• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.320-330
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• 2012

In this paper, we investigate the power integrity of grid structures for power and ground distribution on printed circuit board (PCB). We propose the 2D transmission line method (TLM)-based model for efficient frequency-dependent impedance characterization and PCB-package-integrated circuit (IC) co-simulation. The model includes an equivalent circuit model of fringing capacitance and probing ports. The accuracy of the proposed grid model is verified with test structure measurements and 3D electromagnetic (EM) simulations. If the grid structures replace the plane structures in PCBs, they should provide effective shielding of the electromagnetic interference in mobile systems. An analytical model to predict the shielding effectiveness (SE) of the grid structures is proposed and verified with EM simulations.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.8
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• pp.486-489
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• 2015

Power semiconductor device has a very long history among semiconductor, since the invention of low-pressure bipolar transistor 1947, and so far from small capacity to withstand voltage-current, high-speed and high-frequency characteristics have been developed with high function. In this study, the PWM IC Switch to the main parts used in IGBT (insulated gate bipolar transistor) for the low power loss and high drive capability of the simulator to Synopsys' T-CAD used by the 1,700 V NPT Planar IGBT, 1,700 V FS was a study of the Planar IGBT, the results confirmed that IGBT 1,700 V FS Planar is making about 11 percent less than the first designed NPT Planar IGBT.

• Proceedings of the KIPE Conference
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• 2018.07a
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• pp.522-524
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• 2018

A New Direct AC LED Driver has been proposed for wide output power range and precise constant current regulation using an advanced auto commutation topology. The conventional shunt regulation method provides a stepped input current shape by fixed regulation references in the linear regulator of the each channel, which results in poor current regulation and high THD. The conventional method needs to assign a linear regulator in each LED channel so that the number of linear regulator increases when extending the number of channels especially at high power application. The proposed regulation method can drive multiple switches to regulate each LED channel current by a single amplifier with sinusoidal reference so that large number of LED channel can be simply extended with less BOM cost and low THD is obtained with the accurate current regulation thanks to the sinusoidal input current control in the closed loop control. To confirm the validity of the proposed circuit, theoretical analysis and experimental results from a 20-W LED driver prototype are presented.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.4
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• pp.213-217
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• 2015

Device model parameters are very important for accurate estimation of electrical performances in devices, integrated circuits and their systems. There are a large number of methods for extraction of model parameters in power MOSFETs. For high efficiency, design is important considerations of a power MOSFET with high-voltage applications in consumer electronics. Meanwhile, it was proposed that the efficiency of a MOSFET can be enhanced by conducting JFET region double implant to reduce the On-resistance of the transistor. This paper reports the effects of JFET region double implant on the electrical properties and the decreasing On-resistance of the MOSFET. Experimental results show that the 1st JFET region implant diffuse can enhance the On-resistance by decreasing the ion concentration due to the surface and reduce the On-resistance by implanting the 2nd Phosphorus to the surface JFET region.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.17-25
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• 2017

Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

• Journal of Radiation Industry
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• v.2 no.3
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• pp.141-148
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• 2008

Beta rays emitted from tritium in titanium tritide film were simulated with cathode rays of a scanning electron microscope to investigate the effect of beta rays from tritium on semiconductor devices. The cathode ray currents, which vary with the change of applied energy and beam spot size, were measured with Faraday cup. The current from the semiconductor device irradiated with cathode rays at various conditions was measured. The cathode ray current increased with the increase of spot size to a maximum then decreased when the spot sized increased further. The magnitude of current produced in the semiconductor device is proportional to the magnitude of cathode ray current. The magnitude of cathode ray current at each energy level was matched to the intensity of beta ray to simulate the tritium beta ray spectrum. Then the semiconductor characteristics were analyzed with I-V curves.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.113-117
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• 2003

This paper describes the design and the simulation results of the RF CMOS Class-E Power Amplifier for a 2.4GHz ISM band. This circuit is composed two connected amplifiers. where Class F amplifier drives Class E amplifier. The proposed circuit can reduce the total power dissipation of the driving stage and can work with higher efficiency. The power amplifier has been implemented in a standard $0.25{\mu}m$ CMOS technology and is shown to deliver 100mW output power to load with 41% power added efficiency(PAE) from a 2.5V supply.

• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.589-592
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• 2002

The CCM (Continuous Conduction Mode) boost topology is generally used in the PFC (Power Factor Correction) regulator of household air-conditioning systems. There are three kinds of power devices-bridge rectifier diodes, FRDs (Fast Recovery Diodes), and IGBTs (or MOSFETs) - used In a boost PFC regulator. Selecting the appropriate device is very cumbersome work, specially, in the case of FRDs and IGBTs, because there are several considerations as described below: 1) High frequency leakage current regulation (conducted and radiated EMI regulation) 2) Power losses and thermal design 3) Device cost. It should be noted that there are trade-offs between the power loss characteristic of 2) and the other characteristics of 1) and 3). This paper presents a detailed evaluation by using several types of power devices, which can be unintentionally used, to show that optimal selection can be achieved. Based on the given thermal resistances, thermal analysis and design procedures are also described from a practical viewpoint.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2143-2145
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• 2005

Power semicondcutor인 IGBT MOSFET, GTO, SI-Thyristor등은 높은 스위치 신뢰성과 life time, 그리고 fast repetition rate 등을 지니고 있기 때문에 medium/High voltage영역에서 스위치 사용이 대두되어 왔으나, Thyratron이나 Trigatron(Gap switch)와 비교하여 낮은 전압/전류를 스위칭하기 때문에 전통적으로 직렬연결을 통해 high voltage 영역의 스위치로 사용되어 왔다. 하지만, 직렬연결되어 있는 각각의 power semiconductor와 gate driving circuit의 on/off synchronization이 맞지 않기 때문에 부하의 급격한 변화에 따른 전압의 balance에 문제가 가장 심각하게 대두되어 왔다. 이러한 문제를 해결하기 위해서 gate driving circuit에서 제어를 해주는 방법과 power semiconductor에서 제어를 해주는 방법이 있으나 두 방식 모두 문제점이 있다. 본 논문에서는 기존의 zener clamping방식에서 벗어나 새로운 active clamping방식의 직렬연결을 제안했으며 시뮬레이션과 실험을 통해 나타난 이 결과들은 on/off transient 시 symmetry를 유지하는데 효과적이라는 것을 보여주고 있다.

• Journal of Power Electronics
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• v.11 no.3
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• pp.381-388
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• 2011

This article presents the development of a model for SiC power diodes based on the physics of the semiconductor. The model is able to simulate the behavior of the dynamics of the charges in the N- region based on the stored charge inside the SiC power diode, depending on the working regime of the device (turn-on, on-state, and turn-off). The optimal individual calculation of the ambipolar diffusion length for every phase of commutation allows for solving the ambipolar diffusion equation (ADE) using a very simple approach. By means of this methodology development a set of differential equations that models the main physical phenomena associated with the semiconductor power device are obtained. The model is developed in Pspice with acceptable simulation times and without convergence problems during its implementation.