
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• pp.853-856
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• 2009

Highly polycrystalline copper indium diselenide (CuInSe2, CIS) thin films were deposited on glass or ITO glass substrates by two-stage metal organic chemical vapor deposition (MOCVD) at relatively mild conditions, using Cuand In/Se-containing precursors. First, pure Cu thin film was prepared on glass or ITO glass substrates by using a single-source precursor, bis(ethylbutyrylacetate)copper(II) or bis(ethylisobutyrylacetato)copper(II). Second, on the resulting Cu films, tris(N,N-ethylbutyldiselenocarbamato)indium(III) was treated to produce CuInSe2 films by MOCVD method at 400 ${^{\circ}C}$. These precursors are very stable in ambient conditions. In our process, it was quite easy to obtain high quality CIS thin films with less impurities and uniform thickness. Also, it was found that it is easy to control the stoichiometric ratio of relevant elements on demands, leading to Cu or In rich CIS thin films. These CIS films were analyzed by XRD, SEM, EDX, and Near-IR spectroscopy. The optical band gap of the stoichiometric CIS films was about 1.06 eV, which is within an optimal range for harvesting solar radiation energy.

• Journal of the Korean Society for Heat Treatment
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• v.10 no.1
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• pp.20-29
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• 1997

Pure copper is widely used for base material for electrical and electronic parts because of its good electrical conductivity. However, it has such a low strength that various alloying elements are added to copper to increase its strength. Nevertheless, alloying elements which exist as solid solution elements in copper matrix severely reduce the electrical conductivity. The reduction of electrical conductivity can be minimized and the strengthening can be maximized by TMT(Thermo-Mechanical Treatment) in copper alloys. In this research, the effects of TMT on mechanical and electrical properties of Cu-Ni-Al-Si-P, Cu-Ni-Al-Si-P-Zr and Cu-Ni-Si-P-Ti alloys aged at various temperatures were investigated. The Cu alloy with Ti showed the hardness of Hv 225, electrical conductivity of 59.8%IACS, tensile strength of 572MPa and elongation of 6.4%.

• Journal of the Korean Electrochemical Society
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• v.13 no.4
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• pp.270-276
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• 2010

Nickel-copper foam electrodes with pore gradient micro framework and nano-ramified wall have been prepared by using an electrochemical deposition process. Growth habit of nickel-copper co-deposits was quite different from that of pure nickel deposit. In particular, the ramified structure of the individual particles was getting clear with chloride ion content in the electrolyte. The ratio of nickel to copper in the deposits decreased with the distance away from the substrate and the more chloride ions in the electrolyte led to the more nickel content throughout the deposits. Compositional analysis for the cross section of a ramified branch, together with tactical selective copper etching, proved that the copper content increased with approaching central region of the cross section. Such a composition gradient actually disappeared after heat treatment. It is anticipated that the pore gradient nickel-copper nanostructured foams presented in this work might be a promising option for the high-performance electrode in functional electrochemical devices.

• Korean Journal of Materials Research
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• v.11 no.7
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• pp.569-574
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• 2001

The crystal structure, surface morphology and preferred orientation of the copper electrodeposit were investigated by the using sulfate bath with $SiO_2$suspensions and the cathode substrate Au sputtered. As by the addition of colloidal silica in copper electrolytic bath and Au pre-coating on substrate, the crystal particles of deposits was fined-down, made uniform and the account of particles were increased. Hardness of copper electrodeposits with colloidal silica increased about 15% in comparison with that of pure copper deposit film and (111), (200) and (311) plane of X-ray diffraction patterns were almost swept away, so preferred orientation of the copper deposits changed from (111) to (110) plane by codeposit $SiO_2$ and precoating the substrate.

• Korean Journal of Optics and Photonics
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• v.17 no.1
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• pp.104-109
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• 2006

Cu-doped $TiO_2$ thin films were prepared by RF magnetron co-sputtering, and their structural, optical and photodegradation. properties were examined as a function of calcination temperature. XRD results showed that the crystallite size of Cu/$TiO_2$ thin films was bigger than that of the pure $TiO_2$ thin films. SEM results revealed that the agglomerated particle size of the Cu/$TiO_2$ films was more uniform and smaller than that of pure $TiO_2$ films. The absorption edge of thin films calcined at $900^{\circ}C$ was red shifted, resulting from the phase transformation from anatase to rutile phase, and the transmittance of the thin film rapidly decreased due to an increase in particle size. The photodegradation properties of the Cu/$TiO_2$ thin films were superior to those of the pure $TiO_2$ thin films.

• Korean Journal of Metals and Materials
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• v.46 no.9
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• pp.545-553
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• 2008

Dynamic deformation behavior of ultra-fine-grained pure coppers fabricated by equal channel angular pressing (ECAP) was investigated in this study. Dynamic torsional tests were conducted on four copper specimens using a torsional Kolsky bar, and then the test data were analyzed by their microstructures and tensile properties. The 1-pass ECAP'ed specimen consisted of fine dislocation cell structures elongated along the ECAP direction, which were changed to very fine, equiaxed subgrains of 300~400 nm in size as the pass number increased. The dynamic torsional test results indicated that maximum shear stress increased with increasing ECAP pass number. Adiabatic shear bands were not found at the gage center of the dynamically deformed torsional specimen of the 1- or 4-pass ECAP'ed specimen, while some weak bands were observed in the 8-pass ECAP'ed specimen. These findings suggested that the grain refinement according to the ECAP was very effective in strengthening of pure coppers, and that ECAP'ed coppers could be used without serious reduction in fracture resistance under dynamic torsional loading as adiabatic shear bands were hardly formed.