• Computers and Concrete
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• v.21 no.3
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• pp.311-319
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• 2018

This study used a volumetric method for design. The control group used waste Liquid Crystal Displayplay (LCD) glass powder to replace cement (0%, 10%, 20%, 30%), and the PZT group used Pd-Zr-Ti piezoelectric (PZT) powder to replace 5% of the fine aggregate to make cement mortar. The engineering and the mechanical and electricity properties were tested; flow, compressive strength, ultrasonic pulse velocity (UPV), water absorption and resistivity (SSD and OD electricity at 50 V and 100 V) were determined; and the correlations were determined by linear regression. The compressive strength of the control group (29.5-31.8 MPa) was higher than that of the PZT group (25.1-29 MPa) by 2.8-4.4 MPa at the curing age of 28 days. A 20% waste LCD glass powder replacement (31.8 MPa) can fill up finer pores and accelerate hydration. The control group had a higher 50 V-SSD resistivity ($1870-3244{\Omega}.cm$), and the PZT group had a lower resistivity ($1419-3013{\Omega}.cm$), meaning that the resistivity increases with the replacement of waste LCD glass powder. This is because the waste LCD glass powder contains 62% $SiO_2$, which is a low dielectric material that is an insulator. Therefore, the resistivity increases with the $SiO_2$ content.

• Korean Journal of Materials Research
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• v.5 no.2
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• pp.151-156
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• 1995

Low temperature firing $(Ba, Sr)TiO_{3}$ dielectrics were successfully prepared with lead based glass and those electrical properties were investigated. Different amount of PbO content glass materials were added to dielectrics to investigate the sinterability and its dielectric properties. Also, various compositions of ceramic capacitors were prepared to applicate in multilayer ceramic capacitors. A large amount of experiment has been done with various Pb contented glasses and different sintering temperatures. The sintering temperature of $(Ba,Sr)TiO_{3}$can be reduced from $1350^{\circ}C$to as low as $1050^{\circ}C$ with 4wt% addition of $PbO-ZnO-B_{2}O_{2}$ glass materials. Its dielectric constant at room temperature was up to 8100 with low dielectric loss, 0.005. This ceramic capacitor showed fully fired microstructures with its grain size of 1-3$\mu \textrm{m}$. The sintered body which was sintered at $1150^{\circ}C$ for 2hr with 4wt% $PbO-ZnO-B_{2}O_{2}$ glass material addition satisfied the Z5U specification of the EIAS.

• Applied Chemistry for Engineering
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• v.29 no.2
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• pp.196-200
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• 2018

In this study, the intermediate layer in Pd-based hydrogen separation membrane was synthesized to minimize the surface roughness and defects using powder-type and sol-type metal oxides. The surface properties and gas permeation characteristics were analysed by SEM and $N_2$ gas permeation test. The coating layer composed of sol type metal oxides has smooth surface, especially the layer coated by $TiO_2$ sol has little pin holes, cracks and defects. The binary layer composed of powder type and sol type metal oxides has similar flux characteristics to a single sol type layer. The Pd-based composite membrane improved by the binary intermediate layer exhibited $0.32mol/m^2s$ of the hydrogen permeation flux with a selectivity ($H_2/N_2$) of ~10,890 at 672 K and a pressure difference of 1 bar.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04b
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• pp.80-83
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• 2000

The post-annealing treatments on rf magnetron sputtered PZT($Pb_{1.05}(Zr_{0.52},\;Ti_{0.48})O_3$) thin films($4000{\AA}$) have been investigated for a structure of PZT/Pt/Ti/Coming glass(1737). Crystallization properties of PZT films were strongly dependent on RTA(Rapid Thermal Annealing) annealing temperature and time. We were able to obtain a perovskite structure of PZT at $650^{\circ}C$ and 10min. P-E curves of Pd/PZT/Pt capacitor demonstrate typical hysteresis loops. The measured values of $P_r$, $E_c$ were $8.1[{\mu}C/cm^2]$, 95[kV/cm] respectively. Polarization value decrease about 25% after $10^9$ cycles.

