• Title/Summary/Keyword: Plasma Polymer

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Organic Field Effect Transistor Based Memory Device With Plasma Polymerized Styrene Thin Film as Polymer Electret

  • Kim, Hui-Seong;Lee, Bung-Ju;Jeong, Geon-Su;Sin, Baek-Gyun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.195.2-195.2
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    • 2013
  • 플라즈마 중합 증착기술을 이용하여 ppMMA (plasma polymerized methyl methacrylate) 및 ppS (plasma polymerized styrene) 박막을 제작하고, ppMMA를 게이트 절연층, polymer electret인 ppS를 메모리층으로 한 전계효과트랜지스터 기반 유기 메모리 소자를 제작하였다. 메모리층인 ppS의 두께를 각각 30, 60, 90 nm로 달리한 유기 메모리 소자가 C-V 및 I-V 특성에서 나타내는 히스테리시스 현상을 분석하여 메모리 특성을 평가했으며, 메모리층의 두께 변화에 따른 유기 메모리 소자의 성능을 비교분석하였다.

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Deposition of Plasma Polymerized Films on Silicon Substrates Using Plasma Assisted CVD Method For Low Dielectric Application

  • Kim, M.C.;S.H. Cho;J.H. Boo;Lee, S.B.;J.G. Han;B.Y. Hong;S.H. Yang
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2001.06a
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    • pp.72-72
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    • 2001
  • Plasma polymerized thin films have been deposited on Si(lOO) substrates at $25-400^{\circ}C$ using thiophene ($C_4H_4S$) precursor by plasma assisted chemical vapor deposition (PACVD) method for low-dielectric device application. In order to compare physical properties of the as-grown thin films, the effects of the plasma power, gas flow ratio and deposition temperature on the dielectric constant and thermal stability were mainly studied. XRD and TED studies revealed that the as-grown thin films have highly oriented amorphous polymer structure. XPS data showed that the polymerized thin films that grown under different RF power and deposition temperature as well as different gas ratio of $Ar:H_2$ have different stoichiometric ratio of C and S compared with that of monomer, indicating a formation of mixture polymers. Moreover, we also realized that oxygen free and thermally stable polymer thin films could be grown at even $400^{\circ}C$. The results of SEM, AFM and TEM showed that the polymer films with smooth surface and sharp interface could be grown under various deposition conditions. From the electrical property measurements such as I-V and C-V characteristics, the minimum dielectric constant and the best leakage current were obtained to be about 3.22 and $10-11{\;}A/\textrm{cm}^2$, respectively.

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Polymer Thin Film of Phthalic Anhydride via Plasma Polymerization (플라즈마 중합에 의한 프탈릭 안하이드라이드 고분자 박막 필름 제조 연구)

  • Kang, Hyun Min;Basarir, Fevzian;Paek, Kwan Yeol;Yoon, Tae-Ho
    • Journal of Adhesion and Interface
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    • v.10 no.1
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    • pp.17-22
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    • 2009
  • Polymer thin films were prepared by radio frequency (RF) plasma polymerization of phthalic anhydride (PA). First, monomer vaporization temperature ($100{\sim}160^{\circ}C$) was optimized by evaluating the thermal properties of thin films using differential scanning calorimeter (DSC) and measuring the root-mean-square (RMS) roughness with atomic force microscope (AFM) at the fixed plasma power of 10 W and time of 5 min in a continuous-wave (CW) mode. Plasma power (5~20 W) was then optimized by measuring the film solubility in solvents such as toluene, acetone, dimethylsulfoxide (DMSO) and 1 methylpyrrolidine (NMP). Next, pulsed mode plasma polymerization was also studied by varying the duty cycle of on-time (5, 20%) under optimized conditions of continuous-wave (CW) mode ($120^{\circ}C$, 10 W) in order to increase the anhydride functional groups. Finally, polymer thin films were characterized by Fourier transform infrared spectroscopy (FT-IR), thermogravimetric analyzer (TGA) and ${\alpha}$-step.

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Thermal Lamination of Polyethylene Film on Aluminum by Surface Modification (표면개질을 이용한 폴리에틸렌 필름과 알루미늄간의 열융착)

  • Cho, Dong-Lyun;Yun, Ta-Song
    • Polymer(Korea)
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    • v.25 no.4
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    • pp.594-601
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    • 2001
  • Direct thermal lamination of polyethylene film on aluminum plate without using adhesive was tried by modifying their surfaces to have polar groups. Polyethylene film was modified by treating with oxygen or acrylic acid plasma. Aluminum plate was modified by treating with boiling water or diaminocyclohexane plasma. Fairly high adhesion strength was obtained even in the case when only the polyethylene film was modified, and adhesion strength was so high that film was broken during the adhesion test if both the film and the aluminum plate were modified. Even chemical bonding seemed to be possible when the film treated with acrylic acid was laminated on the plate treated with diaminocyclohexane plasma by forming amide linkage through the reaction between COOH groups on the film surface and NH$_2$ groups on the plate surface.

