• Title/Summary/Keyword: Power Circuit Design

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Design of a Small Area 12-bit 300MSPS CMOS D/A Converter for Display Systems (디스플레이 시스템을 위한 소면적 12-bit 300MSPS CMOS D/A 변환기의 설계)

  • Shin, Seung-Chul;Moon, Jun-Ho;Song, Min-Kyu
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.4
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    • pp.1-9
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    • 2009
  • In this paper, a small area 12-bit 300MSPS CMOS Digital-to-Analog Converter(DAC) is proposed for display systems. The architecture of the DAC is based on a current steering 6+6 segmented type, which reduces non-linearity error and other secondary effects. In order to improve the linearity and glitch noise, an analog current cell using monitoring bias circuit is designed. For the purpose of reducing chip area and power dissipation, furthermore, a noble self-clocked switching logic is proposed. To verify the performance, it is fabricated with $0.13{\mu}m$ thick-gate 1-poly 6-metal N-well Samsung CMOS technology. The effective chip area is $0.26mm^2$ ($510{\mu}m{\times}510{\mu}m$) with 100mW power consumption. The measured INL (Integrated Non Linearity) and DNL (Differential Non Linearity) are within ${\pm}3LSB$ and ${\pm}1LSB$, respectively. The measured SFDR is about 70dB, when the input frequency is 15MHz at 300MHz clock frequency.

Three Dimensional Implementation of Intelligent Transportation System Radio Frequency Module Packages with Pad Area Array (PAA(Pad Area Array)을 이용한 ITS RF 모듈의 3차원적 패키지 구현)

  • Jee, Yong;Park, Sung-Joo;Kim, Dong-Yong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.1
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    • pp.13-22
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    • 2001
  • This paper presents three dimensional structure of RF packages and the improvement effect of its electrical characteristics when implementing RF transceivers. We divided RF modules into several subunits following each subunit function based on the partitioning algorithm which suggests a method of three dimension stacking interconnection, PAA(pad area array) interconnection and stacking of three dimensional RF package structures. 224MHz ITS(Intelligent Transportation System) RF module subdivided into subunits of functional blocks of a receiver(RX), a transmitter(TX), a phase locked loop(PLL) and power(PWR) unit, simultaneously meeting the requirements of impedance characteristic and system stability. Each sub­functional unit has its own frequency region of 224MHz, 21.4MHz, and 450KHz~DC. The signal gain of receiver and transmitter unit showed 18.9㏈, 23.9㏈. PLL and PWR modules also provided stable phase locking, constant voltages which agree with design specifications and maximize their characteristics. The RF module of three dimension stacking structure showed $48cm^3$, 76.9% reduction in volume and 4.8cm, 28.4% in net length, 41.8$^{\circ}C$, 37% in maximum operating temperature, respectively. We have found that three dimensional PAA package structure is able to produce high speed, high density, low power characteristics and to improve its functional characteristics by subdividing RF modules according to the subunit function and the operating frequency, and the features of physical volume, electrical characteristics, and thermal conditions compared to two dimensional RF circuit modules.

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Design of a CMOS Tx RF/IF Single Chip for PCS Band Applications (PCS 대역 송신용 CMOS RF/IF 단일 칩 설계)

