• 한국전기전자재료학회논문지
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• 제27권11호
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• pp.746-752
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• 2014

Photo electrode is an important component of DSSC, so this paper did some research on it. Through the method of adding PEG additive into $TiO_2$ paste, the electrical characteristics and efficiencies of DSSCs with photo electrode surface area were studied. In the case of not adding PEG in $TiO_2$ paste, $26{\mu}m$ thickness $TiO_2$ photo electrode shows 5.081% efficiency. The highest short circuit current density was $10.476mA/cm2^$. The structure of porous $TiO_2$ film can be controlled through changing the PEG additive amount in $TiO_2$ paste and the molecular weight of PEG. When the additive amount of PEG 20,000 in $TiO_2$ paste reaches 5%, the peak efficiency with $26{\mu}m$ thickness $TiO_2$ photo electrode was 5.387% and its highest current density were $11.084mA/cm^2$.

• 한국전기전자재료학회논문지
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• 제16권12호
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• pp.1125-1130
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• 2003

The electrophoretic deposition method using the suspension solution with additives under the electric potential was applied for the fabrication of YBCO superconductor wire. This method was able to simplify the fabrication facilities, and produce an uniform and dense thick film. To improve the critical current density of deposited films, the additive PEGs(Poly Ethylene Glycole) with the molecular weight of 600, 1000 and 3400 were used as chemical binders for the suspension solution. The organic additive (PEG) showed better effects to the properties of YBCO superconductor wire. The PEG improved the adhesion between superconductor particles and suppressed the crack on the surface, which enhanced the surface uniformity and density of YBCO deposited film. It was found that acetone suspension solution showed better deposition properties than the others. The samples fabricated in the solution with the additive, 8 vol.% of 1% PEG(1000), showed the highest critical current density measured as 2300∼2400 A/$\textrm{cm}^2$ at 77 K, 0 T.

• Membrane and Water Treatment
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• 제6권5호
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• pp.379-392
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• 2015

Polyvinyl chloride (PVC) ultrafiltration membrane was prepared by blending 12 wt.% of PVC in N, N-dimethylacetimide (DMAc) with polyethylene glycol 400 (PEG400) as an additive. The influence of PEG400 concentration on the PVC membrane morphology, permeability, fouling and rejection were investigated. Fouling and rejection of the PVC membrane were characterized by dextran T-100 filtration. The results showed that membrane water flux was increased up to $682Lm^{-2}h^{-1}$ when 28 wt.% of PEG400 was added into the PVC membrane solution. The best membrane performance with a low fouling and a high selectivity was achieved by adding 12 wt.% concentration of PEG400, which resulted in 90% rejection of dextran and 90% of flux recovery ratio. At further addition of PEG400 concentration, irreversible fouling was starting to increase. A 90% of irreversible fouling was formed in the PVC membrane when more than 22 wt.% of PEG400 is added.

• 멤브레인
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• 제22권4호
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• pp.258-264
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• 2012

본 연구에서는 응고조와 도프조성에 따른 투과특성을 알아보기 위해 첨가제로 PEG, PVP를 사용하였고, 상전이법을 이용하여 PSf 평막을 제조하였다. 고분자의 농도, 첨가제의 농도 그리고 응고조의 조성을 달리하여 제막하였다. 평막의 모폴로지와 수투과도를 각각 FE-SEM과 수투과 테스트 장치를 이용하여 측정하였다. 가장 높은 수투과도(986 L/mh)는 PSf 15 wt%, PEG 25 wt% 그리고 응고조로 물이 사용되었을 경우 나타났다. PSf/PEG조성일때 응고조에 DMAc의 함량이 증가할수록 순수투과도는 급격히 감소하였다. 그러한 결과 첨가제의 함량과 응고조의 조성의 변화가 모폴로지와 수투과 특성에 영향을 미치는 것을 확인하였다.

• 한국표면공학회지
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• 제57권4호
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• pp.274-284
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• 2024

In this study, copper foil was electroplated under high current density conditions. We used Polyethylene Glycol (PEG), known for its thermal stability and low decomposition rate, as an inhibitor to form a stable and smooth copper layer on the titanium cathode. The electrolyte was composed of 50 g/L CuSO₄ and 100 g/L H₂SO₄, MPSA as an accelerator, JGB as a leveler, and PEG as a suppressor, and HCl was added as chloride ions for improving plating efficiency. The copper foil electroplated in the electrolyte added PEG which induced to inhibit the growth of rough crystals. As a result, the surface roughness value was reduced, and a uniform surface was formed over a large area. Moreover, the addition of PEG led to priority growth to the (111) plane and the formation of polygonal crystals through horizontal and vertical growth of crystals onto the cathode. In addition, the grains became fine when more than 30 ppm of PEG was added. As the microcrystalline structure changed, mechanical and electrical properties were altered. With the addition of PEG, the tensile strength increased due to grain refinement, and the elongation was improved due to the uniform surface. However, as the amount of PEG added increased, the corrosion rate and resistivity increased due to grain refinement. Finally, it was possible to manufacture a copper foil with excellent electrical and mechanical properties and the best surface properties when electroplating was carried out under the condition of additives with Cl-20 ppm, MPSA 10 ppm, JGB 5 ppm, and PEG 10 ppm.