• Applied Chemistry for Engineering
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• v.25 no.3
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• pp.300-306
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• 2014

In this study, we investigated the noble metal catalysts for HCHO removal at room temperature. These catalysts were characterized by XRD, FT-IR, CO-chemisorption. As a result, Pt and Pd based catalysts prepared by the reduction treatment showed the superior HCHO oxidation ability at room temperature. When the catalysts were prepared using $TiO_2$ support, which is well known as the reducing support, showed the superior activity. Also, the activity decreased by the agglomeration of active metal with increasing the reduction time. In case of reduction catalysts, it has been confirmed that the desorption and adsorption ability properties of HCHO is excellent at room temperature.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.263-267
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• 2004

This study presents the combined effect of electric field application and mechanical compressive stress loading on deformation in a multilayer ceramic actuator, designed with stacking 0.2($PbMn_{1/3}Nb_{2/3}O_{3}$)-0.8($PbZr_{0.475}Ti_{0.525}O_{3}$) ceramics and Ag-Pd electrode, alternately. The deformation behaviors were attributed to relative $180^{\circ}$domain, determined by pre-loaded compressive stress and electric field. The non-linearity of piezoelectricity and strain are dependent upon the young's modulus resulting from the domain reorientation.

• Journal of the Korean Ceramic Society
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• v.47 no.1
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• pp.92-96
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• 2010

Based on the differential electrode equilibria approach, potentiometric YSZ sensors with semiconducting oxide electrodes for CO detection are developed. To improve the selectivity, sensitivity and response-time of the sensor, our strategy includes (a) selection of an oxide with a semiconducting response to CO, (b) addition of other semiconducting materials, (c) addition of a catalyst (Pd), (d) utilization of combined p- and n-type electrodes in one sensor configuration, and (e) optimization of operating temperatures. Excellent sensing performance is obtained by a novel device structure incorporating $La_2CuO_4$ electrodes on one side and $TiO_2$-based electrodes on opposite substrate faces with Pt contacts. The resulting response produces additive effects for the individual $La_2CuO_4$ and $TiO_2$-based electrodes voltages, thereby realizing an even higher CO sensitivity. The device also is highly selective to CO versus NO with minor sensitivity for NO concentration, compared to a notably large CO sensitivity.

• Journal of the Korean institute of surface engineering
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• v.47 no.2
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• pp.68-74
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• 2014

The seed step-coverage enhancement process (SSEP) using Pd/Cu/PVP colloids was investigated for the filling of through silicon via (TSV) without void. TEM analysis showed that the Pd/Cu nano-particles were well dispersed in aqueous solution with the average diameter of 6.18 nm. This Pd/Cu nano-particles were uniformly deposited on the substrate of Si/$SiO_2$/Ti wafer using electrophoresis with the high frequency Alternating Current (AC). After electroless Cu deposition on the substrate treated with Pd/Cu/PVP colloids, the adhesive property between deposited Cu layer and substrate was evaluated. The Cu deposit obtained by SSEP with Pd/Cu/PVP colloids showed superior adhesion property to that on Pd ion catalyst-treated substrate. Finally, by implementing the SSEP using Pd/Cu/PVP colloids, we achieved 700% improvement of step coverage of Cu seed layer compared to PVD process, resulting in void-free filling in high aspect ratio TSV.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.530-538
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• 2016

There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina ($Al_2O_3$), aluminium nitride (AlN), and silicon nitride ($Si_3N_4$). In this study, the plating of metal layers on an insulating silicon nitride ($Si_3N_4$) ceramic substrate was developed. We formed a Pd-$TiO_2$ adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating $Si_3N_4$ substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the $TiO_2$ layer. The electrical resistivity of Ni and Cu layers is $7.27{\times}10^{-5}$ and $1.32{\times}10^{-6}ohm-cm$ by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.40.2-40.2
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• 2007