• Design Convergence Study
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• v.16 no.4
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• pp.81-98
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• 2017

This study starts from the judgment that the evaluation about preserved flower package design has to be performed based on the product attribute. The principles and components of package design are reestablished from preceding researches, the product type model is suggested based on the product attribute. The 6 principles of package design are usability, esthetic element, attracting attention, creativity, identity and implication, and the 5 components of package design are form, material, color, graphics and branding factors. The product types are classified into 4 areas following the 2 axises. The 1 axis means the degree of perception risk on acquiring information and the other means the approaching type to expected effects about products. The characteristics of package design components are analyzed from the cases belonged at each area on the product type model. Based on the this model, the strategy of preserved flower package design is drawn. At last the package of 'Preserville' is analyzed, we find out the critical points and suggest the intention point in planning the preserved flower package.

• Proceedings of the KSRS Conference
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• 2002.10a
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• pp.49-52
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• 2002

High-resolution satellite image processing software should be able to ensure accurate, fast, compact data processing in offline or online environment. In this paper, component software for high-resolution satellite image processing is developed using OpenGIS components and real-time data processing architecture. The developed component software is composed of three major packages, which are data provide package, user interface package, and fast data processing package. The data provider package encodes and decodes diverse image/vector data formats and give identical data access methods to developers. The user interface package supports menus, toolbars, dialogs, and events to use easier. The fast data processing package follows the OpenGIS's data processing standards, which can deal with several processors as components with standard procedural functionalities.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.23 no.3
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• pp.173-181
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• 2017

This study was conducted to investigate the packaging characteristics including pack sources and pack components of processed foods in Korea. For the survey, 704 food package samples were selected based on the consumption of top 10 brackets in each food item. They were consisted of 1,245 packaging components. Seven specific items were firstly investigated including product name, capacity of the food, package component, package source, food contact area, food contact ratio, and package thickness. The processed foods in Korea can be classified into 16 pack sources and 21 pack components, respectively. By using this information, the data were analyzed specifically. The collected data were analyzed in 8 major categories: frequency of use by pack components and pack sources, pack components by the products, pack sources by the products and pack components, pack thickness/food contact ratio by the products, food contact ratio by pack components and pack sources. Consequently, this survey will provide various information of the packaging characteristics of processed foods in Korea.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.12a
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• The Journal of Korean Institute of Communications and Information Sciences
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• v.31 no.12C
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• pp.1157-1164
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• 2006

In this paper, we proposed a method for measuring accurate positions and sizes of package and balls in a micro BGA. To find defects of BGA accurately, we focused on finding positions of package and balls. After labeling, we detected connected components of package and balls using feature parameters. After the detection of package component, we measured position and size of package by employing rectangular model which was constructed by the package information. After the detection of the ball components, we measured positions and diameters of balls by employing circular models which were constructed by the ball informations. We did calibration based on landmarks to measure real length, and we compared the measured results with the SEM data. Finally, we found that the accuracy of the proposed method is 94% in terms of ball's radius.

• ETRI Journal
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• v.39 no.6
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• pp.866-873
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• 2017

We propose a multilayered-substrate-based power semiconductor discrete device package for a low switching loss and high heat dissipation. To verify the proposed package, cost-effective, low-temperature co-fired ceramic, multilayered substrates are used. A bare die is attached to an embedded cavity of the multilayered substrate. Because the height of the pad on the top plane of the die and the signal line on the substrate are the same, the length of the bond wires can be shortened. A large number of thermal vias with a high thermal conductivity are embedded in the multilayered substrate to increase the heat dissipation rate of the package. The packaged silicon carbide Schottky barrier diode satisfies the reliability testing of a high-temperature storage life and temperature humidity bias. At $175^{\circ}C$, the forward current is 7 A at a forward voltage of 1.13 V, and the reverse leakage current is below 100 lA up to a reverse voltage of 980 V. The measured maximum reverse current ($I_{RM}$), reverse recovery time ($T_{rr}$), and reverse recovery charge ($Q_{rr}$) are 2.4 A, 16.6 ns, and 19.92 nC, respectively, at a reverse voltage of 300 V and di/dt equal to $300A/{\mu}s$.

• Journal of Distribution Science
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• v.12 no.12
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• pp.27-41
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• 2014

Purpose - This study examines various reservation service components that would increase customers' brand attachment and loyalty, while discussing how reservation service components would affect the customer behaviors. Research design, data, and methodology - This study theoretically analyzed the hotel package product reservation system, the customer expectations, the brand attachment, and the brand loyalty, while reviewing previous studies. Results - This study analyzed the distribution channels of the hotel package products from various angles and, as for more extensive research, the study explained the different results caused by each different reservation system type that may be preferred by each individual customer. Conclusions - It was confirmed that, of the hotel reservation service components, the convenience factors, the reliability factors, the information factors, and the other factors other than the human factors, have a significant influence on the customer expectations. Further, the study also revealed that the customer expectation has an important effect on the brand attachment. In addition, the study improved the prevailing understanding on the relation between the brand attachment and the brand loyalty.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.768-771
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• 2003

Nowadays, the study on the ceramic components and modules used in telecommunication system is being performed. Duplexer is the one of the most important components and has the role of dividing Rx and Tx signal. Duplexer including the FBAR is being done vigorously LTCC is used for package like SAW package, duplexer package. In our research, LTCC material is used for FBAR duplexer package and photo-lithography for the fine line phase shifter. The good characteristics, low loss and good isolation, of duplexer is obtained by the fine line phase shifter having high characteristic impedance of stripline.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.10
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.27-34
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• 2015

The correlation between crack propagation and localized recrystallization are compared in a series of cross section analyses on thermal cycled edgebond and underfilm material applied wafer level chip scale package (WLCSP) components with a baseline of no-material applied WLCSP components. The results show that the crack propagation distribution and recrystallization region correlation can explain potential degradation mechanisms and support the damage accumulation history in a more efficient way. Edgebond material applied components show a shift of damage accumulation to a more localized region, thus potentially accelerated the degradation during thermal cycling. Underfilm material applied components triggered more solder joints for a more wider distribution of damage accumulation resulting in a slightly improved thermal cycling performance compared to no-material applied components. Using an analysis on localized distribution of recrystallized areas inside the solder joint showed potential value as a new analytical approach.