• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.11
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• pp.746-752
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• 2014

Photo electrode is an important component of DSSC, so this paper did some research on it. Through the method of adding PEG additive into $TiO_2$ paste, the electrical characteristics and efficiencies of DSSCs with photo electrode surface area were studied. In the case of not adding PEG in $TiO_2$ paste, $26{\mu}m$ thickness $TiO_2$ photo electrode shows 5.081% efficiency. The highest short circuit current density was $10.476mA/cm2^$. The structure of porous $TiO_2$ film can be controlled through changing the PEG additive amount in $TiO_2$ paste and the molecular weight of PEG. When the additive amount of PEG 20,000 in $TiO_2$ paste reaches 5%, the peak efficiency with $26{\mu}m$ thickness $TiO_2$ photo electrode was 5.387% and its highest current density were $11.084mA/cm^2$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12
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• pp.1125-1130
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• 2003

The electrophoretic deposition method using the suspension solution with additives under the electric potential was applied for the fabrication of YBCO superconductor wire. This method was able to simplify the fabrication facilities, and produce an uniform and dense thick film. To improve the critical current density of deposited films, the additive PEGs(Poly Ethylene Glycole) with the molecular weight of 600, 1000 and 3400 were used as chemical binders for the suspension solution. The organic additive (PEG) showed better effects to the properties of YBCO superconductor wire. The PEG improved the adhesion between superconductor particles and suppressed the crack on the surface, which enhanced the surface uniformity and density of YBCO deposited film. It was found that acetone suspension solution showed better deposition properties than the others. The samples fabricated in the solution with the additive, 8 vol.% of 1% PEG(1000), showed the highest critical current density measured as 2300∼2400 A/$\textrm{cm}^2$ at 77 K, 0 T.

• Membrane and Water Treatment
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• v.6 no.5
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• pp.379-392
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• 2015

Polyvinyl chloride (PVC) ultrafiltration membrane was prepared by blending 12 wt.% of PVC in N, N-dimethylacetimide (DMAc) with polyethylene glycol 400 (PEG400) as an additive. The influence of PEG400 concentration on the PVC membrane morphology, permeability, fouling and rejection were investigated. Fouling and rejection of the PVC membrane were characterized by dextran T-100 filtration. The results showed that membrane water flux was increased up to $682Lm^{-2}h^{-1}$ when 28 wt.% of PEG400 was added into the PVC membrane solution. The best membrane performance with a low fouling and a high selectivity was achieved by adding 12 wt.% concentration of PEG400, which resulted in 90% rejection of dextran and 90% of flux recovery ratio. At further addition of PEG400 concentration, irreversible fouling was starting to increase. A 90% of irreversible fouling was formed in the PVC membrane when more than 22 wt.% of PEG400 is added.

• Membrane Journal
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• v.22 no.4
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• pp.258-264
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• 2012

In this study, to research effect of coagulation bath and composition of dope solution, polysulfone flat sheet membrane was fabricated by phase inversion method. PEG and PVP were used as additive. Concentration of polymer and additive, composition of coagulation bath was controlled to prepare flat sheet membrane. And then the morphology and water flux of prepared membrane were measured by FE-SEM and water flux testing apparatus. The highest value of water flux was measured at the membrane prepared under a 15 wt% PSF, 25 wt% PEG conditions, and water as coagulation bath. The pure water flux of the membrane composed of PSf/PEG was drastically decreased with increasing amount of DMAc. We confirmed that change of amount in additive and composition in coagulation bath influence the morphology and water flux performance of the membrane.

• Journal of the Korean institute of surface engineering
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• v.57 no.4
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• pp.274-284
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• 2024