  • Moon, Yo-Sup;Kwon, Duck-Ki;Kim, Keo-Sung;Park, Jong-Tae;Yu, Chong-Gun
    • Journal of IKEEE
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    • v.7 no.2 s.13
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    • pp.236-244
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    • 2003
  • In this paper, RF and IF circuits for mobile terminals which have usually been implemented using expensive BiCMOS processes are designed using CMOS circuits, and a Tx CMOS RF/IF single chip for PCS applications is designed. The designed circuit consists of an IF block including an IF PLL frequency synthesizer, an IF mixer, and a VGA and an RF block including a SSB RF mixer and a driver amplifier, and performs all transmit signal processing functions required between digital baseband and the power amplifier. The phase noise level of the designed IF PLL frequency synthesizer is -114dBc/Hz@100kHz and the lock time is less than $300{\mu}s$. It consumes 5.3mA from a 3V power supply. The conversion gain and OIP3 of the IF mixer block are 3.6dB and -11.3dBm. It consumes 5.3mA. The 3dB frequencies of the VGA are greater than 250MHz for all gain settings. The designed VGA consumes 10mA. The designed RF block exhibits a gain of 14.93dB and an OIP3 of 6.97dBm. The image and carrier suppressions are 35dBc and 31dBc, respectively. It consumes 63.4mA. The designed circuits are under fabrication using a $0.35{\mu}m$ CMOS process. The designed entire chip consumes 84mA from a 3V supply, and its area is $1.6㎜{\times}3.5㎜$.

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Analysis of the Effect of the Etching Process and Ion Injection Process in the Unit Process for the Development of High Voltage Power Semiconductor Devices (고전압 전력반도체 소자 개발을 위한 단위공정에서 식각공정과 이온주입공정의 영향 분석)

  • Gyu Cheol Choi;KyungBeom Kim;Bonghwan Kim;Jong Min Kim;SangMok Chang
    • Clean Technology
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    • v.29 no.4
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    • pp.255-261
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    • 2023
  • Power semiconductors are semiconductors used for power conversion, transformation, distribution, and control. Recently, the global demand for high-voltage power semiconductors is increasing across various industrial fields, and optimization research on high-voltage IGBT components is urgently needed in these industries. For high-voltage IGBT development, setting the resistance value of the wafer and optimizing key unit processes are major variables in the electrical characteristics of the finished chip. Furthermore, the securing process and optimization of the technology to support high breakdown voltage is also important. Etching is a process of transferring the pattern of the mask circuit in the photolithography process to the wafer and removing unnecessary parts at the bottom of the photoresist film. Ion implantation is a process of injecting impurities along with thermal diffusion technology into the wafer substrate during the semiconductor manufacturing process. This process helps achieve a certain conductivity. In this study, dry etching and wet etching were controlled during field ring etching, which is an important process for forming a ring structure that supports the 3.3 kV breakdown voltage of IGBT, in order to analyze four conditions and form a stable body junction depth to secure the breakdown voltage. The field ring ion implantation process was optimized based on the TEG design by dividing it into four conditions. The wet etching 1-step method was advantageous in terms of process and work efficiency, and the ring pattern ion implantation conditions showed a doping concentration of 9.0E13 and an energy of 120 keV. The p-ion implantation conditions were optimized at a doping concentration of 6.5E13 and an energy of 80 keV, and the p+ ion implantation conditions were optimized at a doping concentration of 3.0E15 and an energy of 160 keV.

Design of pHEMT channel structure for single-pole-double-throw MMIC switches (SPDT 단일고주파집적회로 스위치용 pHEMT 채널구조 설계)

  • Mun Jae Kyoung;Lim Jong Won;Jang Woo Jin;Ji, Hong Gu;Ahn Ho Kyun;Kim Hae Cheon;Park Chong Ook
    • Journal of the Korean Vacuum Society
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    • v.14 no.4
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    • pp.207-214
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    • 2005
  • This paper presents a channel structure for promising high performance pseudomorphic high electron mobility transistor(pHEMT) switching device for design and fabricating of microwave control circuits, such as switches, phase shifters, attenuators, limiters, for application in personal mobile communication systems. Using the designed epitaxial channel layer structure and ETRI's $0.5\mu$m pHEMT switch process, single pole double throw (SPDT) Tx/Rx monolithic microwave integrated circuit (MMIC) switch was fabricated for 2.4 GHz and 5 GHz band wireless local area network (WLAN) systems. The SPDT switch exhibits a low insertion loss of 0.849 dB, high isolation of 32.638 dB, return loss of 11.006 dB, power transfer capability of 25dBm, and 3rd order intercept point of 42dBm at frequency of 5.8GHz and control voltage of 0/-3V These performances are enough for an application to 5 GHz band WLAN systems.

