• 한국결정학회:학술대회논문집
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• 한국결정학회 2007년도 추계학술연구발표회 및 정기총회
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• pp.42-42
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• 2007

• 반도체디스플레이기술학회지
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• 제14권1호
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• pp.67-71
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• 2015

Pulse electroplating was studied to form nanocrystal structure effectively by changing plating current density and duty cycle. When both of plating current density and duty cycle were decreased from $100mA/cm^2$ and 70% to $50mA/cm^2$ and 30%, the P content in the Ni matrix was increased almost up to the composition of $Ni_3P$ compound and the grain growth after annealing was retarded as well. The as-plated hardness values ranging from 660 to 753 HV are mainly based on the formation of nanocrystal structure. On the other hand, the post-anneal hardness values ranging from 898 to 1045 HV, which are comparable to the hardness of hard Cr, are coming from how competition worked between the precipitation of $Ni_3P$ and the grain coarsening. According to the ANOVA and regression analysis, the plating current density showed more strong effect on nanocrystal size and film hardness than the duty cycle.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.186-186
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• 2015

We have introduced multifunctional ITO single thin films formed by normal sputtering system equipped with a plasma limiter which effectively blocks the bombardment of energetic negative oxygen ions. MFSS ITO also possesses high gas diffusion barrier properties simultaneously low resistivity even it deposited at room temperature without post annealing on plastic substrate. Nano-crystalline enhancement by Ar energy has energy window from 20 to 30 eV under blocking NOI condition. Effect of blocking NOI and optimal Ar energy window enhancement facilitate that resistivity is minimized to $3.61{\times}10^{-4}{\Omega}cm$ and the WVTR of 100 nm thick MFSS ITO is $3.9{\times}10^{-3}g/(m^2day)$ which is measured under environmental conditions of 90% relative humidity and 50oC that corresponds to a value of ${\sim}10^{-5}g/(m^2day)$ at room temperature. The multifunctional MFSS ITO with low resistivity, and low gas permeability will be highly valuable for plastic electronics applications.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.309-309
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• 2013

기존의 CIGS 태양전지는 window 층(GZO/ZnO/CdS)에서의 투과 및 반사 손실을 줄이기 위하여 MgF2를 이용한 AR (Anti Reflection) 층을 적용하여 cell을 제작하고 있다. 현재 단위공정을 줄이고 시간적 경제적 비용을 절감하기위해 무반사 코팅층 없이 표면의 구조를 변화 시키거나 CIGS 태양전지의 window 층만으로 cell 구조에 적용하는 연구가 많이 진행되고 있다. 본 연구는 AR층과 window층 역할을 동시에 만족하는 일체화된 window층 두께를 설계하고 성장한 후, window층의 열처리 전후의 구조적, 광학적 및 전기적 특성을 비교 평가하였다. Macleod simulation을 이용하여 window 층을 설계한 후, RF magnetron sputtering법을 이용하여 상온성장 시킨 후 N2 분위기에서 후열처리 조건에 따른 박막의 구조적, 전기적 및 광학적 특성을 변화를 X-ray diffractometer, Field emission-scanning electron microscope, Atomic force microscopy, 4 point probe, Hall 측정, 투과도 및 반사도등으로 비교 평가하였다.

• The Korean Journal of Ceramics
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• 제4권4호
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• pp.372-376
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• 1998

Using calcium-phosphate-powder targets with the Ca/P ratios of 1.0-1.67, hydroxyapatite ($Ca_{10}(PO_4)_6(OH)_2$, HAp) thin films with 4-7㎛ thickness were prepared on titanium metal plates by r.f. magnetron sputtering, followed an annealing at $200^{\circ}C$ for 24 hr under a high water vapor pressure using an autoclave. All the specimens were systematically characterized by XRD, FT-IR, SEM and EDS analyses. The post-annealed films were confirmed to be a nonstoichiometric oxyhydroxyapatite by XRD and FT-IR measurements.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권1호
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• pp.51-54
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• 2009

