• 한국통신학회논문지
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• 제35권1B호
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• pp.62-67
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• 2010

본 연구는 다양한 산업 환경에 적용되는 RFID 태그 개발에 있어 RFID 태그 패키징 개발과 RFID 태그 플립칩(flip chip) 접합 방법이 산업 환경 맞춤형 RFID 태그 개발에 미치는 영향에 대해 분석하였다. RFID 태그 플립칩(flip chip) 접합은 와이어 접합(wire bonding), 초음파 접합(ultrasonic bonding), 열융착 접합(heat plate bonding), 레이저 접합(laser bonding)으로 구분되어 있으며, 이런 접합 방법은 다양한 RFID 태그 개발의 적용 환경에 따라 적합한 접합 방법이 있음을 본 연구를 통해서 알 수 있었다. 극고온, 극저온, 다습, 고내구성 등 다양한 산업 환경 중 극고온 환경에서의 RFID 태그 개발은 빛 에너지를 흡수하여 열 에너지로 전환하는 레이저 접합 방법과 직접적인 열 전달 방식인 열융착 접합 방법은 접속 재료인 ACF의 손상으로 인해 부적합하고, 와이어를 이용하여 직접 범프와 패턴을 연결하는 와이어 접합 방법이 적합함을 알 수 있었다.

• 청정기술
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• 제23권3호
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• pp.325-330
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• 2017

This study presents the preparation of n-tetradecane-in-water emulsions with different weight ratios of n-tetradecane and water, and their potential application in packaging and shipping vaccines. The size and distribution of the n-tetradecane droplets are characterized using optical microscopy and light scattering methods, respectively. The thermal properties of the emulsions are determined using the T-history method. In the results, the emulsions, which are comprised of 17 ~ 30 wt% oil, 3 wt% surfactant, and 67 ~ 80 wt% water, are stable and have droplet sizes in the range of 100 to 800 nm. The thermal properties demonstrate that subcooling is prevented through increasing the droplet size. The results indicate that the n-tetradecane/water emulsions containing 25 ~ 35 wt% n-tetradecane, with a melting point of $2{\sim}8^{\circ}C$ and a latent heat of $227.0{\sim}250.8kJ\;kg^{-1}$, are good candidate materials for packaging and shipping vaccines.

• 펄프종이기술
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• 제39권5호
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• pp.45-51
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• 2007

This study was carried out to investigate various heavy metal contents in packaging papers by pre-treatments for ICP-ES (Inductively Coupled Plasma Emission Spectrometry) analysis. Pre-treatment methods of heavy metals in this study include extraction, migration and decomposition methods (dry ashing, $HNO_3-HClO_4-HF,\;HNO_3,\;and\;H_2SO_4-HNO_3$). Test results were compared with conventional extraction (water) and migration (3% acetic acid) methods. The five representative heavy metals (Cd, As, Pb, Cr and Hg) were analyzed. For Cd, Hg, and As, the results were below detection limit of the instrumental technique. It was considered that the migration test was a better method compared to extraction test, but all the decomposition methods showed much higher detection values than the extraction or migration test. In case of recycled corrugated containers, 3% acetic acid solution extracted about 25% of chromium and 30% of lead compared to the content by decomposition methods. Among all decomposition methods, the nitric acid - perchloric acid - hydrofluoric acid treatment brought a slightly higher detection value than others, but there was no significant difference among them except sulfuric acid - nitric acid method.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.338-339
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• 2008

현재 PCB (Printed circuit board) 산업은 디스플레이, 모바일 시장의 수요 증가로 인해 활성화 되면서 다앙한 분야로 확대 되어가고 있다. 전자기기의 직접화, 고속파, 사용 주파수 영역의 증가로 인해 수십 GHz 영역에서도 활용이 가능한 소재 및 기판의 필요성이 대두되어 지고 있어 이에 대응할 수 있는 소재 개발도 다양해지고 있다. 본 논문에서는 GHz 영역에서 인쇄회로기판의 회로형태가 특성에 미치는 영향에 대해 연구하였다. 이를위해 패턴도금법과 에칭법으로 회로를 형성하였다. 패턴도금법으로 형성된 시편은 무전해 구리도금 공정을 거친 후 감광성 필름을 이용하여 전해 도금방법을 패턴을 형성하여 회로를 구현하였고, 에칭 패턴 시편은 FR4를 이용하여 동박접합과 도금 공정 후 마스크 패턴을 사용하여 노광, 현상, 에칭 공정을 거쳐 회로를 구성하였다. GHz영역에서 Transmission Line 특성을 분석하였으며 구리 패턴과 절연체사이의 계면형태가 특성에 영향을 주는 것을 확인할 수 있었다.

