• Title/Summary/Keyword: PCB board

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PCB Board Impedance Analysis Using Similarity Transform for Transmission Matrix (전송선로행열에 대한 유사변환을 이용한 PCB기판 임피던스 해석)

  • Suh, Young-Suk
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.13 no.10
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    • pp.2052-2058
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    • 2009
  • As the operating frequency of digital system increases and voltage swing decreases, an accurate and high speed analysis of PCB board becomes very important. Transmission matrix method, which use the multiple products of unit column matrix, is the highest speedy method in PCB board analysis. In this paper a new method to reduce the calculation time of PCB board impedances is proposed. First, in this method the eigenvalue and eigenvectors of the transmission matrix for unit column of PCB are calculated and the transmission matrix for the unit column is transformed using similarity transform to reduce the number of multiplication on the matrix elements. This method using the similarity transform can reduce the calculation time greatly comparing the previous method. The proposed method is applied to the 1.3 inch by 1.9 inch board and shows about 10 times reduction of calculation time. This method can be applied to the PCB design which needs a lots of repetitive calculation of board impedances.

Ultra-High-Speed PCB Design Methods (초고속 PCB 설계 기법)

  • Kim, Chang-Gyun;Lee, Seongsoo
    • Journal of IKEEE
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    • v.22 no.3
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    • pp.882-885
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    • 2018
  • Recently, signal integrity on PCB (printed circuit board) becomes very important as the system operation speed increases. So far, PCB is customarily designed to minimize area and cost. However, ultra-high-speed PCB often fail to operate properly, unless it is precisely and carefully designed considering dielectric characteristics, line width, line spacing, and impedance matching. This paper surveys many problems in ultra-high-speed PCB and various design methods to mitigate them.

The stable design of radiant heat inside PCB circuit board device (PCB회로 보드장치내의 안정적 방열설계를 위한 연구)

  • Won, Jong-Wun;Lee, Jong-Hwi
    • Journal of the Korea Safety Management & Science
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    • v.15 no.2
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    • pp.129-134
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    • 2013
  • In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.

Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages (전자장비 회로기판의 열응력해석)

  • Kwon Y. J.;Kim J. A.
    • Korean Journal of Computational Design and Engineering
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    • v.9 no.4
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

An Investigation on the Extraction and Quantitation of a Hexavalent Chromium in Acrylonitrile Butadiene Styrene Copolymer (ABS) and Printed Circuit Board (PCB) by Ion Chromatography Coupled with Inductively Coupled Plasma Atomic Emission Spectrometry

  • Nam, Sang-Ho;Kim, Yu-Na
    • Bulletin of the Korean Chemical Society
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    • v.33 no.6
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    • pp.1967-1971
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    • 2012
  • A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg.

Effects on PCB Transmission Characteristics by SMD Pad Alignment (SMD의 패드 정렬이 PCB 전송 특성에 미치는 영향)

  • Kim, Chang-Gyun;Lee, Seongsoo
    • Journal of IKEEE
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    • v.22 no.3
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    • pp.874-877
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    • 2018
  • Many SMDs (surface mount device) are mounted and mutually connected on a PCB (printed circuit board). System performance degrades when their transmission characteristics are bad. Pads connecting a PCB and SMDs affects PCB transmission characteristics significantly, so pad should be properly aligned to optimize impedance matching. In this paper, effects on PCB transmission characteristics are simulated by pad alignment. When frequency is relatively low, pad alignment seldom affect PCB transmission characteristics, but it affects more and more when frequency or pad size becomes larger. Therefore, pad alignment should be carefully chosen based on target frequency and pad size. Especially, the proposed edge-aligned pad is generally more advantageous over the conventional centered-aligned pad in 12~16 GHz Ku-band frequency.

Development of Miniature Quad SAW Filter Bank based on PCB Substrate

  • Lee, Young-Jin;Kim, Chang-Il;Paik, Jong-Hoo
    • Transactions on Electrical and Electronic Materials
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    • v.9 no.1
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    • pp.33-37
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    • 2008
  • This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.

The Optimization using PCB EM interpretation of GEO satellite's L Band Converter (정지궤도위성용 L대역변환반의 PCB EM 해석을 통한 최적화)

  • Kim, Ki-Jung;Ko, Hyeon-Seok
    • The Journal of the Korea institute of electronic communication sciences
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    • v.8 no.8
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    • pp.1219-1226
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    • 2013
  • This study is the analysis and verification process of the L-band satellite communications repeater thought PCB & circuit EM analysis. System performance can be vulnerable to various spurious inside the L-band satellite transponder, power conversion board, digital signal board, TM/TC board, such as control panels and blocks that are linked signal components when the winch is increased due to the noise component. So the whole system can cause performance degradation. PCB resonance analysis and EM simulation can be easily analyzed for a variety of optimal. Also, by setting the ports on the PCB, H/W designer wants to can easily analyze system.

A Manufacturing Process Model of Internet of Things Devices Using a PCB-mounted RFID Tag Chip (PCB 부착형 RFID 태그 칩을 이용한 사물인터넷 디바이스 생산 공정에 대한 모델)

  • Park, Yungi;Seo, Jeongwook
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2016.05a
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    • pp.674-675
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    • 2016
  • In this paper, we propose a manufacturing process model of Internet of Things devices using a Printed Circuit Board (PCB)-mounted RFID tag chip for reducing electronic wastes. Electrical and electronic products require a PCB surface mount and many examination. Also, conventional barcode systems cannot provide traceability management in PCB manufacturing before finishing Surface Mount Technology (SMT) process. The proposed process model does not require workers' attaching and detaching process unlike barcode systems. Also, RFID tag chip can record all the data in manufacturing steps. Thus, the number of connections to a database management system (DBMS) can be reduced.

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A study on the dynamic characteristic of printed circuit board considering the concept of simplified representative volume elements. (단순화된 볼륨 요소 개념을 고려한 인쇄회로기판 동특성에 관한 연구)

  • 서현석;김성훈;황도순;김대영;이상곤;이주훈;채장수;김태경;김춘삼
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2002.05a
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    • pp.78-81
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    • 2002
  • Printed Circuit Boards for satellite are composed of multi-layered copper plate and glass epoxy. Each copper layer have the complicated and different pattern to operate correctly for its mission. Especially. copper layer give effect on the PCB stiffness seriously. But It can make more complicate to predict the exact stiffness of PCB. In KOMPSAT-2 program, too many type of PCB are used for each electronic unit, and they have different type of pattern of copper layer. Solar array regulator has two type of PCB and it will be considered for this study. In this study. we calculate the PCB board stiffness of KOMPSAT-2 SAR unit considering the concept of simplified representative volume element. It will be correlated with the test results under KOMPSAT-2 vibration environmental condition to increase the reliability of this study.

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