In this study, copper foil was electroplated under high current density conditions. We used Polyethylene Glycol (PEG), known for its thermal stability and low decomposition rate, as an inhibitor to form a stable and smooth copper layer on the titanium cathode. The electrolyte was composed of 50 g/L CuSO₄ and 100 g/L H₂SO₄, MPSA as an accelerator, JGB as a leveler, and PEG as a suppressor, and HCl was added as chloride ions for improving plating efficiency. The copper foil electroplated in the electrolyte added PEG which induced to inhibit the growth of rough crystals. As a result, the surface roughness value was reduced, and a uniform surface was formed over a large area. Moreover, the addition of PEG led to priority growth to the (111) plane and the formation of polygonal crystals through horizontal and vertical growth of crystals onto the cathode. In addition, the grains became fine when more than 30 ppm of PEG was added. As the microcrystalline structure changed, mechanical and electrical properties were altered. With the addition of PEG, the tensile strength increased due to grain refinement, and the elongation was improved due to the uniform surface. However, as the amount of PEG added increased, the corrosion rate and resistivity increased due to grain refinement. Finally, it was possible to manufacture a copper foil with excellent electrical and mechanical properties and the best surface properties when electroplating was carried out under the condition of additives with Cl-20 ppm, MPSA 10 ppm, JGB 5 ppm, and PEG 10 ppm.

• Applied Chemistry for Engineering
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• v.34 no.3
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• pp.285-290
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• 2023

Poly-lactic acid (PLA) is the most promising polymer in additive manufacturing as an alternative to acrylonitrile butadiene styrene (ABS). Since it is produced from renewable resources such as corn starch and sugar beets, it is also biocompatible and biodegradable. However, PLA has a couple of issues that limit its use. First, it has a comparatively low glass transition temperature of around 60 ℃, such that it exhibits low thermal resistance. Second, PLA has low impact strength because it is brittle. Due to these problems, scientists have found methods to improve the crystallinity and ductility of PLA. Polyethylene glycol (PEG) is one of the most studied plasticizers for PLA to give it chain mobility. However, the blend of PLA and PEG becomes unstable, and phase separation occurs even at room temperature as PEG is self-crystallized. Thus, it is necessary to investigate the optimal mixing ratio of PLA-PEG at the molecular scale. In this study, molecular dynamics will be conducted with various ratios of L-type PLA (PLLA) or DL-type PLA-PEG (PDLA-PEG) systems by using BIOVIA Materials Studio.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.123-126
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• 2003

The electrophoretic deposition method using the suspension solution with additives under the electric potential was applied for the fabrication of YBCO superconductor wire. This method was able to simplify the fabrication facilities, and produce an uniform and dense thick film. To improve the critical current density of deposited films, the additive PEGs(Poly Ethylene Glycole) with the molecular weight of 600, 1000 and 3400, were used as chemical binders for the suspension solution. The organic additive PEG showed better effects to the properties of YBCO superconductor wire. The PEG improved the adhesion between superconductor particles and suppressed the crack on the surface, which enhanced the surface uniformity and density of YBCO deposited film. It was found that acetone suspension solution showed better deposition properties than the others. The samples fabricated in the solution with the additive, 8 vol.% of 1% PEG(1000), showed the highest critical current density measured as $2300{\sim}2400\;Acm^2$ at 77 K, 0 T.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04a
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• pp.37-40
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• 2002

Superconductor wire fabricated by electrophoresis showed its critical current density depended on parameters such as applied voltage and deposition time. Substrate and suspension solutions. and its properties are also important parameters. When same optimal parameter and condition was used, deposition density of superconductor film affect directly its critical current density. In this study, therefore, electrophoretic deposition technique was utilized for a densification of YBCO superconducting wire, and researches on electrophoretic suspension solutions and additive were experimentally performed for an improvement of the critical current density of fabricated electrophoretically superconducting wire. The samples fabricated in the solution with the additive, 8 vol.% of 1% PEG(1000), showed the highest critical current density.

• Journal of Environmental Health Sciences
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• v.31 no.4 s.85
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• pp.241-245
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• 2005

Laccase catalyzes the oxidation and polymerization of aromatic compounds in the presence of molecular oxygen. Studies were conducted to characterize the use of polyethylene glycol (PEG) as an additive to keep up the enzymatic stability. The enzymatic activities highly remained and bisphenol A (BPA) was rapidly converted in the presence of 5 mg/l of PEC. These effects were accomplished with PEG of molecular weight 3,350. A linear relationship was found between the quantity of BPA to be converted $(10-120\;{\mu}M)$ and the optimum dose of PEC required for greater than $95\%$ conversion. This result suggests that it is the interaction between the PEG and the reaction products. In the optimum dose of PEG, the aeration of reaction mixture neither enhanced the conversion of BPA nor retarded the inactivation of the enzyme.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.