Recent Progress in Air-Conditioning and Refrigeration Research : A Review of Papers Published in the Korean Journal of Air-Conditioning and Refrigeration Engineering in 2012 (설비공학 분야의 최근 연구 동향 : 2012년 학회지 논문에 대한 종합적 고찰)

  • Han, Hwataik;Lee, Dae-Young;Kim, Sa Ryang;Kim, Hyun-Jung;Choi, Jong Min;Park, Jun-Seok;Kim, Sumin
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.25 no.6
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    • pp.346-361
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    • 2013
  • This article reviews the papers published in the Korean Journal of Air-Conditioning and Refrigeration Engineering during 2012. It is intended to understand the status of current research in the areas of heating, cooling, ventilation, sanitation, and indoor environments of buildings and plant facilities. The conclusions are as follows : (1) The research works on thermal and fluid engineering have been reviewed as groups of fluid machinery, pipes and valves, fuel cells and power plants, ground-coupled heat pumps, and general heat and mass transfer systems. Research issues are mainly focused on new and renewable energy systems, such as fuel cells, ocean thermal energy conversion power plants, and ground-coupled heat pump systems. (2) Research works on the heat transfer area have been reviewed in the categories of heat transfer characteristics, pool boiling and condensing heat transfer, and industrial heat exchangers. Researches on heat transfer characteristics included the results for natural convection in a square enclosure with two hot circular cylinders, non-uniform grooved tube considering tube expansion, single-tube annular baffle system, broadcasting LED light with ion wind generator, mechanical property and microstructure of SA213 P92 boiler pipe steel, and flat plate using multiple tripping wires. In the area of pool boiling and condensing heat transfer, researches on the design of a micro-channel heat exchanger for a heat pump, numerical simulation of a heat pump evaporator considering the pressure drop in the distributor and capillary tubes, critical heat flux on a thermoexcel-E enhanced surface, and the performance of a fin-and-tube condenser with non-uniform air distribution and different tube types were actively carried out. In the area of industrial heat exchangers, researches on a plate heat exchanger type dehumidifier, fin-tube heat exchanger, an electric circuit transient analogy model in a vertical closed loop ground heat exchanger, heat transfer characteristics of a double skin window for plant factory, a regenerative heat exchanger depending on its porous structure, and various types of plate heat exchangers were performed. (3) In the field of refrigeration, various studies were executed to improve refrigeration system performance, and to evaluate the applicability of alternative refrigerants and new components. Various topics were presented in the area of refrigeration cycle. Research issues mainly focused on the enhancement of the system performance. In the alternative refrigerant area, studies on CO2, R32/R152a mixture, and R1234yf were performed. Studies on the design and performance analysis of various compressors and evaporator were executed. (4) In building mechanical system research fields, twenty-nine studies were conducted to achieve effective design of mechanical systems, and also to maximize the energy efficiency of buildings. The topics of the studies included heating and cooling, HVAC system, ventilation, renewable energy systems, and lighting systems in buildings. New designs and performance tests using numerical methods and experiments provide useful information and key data, which can improve the energy efficiency of buildings. (5) In the fields of the architectural environment, studies for various purposes, such as indoor environment, building energy, and renewable energy were performed. In particular, building energy-related researches and renewable energy systems have been mainly studied, reflecting interests in global climate change, and efforts to reduce building energy consumption by government and architectural specialists. In addition, many researches have been conducted regarding indoor environments.

