• Title/Summary/Keyword: Packing Time

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Nesting Problem for Two Dimensional Irregular Shapes using Heuristic (휴리스틱을 이용한 2차원 임의형상 부재 배치 문제)

  • Jeong, Sung-Kyo;Jeon, Geon-Wook
    • IE interfaces
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    • v.21 no.1
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    • pp.8-17
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    • 2008
  • A new search procedure, VLT(Vertex Line Tracing) heuristic, for two dimensional irregular shapes nesting problem was suggested in this study. The VLT heuristic was suggested to the nesting problem to overcome disadvantages of the existing NFP(No-Fit-Polygon) method. This VLT heuristic was compared with the results of the existing benchmark problems suggested by Albano, Hopper, and Burke. The results of the VLT heuristic give efficient solutions in the point of the scrap ratio and computation time. A computer program, NestLogic, using C++ for VLT heuristic was also developed for this nesting problem.

A Study Birefringence of Injection Molding for Plastics Aspheric Lens (플라스틱 비구면 사출렌즈의 복굴절에 관한 연구)

  • Jun, Yoo-Tae;Hyun, Dong-Hoon
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.15 no.1
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    • pp.108-112
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    • 2006
  • A Study of birefringence in an aspheric lens of injection molding became more important to improve its optical properties. In the present study, the experimental study was carried out to investigate the relationship between birefringence and injection molded conditions. The processing factors are conditions include packing pressure, packing time, injection speed, melt temperature of optical resin and wall temperature. Birefringence was observed figures by using a polarizer in light. This experiments were carried out using the simulation software and injection molding machine.

사출성형의 보압과정에 관한 연구

  • 이호상;전형환;한진현;설권;한창훈
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.10a
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    • pp.46-50
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    • 2001
  • Due to its ability in producing a net-shape product to high precision in a very shot cycle time, injection molding has become one of the most important polymer-processings in the industry today. Recently the CAE applications in the field of injection molding have provided significant contributions to the mold design and process optimization. As a part of such an application the packing process has been studied using C-PARK. The prediction of pressure variations during post-filling stage for amorphous material has been compared with an experimental observation for a simple rectangular geometry of uniform thickness. And the optimal packing processes were calculated using the cavity pressure curve near the gate. As a case study, a warpage simulation was carried out for a DY-HOLDER with the variable number of gates.

A Heuristic Algorithm for Minimizing Maintenance Workforce Level (정비작업 인력 수준 최소화를 위한 발견적 기법)

  • Chang, Soo-Y.;Hong, Yu-Shin;Kim, Jung-Hoe;Kim, Se-Rae
    • Journal of Korean Institute of Industrial Engineers
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    • v.25 no.1
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    • pp.47-55
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    • 1999
  • This paper develops an efficient heuristic algorithm for scheduling workforce level that can accommodate all the requested maintenance jobs. Each job has its own release and due dates as well as man-day requirement, and must be scheduled in a non-interrupted time interval, namely, without preemption. Duration of each job is not fixed, but to be determined within given specific range. The objective is to minimize workforce level to complete all the requested maintenance jobs. We show that the problem can be seen as a variant of the two-dimensional bin-packing problem with some additional constraints. A non-linear mixed integer programming model for the problem is developed, and an efficient heuristic algorithm based on bin-packing algorithms is proposed. In order to evaluate goodness of the solution obtained from the proposed algorithm, a scheme for getting a good lower bound for the optimum solution is presented and analyzed. The computational experiment shows that the proposed algorithm performs quite satisfactorily.

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Column Generation Approach to the Steiner Tree Packing Problem (열 생성 기법을 이용한 스타이너 나무 분할 문제에 관한 연구)

  • 정규웅;이경식;박성수;박경철
    • Journal of the Korean Operations Research and Management Science Society
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    • v.25 no.3
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    • pp.17-33
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    • 2000
  • We consider the Steiner tree packing problem. For a given undirected graph G =(V, E) with positive integer capacities and non-negative weights on its edges, and a list of node sets(nets), the problem is to find a connection of nets which satisfies the edge capacity limits and minimizes the total weights. We focus on the switchbox routing problem in knock-knee model and formulate this problem as an integer programming using Steiner tree variables. The model contains exponential number of variables, but the problem can be solved using a polynomial time column generation procedure. We test the algorithm on some standard test instances and compare the performances with the results using cutting plane approach. Computational results show that our algorithm is competitive to the cutting plane algorithm presented by Grotschel et al. and can be used to solve practically sized problems.

