• 한국재료학회지
• /
• 제24권11호
• /
• pp.632-638
• /
• 2014

We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at $50^{\circ}C$. The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with < 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of $50^{\circ}C$.

• 동력기계공학회지
• /
• 제5권3호
• /
• pp.80-87
• /
• 2001

Decorative properties of chromium depositions from oxalic acid bath containing chromium oxide and ammonium sulfate have been examined over a wide range of bath compositions and plating conditions. The obtained results from this experiment are summarized as follow: The followings were determined as a optimum conditions, bath compositions; $CrO_3\;200{\sim}250\;g/{\ell},\;H_2C_2O_4{\cdot}2H_2O\;500{\sim}700\;g/{\ell},\;(NH_4)_2SO_4\;40{\sim}120\;g/{\ell}$, and operation conditions; pH $2.0{\sim}2.5$, current density $15{\sim}250\;A/dm^2$ at bath temperature range of $30{\sim}80^{\circ}C$. Bright chromium deposits were obtained over a wide range of ammonium sulfate concentration and bath temperature. Decorative property for chromium deposition was adopted to apply stoichiometric ratio of $CrO_3$ concentration and $H_2C_2O_4{\cdot}2H_2O$.

• 한국표면공학회지
• /
• 제33권2호
• /
• pp.126-134
• /
• 2000

This study investigated the bath compositions and plating conditions and crystal structure used for achieving nickel-thallium-phosphorus deposits by means electroless plating. The electroless nickel-thallium-phosphorus deposits were achieved with a bath using sodium hypophosphite as the reducing agent and sodium citrate as the complexing agent. The depositing rate was 10.5mg.$cm^{2-1}$ .$hr^{-1 }$ from the optimistic bath composition, 0.1M nickel sulfate, 0.005M thallium sulfate, 0.2M sodium hypophosphite, and 0.05M sodium citrat and the recommended plating conditions, pH 5.5 and $90^{\circ}C$. The composition of alloy deposits determined by X-ray analysis (EDS) that the Thallium was increased with major increasing concentration of complexing agent and thallium ion in bath solution, it decreased according to the increasing concentrations of reduction agent in the bath solution, Bit Phosphorus showed a contrary to the thallium. It was observed from X-ray diffraction analysis, Scanning Electron Microscopy and Transmission Electron Microscopy. The crystalline structure of deposits was amorphous at the first deposited state but it was changed $Ni-T1-Ni_{5}$ $P_2$ polycrystalline when subjected to 1 hour heat treatment of more than $350^{\circ}C$. TEM observation demonstrated that the microstructure was identical to the result of the XRD at as deposited but it became $Ni-Tl-Ni_{5}$ $P_2$ polycrystalline when heated. And grain size was 10-50nm.

• Journal of Welding and Joining
• /
• 제19권5호
• /
• pp.520-525
• /
• 2001

The Sn-Pb eutectic solder bump formation ($150\mu\textrm{m}$ diameter, $250\mu\textrm{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Pb deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased wish increasing time. The plating rate became constant at limiting current density. After the characteristics of Sn-Pb plating were investigated, Sn-Pb solder bumps were fabricated in optimal condition of $7A/dm^$. 4hr. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallurgy). The shear strength of Sn-Pb bump after reflow was higher than that of before reflow.

• 대한조선학회논문집
• /
• 제36권2호
• /
• pp.77-93
• /
• 1999

본 연구에서는 충격횡압력을 받는 선체 판부재의 붕괴강도 특성을 분석하고 충격하중 효과를 고려한 간이 구조설계식을 제시하고자 한다. 충격횡압력하에 판부재의 붕괴거동을 분석하기 위해 기존의 실험결과와 더불어 범용 비선형 유한요소해석 프로그램인 STARDYNE을 이용하였다. 이론적 방법으로는 먼저 강소성이론을 이용하여 정적 횡압력을 받는 판부재에 대한 붕괴강도식을 도출하였다. 또한, 변형률속도 효과를 고려하여 충격 횡압력 문제에도 적용하였다. 실제 판부재에 적용 예로써 충격횡압력을 받는 강판부재와 알루미늄합금 보강판부재에 대한 붕괴거동을 분석하였다.

• 한국표면공학회지
• /
• 제42권4호
• /
• pp.157-160
• /
• 2009

Many fundamental studies have been carried out regarding waste water and hazardous gas treatments technologies using the photolysis effect of $TiO_2$. However, a permanent use of $TiO_2$ particles immobilized using organic or organic-inorganic binders is impossible. In this study, Ni-$TiO_2$ composite coating was produced by electroless plating to trap $TiO_2$ particles in the Ni coating layer. The electroless plating was performed in the bath solutions with three different concentrations of $TiO_2$ particles : 10 g/l, 20 g/l, and 40 g/l. The surface and photolytic characteristics of the coating layer was investigated by the use of SEM, a scratch tester, and an UV-Visible spectrophotometer. The results showed that the amounts of immobilized $TiO_2$ particles and the photolytic rate of the coating increased with the initial content of $TiO_2$ particles in the electroless bath. In addition, the photolytic rate of the Ni-$TiO_2$ composite coating was remarkably promoted by etching process in 10% HCl solution.