• 한국포장학회지
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• 제27권3호
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• pp.175-180
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• 2021

Although it has recently been regulated for use as an eco-friendly policy in Korea, the use of EPS (Expanded Polystyrene) cooling boxes, which are used as cold chain delivery insulation boxes for fresh agricultural and livestock products, is also increasing rapidly as e-commerce logistics such as delivery have increased rapidly due to COVID-19. Studies were conducted to optimize the EPS cooling container through internal air heat flow of CFD (Computational Fluid Dynamics) analysis and FEM (Finite Element Method) random vibration analysis using domestic PSD (Power Spectral Density) profile of the EPS cooling box to which the refrigerant is applied in this study. In the analysis of the internal air heat flow by the refrigerant in the EPS cooling box, the application of vertical protrusions inside was excellent in volume heat flow and internal air temperature distribution. In addition, as a result of random vibration analysis, the internal vertical protrusion gives the rigid effect of the cooling box, so that displacement and stress generation due to vibration during transport are smaller than that of a general cooling container without protrusion. By utilizing the resonance point (frequency) of the EPS cooling box derived by the Model analysis of ANSYS Software, it can be applied to the insulation and cushion packaging design of the EPS product line, which is widely used as insulation and cushion materials.

• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.1-5
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• 2015

In high temperature aircraft electronics, aluminium based brazing filler is the prime choice today. Aluminium and its alloys have compatible properties like weight minimization, thermal conductivity, heat dissipation, high temperature precipitation hardening etc. suitable for the aerospace industry. However, the selection of brazing filler for high temperature electronics requires high temperature joint strength properties which is crucial for the aerospace. Thus the selection of proper brazing alloy material, the composition and brazing method play an important role in deciding the final reliability of aircraft electronic components. The composition of these aluminium alloys dependent on the addition of the various elements in the aluminium matrix. The complex shapes of aluminium structures like enclosures, heat dissipaters, chassis for electronic circuitry, in avionics are designed from numerous individual components and joined thereafter. In various aircraft applications, the poor strength caused by the casting and shrinkage defects is undesirable. In this report the effect of various additional elements on Al based alloys and brazing fillers have been discussed.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• 한국식품영양과학회지
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• 제25권6호
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• pp.1087-1093
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• 1996

국내 및 해외에서의 멸치액젓 관련 제품의 가공공정과 포장에 대하여 살펴 본 후 멸치액젓의 표준화된 가공과 품질관리를 위해 새로운 가공공정 및 포장방법을 제시하였다. 제시된 방법에서는 원료 멸치를 소금과 혼합한 다음(염도 20%), 온도조절된 상태에서 발효숙성시키고, 여과 혹은 원심분리, 여과잔사를 염수첨가 후 2차 발효시켜서 재여과하여 1차 여과액과 혼합시키고, 용기에 포장하고 저온에서 살균하는 과정에 의해 구성되도록 설계되었다. 여과잔사 폐기물의 처리 문제도 함께 고려하였다.

• 청정기술
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• 제22권1호
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• pp.45-52
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• 2016

This study reports on the modeling and simulation of heat transfer in packaging boxes used for vaccine shipping. Both water and n-tetradecane are used as primary insulation materials inside a multi-slab system. The one-dimensional model, which is a spherical model using a radius equivalent to the rectangular geometry of container, is applied in this study. N-tetradecane with low thermal diffusivity and proper phase transition temperature exhibits higher heat transfer resistance during both heating and cooling processes compared to water. Thus, n-tetradecane is a better candidate as an insulating material for packaging containers for vaccine shipping. Furthermore, the developed method can also become a rapid and economic tool for screening appropriate phase change materials used as insulation materials with suitable properties in logistics applications.

• Journal of Welding and Joining
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• 제31권3호
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• pp.11-16
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• 2013

Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.