• Journal of IKEEE
• /
• v.21 no.3
• /
• pp.272-275
• /
• 2017

Recently, semiconductor integration density enormously increases and its interconnection width is significantly narrowed, which leads to EMI (electromagnetic interference) problems on chip level. Chip manufacturer exploits TEM cell (transverse electromagnetic cell) to measure EMI on chip level, which requires PCB (printed circuit board) for measurement purpose. However, it is often neglected to consider that PCB patterns and other factors can affect on EMI measurement. In this paper, several test patterns are designed for different PCB design variables, and effects of PCB patterns on EMI measurement in TEM cell are analyzed. Based on these analyses, PCB design guidelines are also proposed to minimize the effects on EMI measurements.

• The Journal of Information Technology
• /
• v.3 no.4
• /
• pp.13-21
• /
• 2000

The thesis is for the analysis of the current trend adapted for the method of the test information exchange in the environment of the internal circuit in case of PCB design, The design process is most powerful for improving test characteristics among the entire process of PCB. The PCB is more and more difficult to test as the processes proceed because the nodes become more and more complicated. The data exchange for improving PCB test performance should be easy in order to provide more reliable products in the shorter period. The design technology oriented for the test makes the PCB and its components tested reliably and quickly so that it can effectively improve the quality of the PCB and largely reduce the time and cost of the test development, In addition it can make the substantial standardization In improve the speed of the repeated test and treatment so that the Period of development can be shorter. Also, it helps to effectively detect the potential defects of the products, so that highly reliable PCB can be produced.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.6 no.5
• /
• pp.412-417
• /
• 2005

The objective of study is design and structural analysis of multi-axis drill machine for PCB. This is able to reduce the unit cost of manufacture and to ensure safety, that is with the result of analysis by design the multi-axis drill machine for the use of PCB to enhancing suitability and exactitude in mass production the process of PCB.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.48 no.12
• /
• pp.73-81
• /
• 2011

As high speed digital systems continue to use components with faster edge rate and clock speeds, transmission of the digital information, it can bring about many troubles. The increasing requirement for controlled impedance PCBs becomes both a critical success factor and a design challenge to implement a system. Especially, the noise sources in high frequency digital systems include the noise in power supply, ground and packaging, and they destroy the fidelity of signals. Therefore PCB design with impendence matching is needed to improve fidelity of signal in H/W. In this paper, we have developed an impedance control and analysis tool for multi-layer PCB design, and simulates the tracks controlled impedance with the test coupon. So, it can save the design time and support the economical PCB design.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2012.05a
• /
• pp.303-306
• /
• 2012

According to the rapid development of cell phone and camera industry, all of electronic products obtain small-size, high-performance and variety. Therefore, PCB also obtains high-integration, multi-layers and high-specification rapidly. Among the digital cameras which are continuously evolved and developed, the market of mirror-less camera and hybrid digital camera is continuously increased because of the customer's request for small-size and weight lightening, except for DSLR camera. Therefore, the difficulty of PCB design is gradually increased and design L/T is longer according to the high-specifications, low-current and high-performance components. This thesis suggests the method to reduce L/T for PCB design applied to the reduction of digital camera's developing period and manufacturing period.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.16 no.6
• /
• pp.1204-1208
• /
• 2012

According to the rapid development of cell phone and camera industry, all of electronic products obtain small-size, high-performance and variety. Therefore, PCB also obtains high-integration, multi-layers and high-specification rapidly. Among the digital cameras which are continuously evolved and developed, the market of mirror-less camera and hybrid digital camera is continuously increased because of the customer's request for small-size and weight lightening, except for DSLR camera. Therefore, the difficulty of PCB design is gradually increased and design L/T is longer according to the high-specifications, low-current and high-performance components. This thesis suggests the method to reduce L/T for PCB design applied to the reduction of digital camera's developing period and manufacturing period.

• Proceedings of the KAIS Fall Conference
• /
• 2005.05a
• /
• pp.79-82
• /
• 2005

본 논문에서는 PCB의 제작 공정에 있어 기준구멍을 가공하기 위한 다축드릴머신의 PCB와 드릴날 간의 충돌시험을 구하여 설계에 반영한다. 이는 PCB 가공을 대량생산에 적합하고 정확성을 높이기 위해 PCB용 다축드릴 머신을 설계함에 있어 해석결과를 이용하여 안전성확보와 제작단가를 절감할 수 있다.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.33 no.6
• /
• pp.577-583
• /
• 2009

In this work, a design method that minimizes PCB warpage is proposed. This work suggests that narrow dummy patterns are placed on the discetized location along the periphery of the PCB to control the warpage. The warpage is numerically simulated base on direct modeling of PCB patterns. The optimal pattern that minimizes warpage is determined using the human-based genetic algorithm.

• The Journal of the Korea Contents Association
• /
• v.5 no.5
• /
• pp.17-25
• /
• 2005

In this paper, we design data transformation interface for the automation of PCB product. The data designed to CAD does not exchange itself for the assembly line, so we construct an automation system which is exchangeable. To do this, we analyze the information of PCB components and construct the Information of IC components as database. We also develope two kinds of algorithm; one is to detect human error and another is to exchange itself for the data which is suitable for PCB assembly line. We design data transformation interface to do addition and revision of the information for PCB assembly line. By automating existing manual processing, we are able to shorten access time and enhance reliability of the data and the efficient assembly line of PCB.

• Journal of IKEEE
• /
• v.22 no.3
• /
• pp.882-885
• /
• 2018

Recently, signal integrity on PCB (printed circuit board) becomes very important as the system operation speed increases. So far, PCB is customarily designed to minimize area and cost. However, ultra-high-speed PCB often fail to operate properly, unless it is precisely and carefully designed considering dielectric characteristics, line width, line spacing, and impedance matching. This paper surveys many problems in ultra-high-speed PCB and various design methods to mitigate them.