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Study of Aging and Durability on Plasma Polymerized Tire Cords (플라즈마 중합 코팅된 타이어 코드의 노화에 따른 접착력 변화 연구)

  • Kang, H.M.;Yoon, T.H.
    • Journal of Adhesion and Interface
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    • v.4 no.1
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    • pp.28-34
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    • 2003
  • Steel tire cords were subjected to plasma polymerization coating of acetylene in order to enhance the adhesion to rubber compounds. Plasma polymerization coating was varied to plasma polymerization coating of acetylene, argon plasma etching+plasma polymerization, or argon plasma. etching+plasma polymerization with Ar carrier gas. Adhesion was evaluated via TCAT samples and compared to those with brass coated tire cord. For durability study, plasma polymer cooled tire cords were aged in lab atmosphere for 1, 3, 5, 10 or 15 days, while TCAT specimens prepared with plasma polymer coated tire cords were aged in distilled water, 10% NaCl solution or $100^{\circ}C$ oven for 1, 2, 3 or 4 weeks. After testing, failure surfaces were analyzed with SEM/EDX. Among the treatments, the highest adhesion was obtained by Ar etching+acetylene plasma. polymerization coating with Ar carrier gas, providing almost same pull-out force as the brass coated tire cords. Upon the aging of the tire cords in the lab atmosphere, brass coated tire cords provided better adhesion than plasma polymer coated tire cords, while the TCAT samples with plasma polymer coated tire cords exhibited similar or slightly superior durability to those with brass coated tire cords.

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On the Etching Mechanism of Parylene-C in Inductively Coupled O2 Plasma

  • Shutov, D.A.;Kim, Sung-Ihl;Kwon, Kwang-Ho
    • Transactions on Electrical and Electronic Materials
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    • v.9 no.4
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    • pp.156-162
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    • 2008
  • We report results on a study of inductively coupled plasma (ICP) etching of Parylene-C (poly-monochloro-para-xylylene) films using an $O_2$ gas. Effects of process parameters on etch rates were investigated and are discussed in this article from the standpoint of plasma parameter measurements, performed using a Langmuir probe and modeling calculation. Process parameters of interest include ICP source power and pressure. It was shown that major etching agent of polymer films was oxygen atoms O($^3P$). At the same time it was proposed that positive ions were not effective etchant, but ions played an important role as effective channel of energy transfer from plasma towards the polymer.

MICP(Multi-pole Inductively Coupled Plasma)를 이용한 deep contact etch 특성 연구

  • 김종천;구병희;설여송
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2003.05a
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    • pp.12-17
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    • 2003
  • 본 연구에서는 MICP Etching system 을 이용한 Via contact 및 Deep contact hole etch process 특성을 연구하였다. Langmuir probe 를 이용한 MICP source 의 Plasma density & electron temperature 측정하였고 탄소와 플로우르를 포함하는 혼합 Plasma 를 형성하여 RF frequency, wall temperature, chamber gap, gas chemistry 등의 변화에 따른 식각 특성을 조사하였다. Plasma density 는 1000w 에서 $10^{11}$/$cm^3$ 이상의 high density plasma와 uniform plasma 형성을 확인하였고 $CH_{2}F_{2}$와 CO의 적절한 혼합비를 이용하여 Oxide to PR 선택비가 10 이상인 고선택비 조건을 확보하였다. 고선택비 형성에 따라 Polymer 형성이 많이 되었고 이를 개선하기 위하여 반응 챔버의 온도 조절을 통하여 Polymer 증착 방지에 효과적인 것을 확인하였다. MICP source를 이용하여 탄소와 플로우르의 혼합 가스와 식각 챔버의 온도 조절에 의한 선택비 증가를 확보하여 High Aspect Ratio Contact Hole Etch 가능성을 확보하였다.

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Adhesion Characteristics of Polymer Material Treated by Atmospheric Pressure Plasma (상압 플라즈마 표면처리에 의한 고분자 재질의 접착특성 변화)

  • Seo, Seung-Ho;Chang, Sung-Hwan;Yoo, Yeoung-Een;Chung, Jae-Dong
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.5
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    • pp.445-450
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    • 2011
  • We studied the adhesion characteristics of polymer films (PC, PET, EVA) treated by atmospheric pressure plasma. The process parameters were the frequency, gas flow, and treatment time; we studied the effects of these parameters on the adhesion characteristics of the polymer materials. We used de-ionized water and diiodomethane as the polar and nonpolar solvents, respectively, for measuring the contact angles, and subsequently calculated the surface free energy of each polymer film. The adhesion characteristics were studied by carrying out a $180^{\circ}$ peel-off test. The polymer films treated with plasma developed a hydrophilic surface, which led to increased surface free energy and improved adhesion properties. From the results for contact angle, surface free energy, and adhesion strength, we obtained the optimal plasma-treatment conditions.

Enhanced Hydrophilicity of Polyethersulfone Membrane by Various Surface Modification Methods (다양한 표면개질을 이용한 폴리에테르설폰 막의 친수성 향상)

  • Park, So Jung;Hwang, Jun Seok;Choi, Won-Kil;Lee, Hyung Keun;Huh, Kang Moo
    • Polymer(Korea)
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    • v.38 no.2
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    • pp.205-212
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    • 2014
  • Polyethersulfone (PES) membranes were modified by various physico-chemical modification methods to enhance the surface hydrophilicity for application as a separation membrane to separate and collect water vapor from the flue gas. Homogeneous PES flat-sheet membranes were prepared and modified by acid treatment, blending and plasma treatment for hydrophilic surface modification. The surface characteristics of the modified PES membranes were evaluated by ATR-FTIR, XPS, SEM and contact angle measurements. No significant change in hydrophilicity was observed for the PES membranes modified by acid treatment with sulfuric acid or blending with various compositions of poloxamer as an amphiphilic PEO-PPO-PEO tri-block copolymer. On the other hand, Ar plasma treatment led to a significant increase in the hydrophilicity of the surface, depending on the plasma treatment time. As a result, the PES membrane could be the most efficiently surface-treated by applying the plasma treatment for enhancing their surface hydrophilicity.