• Title, Summary, Keyword: PCB (Printed circuit board)

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Ultra-High-Speed PCB Design Methods (초고속 PCB 설계 기법)

  • Kim, Chang-Gyun;Lee, Seongsoo
    • Journal of IKEEE
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    • v.22 no.3
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    • pp.882-885
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    • 2018
  • Recently, signal integrity on PCB (printed circuit board) becomes very important as the system operation speed increases. So far, PCB is customarily designed to minimize area and cost. However, ultra-high-speed PCB often fail to operate properly, unless it is precisely and carefully designed considering dielectric characteristics, line width, line spacing, and impedance matching. This paper surveys many problems in ultra-high-speed PCB and various design methods to mitigate them.

An Investigation on the Extraction and Quantitation of a Hexavalent Chromium in Acrylonitrile Butadiene Styrene Copolymer (ABS) and Printed Circuit Board (PCB) by Ion Chromatography Coupled with Inductively Coupled Plasma Atomic Emission Spectrometry

  • Nam, Sang-Ho;Kim, Yu-Na
    • Bulletin of the Korean Chemical Society
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    • v.33 no.6
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    • pp.1967-1971
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    • 2012
  • A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg.

Micro Patterning of Nano Metal Ink for Printed Circuit Board Using Inkjet Printing Technology (잉크젯 프린팅 기술을 이용한 나노 금속잉크의 인쇄회로기판용 미세배선 형성)

  • Park, Sung-Jun;Seo, Shang-Hoon;Joung, Jae-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.5
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    • pp.89-96
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    • 2007
  • Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages (전자장비 회로기판의 열응력해석)

  • Kwon Y. J.;Kim J. A.
    • Korean Journal of Computational Design and Engineering
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    • v.9 no.4
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

Effects on PCB Transmission Characteristics by SMD Pad Alignment (SMD의 패드 정렬이 PCB 전송 특성에 미치는 영향)

  • Kim, Chang-Gyun;Lee, Seongsoo
    • Journal of IKEEE
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    • v.22 no.3
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    • pp.874-877
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    • 2018
  • Many SMDs (surface mount device) are mounted and mutually connected on a PCB (printed circuit board). System performance degrades when their transmission characteristics are bad. Pads connecting a PCB and SMDs affects PCB transmission characteristics significantly, so pad should be properly aligned to optimize impedance matching. In this paper, effects on PCB transmission characteristics are simulated by pad alignment. When frequency is relatively low, pad alignment seldom affect PCB transmission characteristics, but it affects more and more when frequency or pad size becomes larger. Therefore, pad alignment should be carefully chosen based on target frequency and pad size. Especially, the proposed edge-aligned pad is generally more advantageous over the conventional centered-aligned pad in 12~16 GHz Ku-band frequency.

Design of flexible assembly line for printed circuit board(PCB) manufacturing of amdahl company

  • Park, Kwangtae;Adiga, Sadashiv
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • pp.159-168
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    • 1992
  • 생산라인의 line balancing이 흐름생산에 있어서 일관된 생산을 하기 위한 필수조건이다. 여러 다양한 제품을 생산하는 printed circuit board(PCB) 공장에서의 line balancing을 얻기 위해서는 mixed model line balancing절차를 설명하고자 한다.

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DC-DC Converter Using a Coreless Printed Circuit Board (PCB) Transformer (코어 없는 PCB 변압기를 이용한 DC-DC 컨버터)

  • 황선민;안태영;최병조
    • Proceedings of the IEEK Conference
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    • pp.9-12
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    • 2000
  • This paper describes the modeling and experimental results of coreless printed circuit board (PCB) based transformer that can be used for power conversion at high frequency operation. The principle of using coreless PCB based transformer in 2MHz, 10W class ZVS Flyback DC-DC converter has been successfully demonstrated. The maximum power conversion efficiency is 79%. Even for high operating frequency, an efficiency greater than 70% can be obtained with under 1% regulation error.

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A Manufacturing Process Model of Internet of Things Devices Using a PCB-mounted RFID Tag Chip (PCB 부착형 RFID 태그 칩을 이용한 사물인터넷 디바이스 생산 공정에 대한 모델)

  • Park, Yungi;Seo, Jeongwook
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • pp.674-675
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    • 2016
  • In this paper, we propose a manufacturing process model of Internet of Things devices using a Printed Circuit Board (PCB)-mounted RFID tag chip for reducing electronic wastes. Electrical and electronic products require a PCB surface mount and many examination. Also, conventional barcode systems cannot provide traceability management in PCB manufacturing before finishing Surface Mount Technology (SMT) process. The proposed process model does not require workers' attaching and detaching process unlike barcode systems. Also, RFID tag chip can record all the data in manufacturing steps. Thus, the number of connections to a database management system (DBMS) can be reduced.

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Copper thickness and thermal reliability of microvias produced by laser-assisted seeding (LAS) process in printed circuit board (PCB) manufacture

  • Leung, E. S.W.;Yung, W. K.C.
    • International Journal of Quality Innovation
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    • v.2 no.2
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    • pp.69-92
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    • 2001
  • The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

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Automatic Extraction of Component Inspection Regions from Printed Circuit Board by Image Clustering (영상 클러스터링에 의한 인쇄회로기판의 부품검사영역 자동추출)

  • Kim, Jun-Oh;Park, Tae-Hyoung
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.61 no.3
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    • pp.472-478
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    • 2012
  • The inspection machine in PCB (printed circuit board) assembly line checks assembly errors by inspecting the images inside of the component inspection region. The component inspection region consists of region of component package and region of soldering. It is necessary to extract the regions automatically for auto-teaching system of the inspection machine. We propose an image segmentation method to extract the component inspection regions automatically from images of PCB. The acquired image is transformed to HSI color model, and then segmented by several regions by clustering method. We develop a modified K-means algorithm to increase the accuracy of extraction. The heuristics generating the initial clusters and merging the final clusters are newly proposed. The vertical and horizontal projection is also developed to distinguish the region of component package and region of soldering. The experimental results are presented to verify the usefulness of the proposed method.