• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.4
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• pp.61-69
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• 2003

Cellular network을 이용하는 휴대 단말기의 경우 TDMA(GSM, IS-136), CDMA(IS-95) 그리고 WCD-MA 등을 포함해서 년간 약 4억대 정도 생산되고 있고, PAM(Power Amplifier Module)은 단말기 한 대당 1~2개 정도 사용되며, 단말기의 battery 사용시간과 밀접한 관련이 있다. 또한 antenna front-end에 장착되기 때문에, 신호의 왜곡에 의한 인접채널 누설 전력과 harmonic 등 전기적인 규격의 적합성과 ESD, 습기 등 품질 신뢰성 문제에 직접적인 영향을 주는 중요한 부품 중의 하나이다. 이로 인하여 PAM의 핵심 기능을 담당하는 PA IC의 공정 기술과 설계 기술, PAM제조 기술 등의 향상에 대한 많은 연구와 개발이 이루어졌다. 본 고에서는 PAM의 최근 기술 동향과 기능적으로 PAM이 주변 수동 및 능동 부품과 집적화 되고 있는 복합 모듈의 동향에 대해서 기술한다.

• Journal of Electrical Engineering and Technology
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• v.12 no.4
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• pp.1556-1565
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• 2017

This paper depicts the design, implementation and analysis of efficient resonant based wireless power transfer (WPT) technique using three magnetic coupled coils. This work is suitable for mid ranged device due to small form factor while minimizing the loading effect. A multi turned loop size resonator is exploited for both the transmitter and receiver for longer distance. In this paper, class-E power amplifier (class-E PA) is introduced with an optimum power tracking mechanism of WPT system to enhance the power capability at mid-range with a flat gain. A robust method of finding optimum distance is derived with an experimental analysis of the designed system. In this method, the load sensitive issue of WPT is resolved by tuning coupling coefficient at considerable distances. Our designed PA with a drain efficiency of 77.8% for a maximum output of 5W is used with adopted tuning technique that improves the overall WPT system performance by 3 dB at various operating points.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.2
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• pp.276-283
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• 2003

In this paper, a 2-stage power amplifier(PA) for IMT-2000 handset has been designed and fabricated using SiGe HBT, which has excellent frequency characteristics and linearity, to reduce size and weight instead of existing linearization techniques. DC I-V characteristics and S-parameter of SiGe HBT were simulated by Agilent circuit simulator(ADS), with large signal Gummel-Poon nonlinear circuit model. Then the output and interstage matching circuits were designed to satisfy the high power condition and the high gain condition, respectively. The experimental results showed output power of 27.1dBm and ACLR of 20dB, PAE of 34%, and linear power gain of 18.9dB over frequency ranges from 1920MHz to 1980MHz.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.553-554
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• 2006

In this paper, 77 GHz CPW power amplifier MMIC, which are consisted of a 2 stage driver stage and a power stage employing $8{\times}50um$ gate width, have been successfully developed by using 120nm $In_{0.4}AlAs/In_{0.35}GaAs$ Metamorphic high electron mobility transistors (MHEMTs). The devices show an extrinsic transconductance $g_m$ of 660 mS/mm, a maximum drain current of 700 mA/mm, and a gate drain breakdown voltage of -8.5 V. A cut-off frequency ($f_T$) of 172 GHz and a maximum oscillation frequency ($f_{max}$) of over 300 GHz are achieved. The fabricated PA exhibited high power gain of 20dB only with 3 stages. The output power is measured to be 12.5 dBm.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.5
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• pp.521-524
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• 2015

This letter presents a selective wireless power transfer architecture using a reconfigurable multi-port amplifier. The proposed wireless power transfer architecture is composed of a phase shifter part controlled by FPGA, two class-E power amplifiers, a four-port power combiner and two coil loads. Depending on the phase control of FPGA, the power ratio of outputs at the two coil loads becomes 1:1, 2:0 and 0:2. The manufactured system has delivered 1W DC power to loads at 125 kHz. The total DC-to-DC conversion efficiency shows more than 40 % including PA efficiency of 79 %.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.4
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• pp.257-265
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• 2009

Recent progress in development of CMOS power amplifiers for mobile terminals is reviewed, focusing first on switching mode power amplifiers, which are used for transmitters with constant envelope modulation and polar transmitters. Then, various transmission line transformers are evaluated. Finally, linear power amplifiers, and linearization techniques, are discussed. Although CMOS devices are less linear than other devices, additional functions can be easily integrated with CMOS power amplifiersin the same IC. Therefore, CMOS power amplifiers are expected to have potential applications after various linearity and efficiency enhancement techniques are used.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.4
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• pp.356-362
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• 2003

In this paper, we propose a predistortion technique which uses a novel combination of the second harmonic technique and the difference frequency technique to achieve independent control of the 3rd and 5th order intermodulation products generated by the PA. The second harmonic and difference frequency terms are generated using an envelope detector and two frequency multipliers. The RF predistorter has capability to independently control of the 3rd and 5th order intermodulation products so that high power amplifier is optimized for linear characteristics. From the measurement results, over the frequency band 2137.5 MHz to 2142.5 MHz, ACPR reduction of 11 dB is obtained for a single 30 dBm W-CDMA carrier.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.9
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• pp.897-903
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• 2011

This paper presents a highly linear power amplifier MMIC, having an output power level of about 1 watt, based on InGaP/GaAs hetero-junction bipolar transistor(HBT) technology for the 900 MHz band. The active bias circuit is applied to minimize the effect of temperature variation. Ballast resistors are optimized to prevent a current collapse and a thermal runaway. The fabricated power amplifier exhibited a gain of 17.6 dB, an output P1dB of 30 dBm, and a PAE of 44.9 % at an output P1dB from the one-tone excitation. It also showed a very high OIP3 of 47.3 dBm at an average output power of 20 dBm from the two-tone excitation.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.5
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• pp.1120-1128
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• 2004

In this paper, we has designed and implemented Up-converter for K-band with high IMD3 performance using balanced power amplifier. It is consisted of PA module and, Local Oscillator module with reject Filter, mixer module and If block, and Up-converter has a local loop path to decide whether it operate or not and has the sensing port to inspect output power level. According to the power budget of designed Up-converter, K-band balanced power amplifier was fabricated by commercial MMIC. Measurement results of up-converter show about 40dB Gain, PldB of 29dBm and OIP3 was 38.25dBm, that is good performance compared to power budgets. We has adjusted gate voltage of MMIC to control more than 30 dB gain. This up-converter was used in transceiver for PTP and PTMP, and applied to digital communication system that use QAM and QPSK modulation.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.3
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• pp.136-145
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• 2006

Two major processing technologies of GaAs HBT and pHEMT have been released in production at Win Semiconductors corp. to address the strong demands of power amplifiers and switches for both handset and WLAN communications markets. Excellent performance with low processing cost and die shrinkage features is reported from the manufactured MMICs. With the stringent tighter manufacturing quality control WIN has successfully become one of the major pure open foundry house to serve the communication industries. The advancing of both technologies to include E/D-pHEMTs and BiHEMTs likes for multifunctional integration of PA, LNA, switch and logics is also highlighted.