• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.2
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• pp.29-35
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• 1998

This paper describes architectures and design of a SIMD type parallel image processing chip called SliM-II. The chiphas a linear array of 64 processing elements (PEs), operates at 30 MHz in the worst case simulation and gives at least 1.92 GIPS. In contrast to existing array processors, such as IMAP, MGAP-2, VIP, etc., each PE has a multiplier that is quite effective for convolution, template matching, etc. The instruction set can execute an ALU operation, data I/O, and inter-PE communication simulataneously in a single instruction cycle. In addition, during the ALU/multiplier operation, SliM-II provides parallel move between the register file and on-chip memory as in DSP chips, SliM-II can greatly reduce the inter-PE communication overhead, due to the idea a sliding, which is a technique of overlapping inter-PE communication with computation. Moreover, the bandwidth of data I/O and inter-PE communication increases due to bit-parallel data paths. We used the COMPASS$^{TM}$ 3.3 V 0.6.$\mu$m standrd cell library (v8r4.10). The total number of transistors is about 1.5 muillions, the core size is 13.2 * 13.0 mm$^{2}$ and the package type is 208 pin PQ2 (Power Quad 2). The performance evaluation shows that, compared to a existing array processors, a proposed architeture gives a significant improvement for algorithms requiring multiplications.s.

• The Journal of Industrial Distribution & Business
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• v.11 no.12
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• pp.7-15
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• 2020

Purpose: This study aims to explore the feasibility of expanding complex wards to provide efficient hospital management and high-quality medical services to local residents of Gangneung Medical Center (GMC). Research Design, Data and Methodology: There are four research designs to achieve the research objectives. We analyzed Big Data for 3 months on Social Network Services (SNS). A questionnaire survey conducted on 219 patients visiting the GMC. Surveys of 20 employees of the GMC applied. The feasibility to expand the GMC ward measured through Focus Group Interview by 12 internal and external experts. Data analysis methods derived from various surveys applied with data mining technique, frequency analysis, and Importance-Performance Analysis methods, and IBM SPSS statistical package program applied for data processing. Results: In the result of the big data analysis, the GMC's recognition on SNS is high. 95.9% of the residents and 100.0% of the employees required the need for the complex ward extension. In the analysis of expert opinion, in the future functions of GMC, specialized care (△3.3) and public medicine (△1.4) increased significantly. Conclusion: GMC's complex ward extension is an urgent and indispensable project to provide efficient hospital management and service quality.

• Structural Engineering and Mechanics
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• v.85 no.6
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• pp.755-764
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• 2023

The article examines the impact response of the sandwich beam furnished by a novel bilayer core as inspired by the woodpecker's head architecture under different repeatedly exerted low-velocity impact loadings by employing the finite element package, ABAQUS. The sandwich beam forms four essential parts comprising bottom and top carbon fiber reinforced polymer laminates encasing bilayer core made of laterally arched solid hot melt adhesive material and aluminum honeycomb. Impact loadings are implemented repeatedly with a steel hemisphere impactor for various impact energies, 7.28 J, 9.74 J, and 12.63 J. Essentially, the commonly concentrated stresses at the impact region are regulated away by the arched core in all considered cases thus reducing the threat of failure. The sandwich beam can resist up to 5 continual impacts at 7.28 J and 9.74 J but only up to 3 times repeated loads at 12.63 J before visible failure is noticed. In the examination of several key impact performance indicators under numerous loading cases, the proposed beam demonstrates favorably up to 1.3-11.2 higher impact resistance efficacies compared to existing designs, therefore displaying an improvement in repeated impact resistance of the new design.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.19-25
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• 2011

The size reduction of the semiconductor chip and the improvement of the electrical performance have been enabled through the introduction of the Cu/Low-K process in modern electronic industries. However, Cu/Low-K has a disadvantage of the physical properties that is weaker than materials used for existing semiconductor manufacture process. It causes many problems in chip manufacturing and package processes. Especially, the delamination between the Cu layer and the low-K dielectric layer is a main defect after the temperature cycles. Since the Cu/Low-K layer is located on the top of the pad of the flip chip, the stress on the flip chip affects the Cu/Low-K layer directly. Therefore, it is needed to improve the underfill process or materials. Especially, it becomes very important to select the underfill to decrease the stress at the flip-chip and to protect the solder bump. We have solved the delamination problem in a 90 nm Cu/Low-K flip-chip package after the temperature cycle by selecting an appropriate underfill.

• Journal of Internet Computing and Services
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• v.11 no.2
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• pp.143-153
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• 2010

When providing high quality panoramic video across the Internet, mobile communications, and broadcasting areas, it requires a suitable video codec that satisfies both high-compression efficiency and random access functionality. The users must have high-compression efficiency in order to enable video streaming of high-volume panoramic data. Random access allows the user to move the viewpoint and direction freely. In this paper, we propose the parallel processing scheme under cell units in order to improve the performance of streaming service for large screen panoramic video in 10Mbps bandwidths based on H.264/AVC with high compression rate. This improved algorithm divides a screen composed of cells less than $256{\times}256$ in size, encodes it, and decodes it with the cells in the present view. At this point, encoding/decoding is parallel processed by the present cell units. Also, since the cells only included in the present view are packed and transmitted, the possible processing of not extricating blocks is proven by experiment.

