Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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DMAB Effects in Electroless Ni Plating for Flexible Printed Circuit Board

DMAB첨가량에 따른 연성회로기판을 위한 무전해 Ni 도금박막에 관한 연구

  • Kim, Hyung-Chul (Department of Materials Engineering, Hanbat National University) ;
  • Rha, Sa-Kyun (Department of Materials Engineering, Hanbat National University) ;
  • Lee, Youn-Seoung (Department of Information & Communication Engineering, Hanbat National University)
  • 김형철 (한밭대학교 재료공학과) ;
  • 나사균 (한밭대학교 재료공학과) ;
  • 이연승 (한밭대학교 정보통신공학과)
  • Received : 2014.08.05
  • Accepted : 2014.10.14
  • Published : 2014.11.27
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Abstract

We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at $50^{\circ}C$. The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with < 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of $50^{\circ}C$.

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