• 한국표면공학회지
• /
• 제25권3호
• /
• pp.133-143
• /
• 1992

Titanium nitride(TiN) films have been prepared by HCD plasma enhanced reactive ion plating. Density and temperature of the plasma generated by the HCD were investigated. It was shown that parameters such as the substrate bias voltage(0 350V) and N2 flow rate(10 180SCCM) influenced the growth, the growth, the microstructure and the color tone of the film mostly. In order to study the interface region, surface analysis by AES combined with sputter depth profiling was performed. Microhardness of the coated TiN films were measured by micro Vickers hardness tester. Also, the effect of coating parameters on composition, coating surface and fracture morphology, grain size and growth rate were examined.

• 한국표면공학회지
• /
• 제41권5호
• /
• pp.240-244
• /
• 2008

Composite plating is a method of co-deposition of plating layer with metallic and/or non-metallic particles to improve the plating layer properties such as high corrosion resistance and photolysis of organic compounds. The properties of nickel-ceramic composite plating are significantly depend on the surface characteristics of co-deposited particles as well as the quantity in electrolyte. In this study, Ni-$TiO_2$ composite coating layer was produced by electrodeposition technique from non-aqueous eletrolyte and its surface characteristics as well as photolytic properties were investigated. The amounts of immobilized $TiO_2$ particles increased with increasing the initial $TiO_2$ particles contents in the bath. Samples electroplated with the current density of $0.5\;A/dm^2$ showed the significantly improved homogeneous $TiO_2$ particles distribution. The corrosion resistance of Ni-$TiO_2$ composite coating layer also improved with increaing the amounts of $TiO_2$ particles. Etched sample showed about 10% increased photolytic rate of organic matter compare to that of the non-etched.

• 전기화학회지
• /
• 제3권2호
• /
• pp.121-126
• /
• 2000

[ $AB_5$ ] 수소저장합금인 $LaNi_5$, 합금분말에 Ni 및 Cu 무전해 도금의 영향을 전기 화학적 실험을 통하여 고찰하였다. 전기 화학적 실험은 정전류 충$\cdot$방전 실험, 순환전류전위 실험, 교류 임피던스 실험 등을 실시하여 도금하지 않은 $LaNi_5$ 전극과 Ni 및 Cu 무전해 도금한 전극간의 특성을 비교 연구하였다. 현상학적인 분석으로는 SEM을 이용하여 분말상의 미세조직을 관찰하였으며 X-선 회절시험을 실시하였다 무전해 도금을 실시하여 Ni 및 Cu박막이 피복된 수소저장 합금은 활성화 특성파 싸이클 수명 등의 특성이 개선되었으며 도금하지 않은 전극에 비하여 반응속도가 증가하였다. 또한 충$\cdot$방전이 반복됨에 따라 전극과 전해질 계면에서의 전하이동저항이 현저하게 감소하였다. 따라서 본 연구에서 실시한 $LaNi_5$, 활물질에 Ni및 Cu 무전해 도금을 실시하면 초기 활성화반응을 촉진시키며 $LaNi_5$활물질이 전해질과의 직접 접촉을 피하게 되어 전극의 수명을 증가시키는 것을 알 수 있었다.

• 동력기계공학회지
• /
• 제5권1호
• /
• pp.89-96
• /
• 2001

Decorative property of chromium deposition from oxalic acid bath containing chromium oxide and ammonium sulfate, has been examined over a wide range of bath compositions and plating conditions. The followings were determined as optimum bath composition, $CrO_3\;200{\sim}250g/{\ell},\;H_2C_2O_4{\cdot}2H_2O\;500{\sim}700g/{\ell},\;(NH_4){_2}SO_4\;40{\sim}120g/{\ell}$, and operation conditions; pH $2.0{\sim}2.5$, current density of $15{\sim}250Adm^2 $ at the bath temperatures of $30{\sim}80^{\circ}C$. Bright chromium deposits were obtained over a wide range of ammonium sulfate concentration, bath temperature, and current density. The current efficiency decreased with increasing current density and bath pH, and increased with Increasing bath temperature. The highest current efficiency was obtained in the bath containing $80g/{\ell}$ of ammonium sulfate. Bright chromium deposits were not obtained at conditions of all the highest current efficiencies.