Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
권호 표지

CAE Analysis and Optimization of Injection Molding for a Mobile Phone Cover

휴대폰 커버 사출성형의 CAE 해석 및 최적화

  • 박기윤 (ED&C, LTD. 기술지원부) ;
  • 김현성 (금오공과대학교 기계공학부) ;
  • 강진현 (금오공과대학교 기계공학부) ;
  • 박종천 (금오공과대학교 기계공학부)
  • Published : 2012.04.30
⟨ Previous Next ⟩

Abstract

This paper deals with an CAE analysis and optimization of injection molding for a mobile phone cover. Two design goals are established in the optimization; one is to switch over the feed system from cold runner to hot runner for the purpose of reducing material costs, and the other is to minimize the warpage in order to improve product quality. By the full-factorial experiments for design parameters, we showed that the cold runner design could be changed to the hot runner design by replacing the current resin with a new resin of higher fluidity. In addition, we could significantly reduce the warpage of the cover product under the hot runner system by optimizing packing pressure and packing time.

Keywords

References

  1. Yao, D., "Direct Search-Based Automatic Mini- mization of Warpage and Weldlines in Injection Molded Parts, Masters Thesis", University of Massachusetts, MA., pp. 1-88, 1998.
  2. Jacques, M. S., "An Analysis of Thermal Warpage in Injection Molded Flat parts Due to Unbalanced Cooling", Polymer Engineering and Science, Vol. 22, No. 4, pp. 241-247, 1982.
  3. Lee, B. H. and Kim, B. H., "Variation of Part Wall Thicknesses to Reduce Warpage of Injection Molded Part-Robust Design Against Process Variability", Polym.-Plast. Tech. Eng., Vol. 36, No. 5, pp. 791-807, 1997.
  4. Chen, R. S., Lee, H. H. and Yu, C. Y., "Application of Taguchi's method on the optimal process design of an injection molded PC/PBT automobile bumper", Composite Structures, Vol. 39, Nos. 3-4, pp. 209-214, 1997.
  5. Liao, S. J., Chang, D. Y., Chen, H. J., Tsou, L. S., Ho, J. R., Yau, H. T. and Hsieh, W. H., "Optimal process conditions of shrinkage and warpage of thin-wall parts", Polymer Engineering and Science, Vol. 44, No. 5, pp. 917-928, 2004.
  6. 권오관, 박종천, 김경모, "강건성을 고려한 모니터 장식패널 사출품의 휨 최소화", 한국 CAD/CAM학회 논문집, 제9권, 제4호, pp. 351-360, 2004.
  7. ED&C, "Autodesk Moldflow Insight : The 4th edition of AMI Korean Manual", 2009.
  8. Park, S. H., Robust design and analysis for quality engineering, Chapman and Hall, pp. 46-49, 1996.
  9. 권태헌 외 4인 공역, "사출성형 CAE 설계지침", 문운당, pp. 206-208, 2001.
  10. Fowlkes, W. Y. and Creveling, C. M., "Engineering Methods for Robust Product Design, Addison-Wesley Publishing Company", New York, pp. 129-130, 1995.
  11. Shoemaker, J., "Moldflow Design Guide", Hanser Publishers, Munich, p. 189, 2006.