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Origin of Green Emission in Extremely Pure Oligofluorene Films: Effect of Molecular Packing

  • Kang, Ji-Hoon;Shin, Na-Yool;Jo Jung-Ho;Keivanidis Panagiotis E.;Laquai Frederic;Wegner Gerhard;Yoon, Do-Y.
    • Proceedings of the Polymer Society of Korea Conference
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    • 2006.10a
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    • pp.236-236
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    • 2006
  • Time-resolved photoluminescence spectroscopy measurements of oligofluorenes with various side chains were studied. With extremely pure oligofluorenes, two kinds of red-shifted green emission were observed which have different origins; aggregate formation and on-chain chemical defect. The green emission around 490 nm was largely dependent upon the intermolecular interaction of oliglfuorene molecules. Moreover, by using oligofluorene with high-order liquid crystalline phase, we observed that the green emission was strongly dependent upon the molecular packing in solid films.

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The Stability and Indium Diffusion from ITO to PPV Layer of Polymer Light Emitting Devices with/without PI Blocking Layer

  • Seongjin Cho;Park, Dongkyu;Taewoo Kwon;Dongsun Yoo;Kim, Ilgon
    • Journal of Korean Vacuum Science & Technology
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    • v.6 no.1
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    • pp.51-54
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    • 2002
  • Polymer EL devices of glass/ITO/PI/MEH-PPV/Al structure were fabricated using spin coating and the Ionized Cluster Beam deposition technique. PMDA-ODA type thin polyimide films which can be used as a impurity blocking layer of EL device were deposited by ICB. According to our previous results, the packing densities of polyimide films were subject to change and depend on their deposition condition. By inserting a Pl layer with various thickness and packing density, I-V characteristics and life time of the devices were investigated to determine the role of a interlayer. The blocking of impurity diffusion from ITO to luminescent layer were confirmed by XPS.

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A Technology Mapping Algorithm for Lookup Table-based FPGAs Using the Gate Decomposition (게이트 분할을 고려한 Lookup Table 방식의 기술 매칭 알고리듬)

  • 이재흥;정정화
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.2
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    • pp.125-134
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    • 1994
  • This paper proposes a new top-down technology mapping algorithm for minimizing the chip area and the path delay time of lookup table-based field programmable gate array(FPGA). First, we present the decomposition and factoring algorithm using common subexpre ssion which minimizes the number of basic logic blocks and levels instead of the number of literals. Secondly, we propose a cube packing algorithm considering the decomposition of gates which exceed m-input lookup table. Previous approaches perform the cube packing and the gate decomposition independently, and it causes to increase the number of basic logic blocks. Lastly, the efficiency.

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CAE Analysis and Optimization of Injection Molding for a Mobile Phone Cover (휴대폰 커버 사출성형의 CAE 해석 및 최적화)

  • Park, Ki-Yoon;Kim, Hyeon-Seong;Kang, Jin-Hyun;Park, Jong-Cheon
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.2
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    • pp.60-65
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    • 2012
  • This paper deals with an CAE analysis and optimization of injection molding for a mobile phone cover. Two design goals are established in the optimization; one is to switch over the feed system from cold runner to hot runner for the purpose of reducing material costs, and the other is to minimize the warpage in order to improve product quality. By the full-factorial experiments for design parameters, we showed that the cold runner design could be changed to the hot runner design by replacing the current resin with a new resin of higher fluidity. In addition, we could significantly reduce the warpage of the cover product under the hot runner system by optimizing packing pressure and packing time.

Effect of Organic Additive Composition on Isostatic Thermocompression Behavior of Alumina Tapes (유기물 조성에 따른 알루미나 테이프의 열간 가압 거동)

  • 이명현;박일석;김대준;이득용
    • Journal of the Korean Ceramic Society
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    • v.37 no.8
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    • pp.824-831
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    • 2000
  • Alumina tapes, having various ratios of alumina to alumina+binder+plasticizer (a/(a+o)) and binder to binder+plasticizer(b/(b+p)), were prepared by the tape casting method. The tapes were thermocompressed varying the thermocompression parameters such as temperature, pressure, and duration time. Among the parameters, the pressure was the most influential to the tape packing density. The packing density varied in two different ways depending on the a/(a+o) ratio. For the tapes having low a/(a+o) ratio, a saturation density was reached by applying very a low pressure of 1 MPa. For tapes with high a/(a+o), on the contrary, the saturation density was obtained at a relatively high pressure. These different responses to the pressure are attributed to the fact that the rearrangement of alumina particles by the pressure becomes easy as an organic content in the tapes is high.

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