Design of DVB-T/H SiP using IC-embedded PCB Process (IC-임베디드 PCB 공정을 사용한 DVB-T/H SiP 설계)

  • Lee, Tae-Heon;Lee, Jang-Hoon;Yoon, Young-Min;Choi, Seog-Moon;Kim, Chang-Gyun;Song, In-Chae;Kim, Boo-Gyoun;Wee, Jae-Kyung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.9
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    • pp.14-23
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    • 2010
  • This paper reports the fabrication of a DVB-T/H System in Package (SiP) that is able to receive and process the DVB-T/H signal. The DVB-T/H is the European telecommunication standard for Digital Video Broadcasting (DVB). An IC-embedded Printed Circuit Board (PCB) process, interpose a chip between PCB layers, has applied to the DVB-T/H SiP. The chip inserted in DVB-T/H SiP is the System on Chip (SoC) for mobile TV. It is comprised of a RF block for DVB-T/H RF signal and a digital block to convert received signal to digital signal for an application processor. To operate the DVB-T/H IC, a 3MHz DC-DC converter and LDO are on the DVB-T/H SiP. And a 38.4MHz crystal is used as a clock source. The fabricated DVB-T/H SiP form 4 layers which size is $8mm{\times}8mm$. The DVB-T/H IC is located between 2nd and 3rd layer. According to the result of simulation, the RF signal sensitivity is improved since the layout modification of the ground plane and via. And we confirmed the adjustment of LC value on power transmission is necessary to turn down the noise level in a SiP. Although the size of a DVB-T/H SiP is decreased over 70% than reference module, the power consumption and efficiency is on a par with reference module. The average power consumption is 297mW and the efficiency is 87%. But, the RF signal sensitivity is declined by average 3.8dB. This is caused by the decrease of the RF signal sensitivity which is 2.8dB, because of the noise from the DC-DC converter.

Investigation of Plugging and Wastage of Narrow Sodium Channels by Sodium and Carbon Dioxide Interaction (소듐과 이산화탄소 반응에 의한 소듐유로막힘 및 재료손상 현상 연구)

  • Park, Sun Hee;Min, Jae Hong;Lee, Tae-Ho;Wi, Myung-Hwan
    • Korean Chemical Engineering Research
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    • v.54 no.6
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    • pp.863-870
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    • 2016
  • We investigated the physical/chemical phenomena that a slow loss of $CO_2$ inventory into sodium after the sodium-$CO_2$ boundary failure in printed circuit heat exchangers (PCHEs), which is considered for the supercritical $CO_2$ Brayton cycle power conversion system of a sodium-cooled fast reactor (SFR). The first phenomenon is plugging inside narrow sodium channels by micro cracks and the other one is damage propagation referred to as wastage combined with the corrosion/erosion effect. Experimental results of plugging shows that sodium flow immediately stopped as $CO_2$ was injected through the nozzle at $300{\sim}400^{\circ}C$ in 3 mmID sodium channels, whereas sodium flow stopped about 60 min after $CO_2$ injection in 5 mmID sodium channels. These results imply that if pressure boundary of sodium-$CO_2$ fails a narrow sodium channel would be plugged by reaction products in a short time whereas a relatively wider sodium channel would be plugged with higher concentration of reaction products. Wastage by the erosion effect of $CO_2$ (200~250 bar) hardly occurred regardless of the kinds of materials (stainless steel 316, Inconel 600, and 9Cr-1Mo steel), temperature ($400{\sim}500^{\circ}C$), or the diameter of the $CO_2$ nozzle (0.2~0.8 mm). Velocities at the $CO_2$ nozzle were specified as Mach 0.4~0.7. Our experimental results are expected to be used for determining the design parameters of PCHEs for their safeties.