• 공업화학
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• 제34권3호
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• pp.285-290
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• 2023

폴리젖산(poly-lactic acid, PLA)은 옥수수 분말이나 sugar beets와 같은 천연 재료로부터 얻어지는 생분해성 및 생체적 합성을 가진 친환경적인 재료로 각광받고 있으며, 특히 적층가공에서 흔히 사용되는 석유로부터 추출된 ABS (acrylonitrile butadiene styrene)의 대체재로 주목받고 있다. 그러나, PLA의 유리 전이 온도는 60 ℃로 비교적 낮아 열 저항성이 떨어질 뿐만 아니라 PLA는 취성이 강해 충격이 가해졌을 때 부러지는 현상이 발생한다는 단점이 있다. 따라서 PLA의 결정화도 및 연성을 증가시켜 단점을 보완하기 위해 젖산에 조핵제 또는 가소제 등을 첨가하는 연구가 활발히 진행되어 왔다. PEG (polyethylene glycol)은 PLA 사슬에 유동성을 주기 위해 가장 많이 연구된 가소제이나, PLA와 혼화되었을 때 자체적인 결정화가 진행되어 상온에서도 혼화물이 불안정해지며 상분리가 일어나게 된다. 따라서 PLA-PEG의 최적의 혼화 비율을 찾는 것이 필수적이다. 이번 연구에서는 가소제인 PEG를 첨가하였을 때 예측되는 두 물질 간의 혼화도를 Materials Studio 프로그램의 Molecular Dynamics를 이용하여 분석하였다. 특히, 젖산과 PEG의 함량 변화에 따른 혼화도와 젖산의 거울상 이성질체인 L-lactic acid 및 D-lactic acid의 함량에 따른 혼화도를 거시적인 관점에서 예측하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.123-126
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• 2003

The electrophoretic deposition method using the suspension solution with additives under the electric potential was applied for the fabrication of YBCO superconductor wire. This method was able to simplify the fabrication facilities, and produce an uniform and dense thick film. To improve the critical current density of deposited films, the additive PEGs(Poly Ethylene Glycole) with the molecular weight of 600, 1000 and 3400, were used as chemical binders for the suspension solution. The organic additive PEG showed better effects to the properties of YBCO superconductor wire. The PEG improved the adhesion between superconductor particles and suppressed the crack on the surface, which enhanced the surface uniformity and density of YBCO deposited film. It was found that acetone suspension solution showed better deposition properties than the others. The samples fabricated in the solution with the additive, 8 vol.% of 1% PEG(1000), showed the highest critical current density measured as $2300{\sim}2400\;Acm^2$ at 77 K, 0 T.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 초전도 자성체
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• pp.37-40
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• 2002

Superconductor wire fabricated by electrophoresis showed its critical current density depended on parameters such as applied voltage and deposition time. Substrate and suspension solutions. and its properties are also important parameters. When same optimal parameter and condition was used, deposition density of superconductor film affect directly its critical current density. In this study, therefore, electrophoretic deposition technique was utilized for a densification of YBCO superconducting wire, and researches on electrophoretic suspension solutions and additive were experimentally performed for an improvement of the critical current density of fabricated electrophoretically superconducting wire. The samples fabricated in the solution with the additive, 8 vol.% of 1% PEG(1000), showed the highest critical current density.

• 한국환경보건학회지
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• 제31권4호
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• pp.241-245
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• 2005

Laccase catalyzes the oxidation and polymerization of aromatic compounds in the presence of molecular oxygen. Studies were conducted to characterize the use of polyethylene glycol (PEG) as an additive to keep up the enzymatic stability. The enzymatic activities highly remained and bisphenol A (BPA) was rapidly converted in the presence of 5 mg/l of PEC. These effects were accomplished with PEG of molecular weight 3,350. A linear relationship was found between the quantity of BPA to be converted $(10-120\;{\mu}M)$ and the optimum dose of PEC required for greater than $95\%$ conversion. This result suggests that it is the interaction between the PEG and the reaction products. In the optimum dose of PEG, the aeration of reaction mixture neither enhanced the conversion of BPA nor retarded the inactivation of the enzyme.

• 한국표면공학회지
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• 제46권4호
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.