• Korean Journal of Cognitive Science
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• v.7 no.1
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• pp.85-103
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• 1996

In this paper,the existence between the difference of the organization culture and th organizational performance is studied. Many previous studies verified the relationship between the two. The Korean Company survey is based on Rousseau's orgnization culture style,and is analyzed using the statistical package. Rousseau's culture style is composed of three components :consturctive style, passive/defensive style,and aggressive/defensive style. The characteristics of each orgnizational analusis are examined. The elements of the constructive style represent positive values on attitude varriables which are selected as the organizational performence variables. The elements of the passive/defensive style represent neagtive values of the attitude variables. Thus,they have an inverse relationship with this culture style. However,the aggressive/ defensive culture's results represent the weak positive relationship compared with the passive/defensive style. For the improvement of the organizational performance,the orgnzational culture has to develop the constructive style and it is better to minimize the defensive style.

• YAKHAK HOEJI
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• v.52 no.6
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• pp.507-513
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• 2008

The purpose of this study is to analyze the factors affecting financial performance of community pharmacies after the implementation of the new drug policy in Korea: separation of drug prescription and dispensing (SPD). The online survey questionnaires were sent to the active pharmacists of the total 20,633 community pharmacies in Korea and 1,147 pharmacists responded to the survey (the response rate was 5.5%). The questionnaire asked simple financial data in order to compare their financial performances before and after the policy. With the SPSS package (version 12.0), two levels of data analysis were used: 1) descriptive statistics to see the financial status of the pharmacies; and 2) multiple regression analysis to find the factors. {or A multiple regression method was used for the data analysis.} The finding illustrated that the average net benefit of the pharmacies was 4,870 thousand won in August 2006, and the major factors affecting the net benefit were the location of pharmacy (geographical proximity to medical institutions), number of prescriptions, drug management services for patients, chain pharmacy membership. The findings of this study suggest that service improvement for patients, revitalization of non-prescription drug sales, professional management will contribute to promote community based pharmacy business.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.42-48
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• 2023

Recently, there has been an increasing demand for performance improvement and miniaturization in response to the growing variety of signals and power demands in many industries such as mobile, IoT, and automotive. As a result, there is a high demand for high-performance chips and advanced packaging technologies that can package such chips. In this context, the FOWLP process technology is a suitable technology, and this paper discusses the plasma application technologies that are being used and studied to improve the shortcomings of this process. The paper is divided into four parts, with an introduction and case studies for each of the plasma application technologies used in each part.

• Journal of Intelligence and Information Systems
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• v.16 no.4
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• pp.99-112
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• 2010

Ensemble learning is a method for improving the performance of classification and prediction algorithms. It is a method for finding a highly accurateclassifier on the training set by constructing and combining an ensemble of weak classifiers, each of which needs only to be moderately accurate on the training set. Ensemble learning has received considerable attention from machine learning and artificial intelligence fields because of its remarkable performance improvement and flexible integration with the traditional learning algorithms such as decision tree (DT), neural networks (NN), and SVM, etc. In those researches, all of DT ensemble studies have demonstrated impressive improvements in the generalization behavior of DT, while NN and SVM ensemble studies have not shown remarkable performance as shown in DT ensembles. Recently, several works have reported that the performance of ensemble can be degraded where multiple classifiers of an ensemble are highly correlated with, and thereby result in multicollinearity problem, which leads to performance degradation of the ensemble. They have also proposed the differentiated learning strategies to cope with performance degradation problem. Hansen and Salamon (1990) insisted that it is necessary and sufficient for the performance enhancement of an ensemble that the ensemble should contain diverse classifiers. Breiman (1996) explored that ensemble learning can increase the performance of unstable learning algorithms, but does not show remarkable performance improvement on stable learning algorithms. Unstable learning algorithms such as decision tree learners are sensitive to the change of the training data, and thus small changes in the training data can yield large changes in the generated classifiers. Therefore, ensemble with unstable learning algorithms can guarantee some diversity among the classifiers. To the contrary, stable learning algorithms such as NN and SVM generate similar classifiers in spite of small changes of the training data, and thus the correlation among the resulting classifiers is very high. This high correlation results in multicollinearity problem, which leads to performance degradation of the ensemble. Kim,s work (2009) showedthe performance comparison in bankruptcy prediction on Korea firms using tradition prediction algorithms such as NN, DT, and SVM. It reports that stable learning algorithms such as NN and SVM have higher predictability than the unstable DT. Meanwhile, with respect to their ensemble learning, DT ensemble shows the more improved performance than NN and SVM ensemble. Further analysis with variance inflation factor (VIF) analysis empirically proves that performance degradation of ensemble is due to multicollinearity problem. It also proposes that optimization of ensemble is needed to cope with such a problem. This paper proposes a hybrid system for coverage optimization of NN ensemble (CO-NN) in order to improve the performance of NN ensemble. Coverage optimization is a technique of choosing a sub-ensemble from an original ensemble to guarantee the diversity of classifiers in coverage optimization process. CO-NN uses GA which has been widely used for various optimization problems to deal with the coverage optimization problem. The GA chromosomes for the coverage optimization are encoded into binary strings, each bit of which indicates individual classifier. The fitness function is defined as maximization of error reduction and a constraint of variance inflation factor (VIF), which is one of the generally used methods to measure multicollinearity, is added to insure the diversity of classifiers by removing high correlation among the classifiers. We use Microsoft Excel and the GAs software package called Evolver. Experiments on company failure prediction have shown that CO-NN is effectively applied in the stable performance enhancement of NNensembles through the choice of classifiers by considering the correlations of the ensemble. The classifiers which have the potential multicollinearity problem are removed by the coverage optimization process of CO-NN and thereby CO-NN has shown higher performance than a single NN classifier and NN ensemble at 1% significance level, and DT ensemble at 5% significance level. However, there remain further research issues. First, decision optimization process to find optimal combination function should be considered in further research. Secondly, various learning strategies to deal with data noise should be introduced in more advanced further researches in the future.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.