Recent Progress in Air Conditioning and Refrigeration Research - A Review of papers Published in the Korean Journal of Air-Conditioning and Refrigeration Engineering in 1998 and 1999 - (공기조화, 냉동 분야의 최근 연구 동향 - 1998년 1999년 학회지 논문에 대한 종합적 고찰 -)

  • 이재헌;김광우;김병주;이재효;김우승;조형희;김민수
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.12 no.12
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    • pp.1098-1125
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    • 2000
  • A review on the papers published in the Korean Journal of Air-Conditioning and Refrigerating Engineering in 1998 and 1999 has been done. Focus has been put on current status of research in the aspect of heating, cooling, ventilation, sanitation and building environment. The conclusions are as follows. 1) A review of the recent studies on fluid flow, turbomachinery and pipe-network shows that many experimental investigations are conducted in applications of impingement jets. Researches on turbulent flows, pipe flows, pipe-networks are focused on analyses of practical systems and prediction of system performance. The results of noise reduction in the turbomachinery are also reported. 2) A review of the recent studies on heat transfer analysis and heat exchanger shows that there were many papers on the channel flow with the application to the design of heat exchanger in the heat transfer analysis. Various experimental and numerical papers on heat exchanger were also published, however, there were few papers available for the analysis of whole system including heat exchanger. 3) A review of the recent studies on heat pump system have focused on the multi-type system and the heat pump cycle to utilize treated sewage as the heat source. The defrosting and the frosting behaviors in the fin-tube heat exchanger is experimentally examined by several authors. Several papers on the ice storage cooling system are presented to show the dynamic simulation program and optimal operation conditions. The study on the micro heat pipes for the cooling of high power electronic components is carried out to examine the characteristics of heat and mass transfer processed. In addition to these, new type of separate thermosyphon is studied experimentally. 4) The recent studies on refrigeration/air conditioning system have focused on the system performance and efficiency for new alternative refrigerants. New systems operating with natural refrigerants are drawing lots of attention. In addition to these, evaporation and condensation heat transfer characteristics of traditional and new refrigerants are investigated for plain tubes and also for microfin tubes. Capillary tubes and orifice are main topics of research as expansion devices and studies on thermophysical properties of new refrigerants and refrigerant/oil mixtures are widely carried out. 5) A review of the recent studies on absorption cooling system shows that numerous experimental and analytical studies on the improvement of absorber performance have been presented. Dynamic analysis of compressor have been performed to understand its vibration characteristics. However research works on tow-phase flow and heat transfer, which could be encountered in the refrigeration system and various phase-change heat exchanger, were seemed to be insufficient. 6) A review of recent studies on duct system shows that the methods for circuit analysis, and flow balancing have been presented. Researches on ventilation are focused on the measurement of ventilation efficiency, and variation of ventilation efficiency with ventilation methods by numerous experimental and numerical studies. Furthermore, many studies have been conducted in real building in order to estimate indoor thermal environments. Many research works to get some information for cooling tower design have been performed but are insufficient. 7) A review on the recent studies on architectural thermal environment and building mechanical systems design shows that thermal comfort analysis is sitting environment, thermal performance analysis of Korean traditional building structures., and evaluation of building environmental load have been performed. However research works to improve the performance of mechanical system design and construction technology were seemed to be insufficient.

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Design of a High-Resolution Integrating Sigma-Delta ADC for Battery Capacity Measurement (배터리 용량측정을 위한 고해상도 Integrating Sigma-Delta ADC 설계)

  • Park, Chul-Kyu;Jang, Ki-Chang;Woo, Sun-Sik;Choi, Joong-Ho
    • Journal of IKEEE
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    • v.16 no.1
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    • pp.28-33
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    • 2012
  • Recently, with mobile devices increasing, as a variety of multimedia functions are needed, battery life is decreased. Accordingly the methods for extending the battery life has been proposed. In order to implement these methods, we have to know exactly the status of the battery, so we need a high resolution analog to digital converter(ADC). In case of the existing integrating sigma-delta ADC, it have not convert reset-time conversion cycle to function of resolution. Because of this reason, all digital values corresponding to the all number of bits will not be able to be expressed. To compensated this drawback, this paper propose that all digital values corresponding to the number of bits can be expressed without having to convert reset-time additional conversion cycle to function of resolution by using a up-down counter. The proposed circuit achieves improved SNDR compared to conventional converters simulation result. Also, this was designed for low power suitable for battery management systems and fabricated in 0.35um process.