Transparent Cuprous oxide film was deposited by rapid thermal oxidation (RTO) of Cu at $500^{\circ}C$/45s condition on textured single-crystal n-Si substrate to form $Cu_2O$/n-Si heterojunction photodiode. The Hall effect measurements for the $Cu_2O$ films showed a p-type conductivity. The photovoltaic and electrical properties of the junction at room temperature were investigated without any post-deposition annealing. I-V characteristics revealed that the junction has good rectifying properties. The C-V data showed abrupt junction and a built-in potential of 1 V. The photodiode showed good stability and high responsivity in the visible at three regions; 525 nm, 625-700 nm, and 750nm denoted as regions A, B, and C, respectively.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.927-930
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• 2009

We studied the solution processes of IGZO thin films and investigated the electrical characteristics of thin film transistor (TFT) with sol-gel processed InGaZn-oxide active semiconductor layer. In particular, the effect of composition variation and post annealing temperature were studied by using solutions having various metal cation ratios to optimize transistor performance.

• Journal of Korean Vacuum Science & Technology
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• 제2권1호
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• pp.25-31
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• 1998

The reliability of fluorine doped silicon oxide (SiOF) films for intermetal dielectrics in multilevel interconnections of ultra-large scale integrated circuits (ULSIs) is investigated. SiOF films were deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition (ECRPECVD) using H-free source gases, i.e., SiF4 and O2. The effect of post plasma treatment on the moisture absorption and dielectric properties of SiOF films was carried out I terms of air exposure time, The reliability test of Cu/TiN/SiOF/Fi specimen was carried out in terms of temperature by rapid thermal annealing (RTA) in N2 ambient. After O2 plasma treatment,, no appreciable peak directly related to moisture absorption was detected. The capacitance-voltage (C-V) characteristics of the O2 plasma treated SiOF film showed that the film remained to hold the sound dielectric properties even after boiling treatment. The Cu/TiN/SiOF/Si system was found to be reliable up to $600^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.13-14
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• 2007

투명전극으로 사용되는 ITO는 우수한 전기적, 광학적 특성으로 인하여 널리 사용되고 있다. 하지만, ITO는 저온공정의 어려움과 ITO의 원료물질인 In의 수급이 불안정하여 원자재의 가격이 높고, 수소 플라즈마에 노출시 열화로 인한 광학적 특성의 변화가 문제점으로 지적되고 있다. 본 논문에서는 ITO 투명전극을 대체하기 위한 실험으로 Al 이 도핑된 ZnO(ZnO:Al) 박막을 상온에서 유리기판 위에 RF 마그네트론 스퍼터 법을 이용하여 제조하였다. 증착된 박막은 ITO물질을 대체하기 위한 투명전극으로의 응용을 위해 후 열처리를 실시하였다. 설정된 열처리 온도는 각각 400도와 300도로 설정하였고 열처리 시간에 따른 변화를 관찰하였다. 열처리된 시편은 각각 XRD, SEM, Hall, U/V 측정을 하여 변화를 관찰하였다.

• 한국전기전자재료학회논문지
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• 제22권2호
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• pp.128-131
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• 2009

Silicon carbide (SiC) has attracted significant attention for high frequency, high temperature and high power devices due to its superior properties such as the large band gap, high breakdown electric field, high saturation velocity and high thermal conductivity. We performed Al ion implantation processes on n-type 4H-SiC substrate using a SILVACO ATHENA numerical simulator. The ion implantation model used Monte-Carlo method. We simulated the effect of channeling by Al implantation in both 0 off-axis and 8 off-axis n-type 4H-SiC substrate. We have investigated the effect of varying the implantation energies and the corresponding doses on the distribution of Al in 4H-SiC. The controlled implantation energies were 40, 60, 80, 100 and 120 keV and the implantation doses varied from $2{\times}10^{14}$ to $1{\times}10^{15}\;cm^{-2}$. The Al ion distribution was deeper with increasing implantation energy, whereas the doping level increased with increasing dose. The effect of post-implantation annealing on the electrical properties of Al-implanted p-n junction diode were also investigated.