• Proceedings of the KWS Conference
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• 2005.11a
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• pp.262-264
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• 2005

$Bi_{2}Sr_{2}CaCu_{2}O_{x}$(Bi-2212) and $Bi_{2}Sr_{2}Ca_{2}Cu_{3}O_{y}$(Bi-2223) high-$T_{c}$ superconductor(HTS) coating have been prepared by plasma spraying and heaat treatment. The Bi-2212 HTS coating later is synthesized through the peritectic reaction between Sr-Ca-Cu oxide coating layer and Bi-Cu oxide coating later, and $Bi_{2}Sr_{2}CaCu_{2}O_{y}$(Bi-2212) superconducting phase grow by partial melting process. The superconducting characteristic depends strongly on the conditions of the partial melting process. the Bi-2212 HTS layer consists of the whiskers grown in the diffusion direction. Above the 2212 layer, Bi-2223 phase and secondary phase was observed. The secondary phase is distributed uniformly over the whole surface. This is caused to the microcrack on the coatings surface. Despite everything, the film shows superconducting with an onset $T_{c}$ of about 115K. There are two changes steps. One changes (1step) at 115K is due to the diamagnetism of the Bi-2223 phase and the other changes (2step) at 78K is due to the diamagnetism of the Bi-2212 phase.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.317-318
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• 2012

현재의 반도체 산업에서 Hafnium oxide와 Hafnium silicates같은 high-k 물질은 CMOS gate와 DRAM capacitor dielectrics로 사용하기 위한 대표적인 물질에 속한다. MOSFET (metal oxide semiconductor field effect transistor)구조에서 gate length는 16 nm 이하로 계속 미세화가 연구 중이고, 또한 gate는 기존구조에서 Multi-gate구조로 다변화가 일어나고 있다. 이를 통해 게이트 절연막은 그 구조와 활용범위가 다양해지게 될 것이다. 동시에 leakage current와 dielectric break-down을 감소시키는 연구가 중요해지고 있다. 그러나 나노 영역에서의 기계적 특성에 대한 연구는 전무한 상태이다. 따라서 복잡한 회로 공정, 다양한 Multi-gate 구조, 신뢰도의 향상을 위해서는 유전박막 물질자체와 계면에서의 물리적, 기계적인 특징의 측정이 상당히 중요해지고 있다. 이에 본 연구는 Nano-indenter의 통해 경도(Hardness)와 탄성계수(Elastic modulus) 등의 측정을 통하여 시료 표면의 나노영역에서의 기계적 특성을 연구하고자 하였다. $HfO_2$게이트 절연막은 rf magnetron sputter를 이용해 Si (silicon) (100)기판위에 박막형태로 증착하였고, 이후 furnace에서 질소분위기로 온도(400, 450, $500^{\circ}C$)를 달리하여 20분 열처리를 하였다. 또한 Weibull distribution을 이용해 박막의 characteristic value를 계산하였으며, 실험결과 열처리 온도가 $400^{\circ}C$에서 $500^{\circ}C$로 증가함에 따라 경도와 탄성계수는 7.4 GPa에서 10.65 GPa으로 120.25 GPa에서 137.95 GPa으로 각각 증가하였다. 이는 재료적 측면으로 재료의 구조적 우수성이 증가된 것으로 판단된다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.5
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• pp.1592-1596
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• 2010

According to the increase of the channel length with fixed width/length, characteristic curves of drain current as a function of gate bias voltage of indium gallium zinc oxide (IGZO) thin-film transistors moved to a positive direction of gate voltage, and field-effect mobility decreased. In case of fixed length and width of channel, field-effect mobility was lower and subthreshold slope was larger when drain bias voltage was higher. Due to large work function of IGZO, band bending at the junction region between IGZO channel and source/drain electrodes was expected to be in opposite direction to that between silicon and metal electrodes; this could explain the above results.

• Journal of Surface Science and Engineering
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• v.44 no.5
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• pp.220-225
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• 2011

304 stainless steel plate was colored by hot dip and electrochemical treatment in a solution containing sulphuric and chromic acids. In the process, treatment variables such as operating time and methode were changed. The surface characteristics that changed by the treatment of the samples such as surface composition, oxide film thickness, color, surface roughness and reflectivity were studied. Surface composition was varied as follows. Fe was decreased, but Cr and O were increased. Ni was increased until 20 min, but reveals decreasing tendency as time passed after that. These means the surface film becomes chrome rich oxide phase as the treatment times increase. The thickness of film was about 220 nm at 30 min by dip treatment and it reduced as the treatment times increased. On the other hand, the thickness was about 150 nm at 10 min by electrochemical method and it doesn't increased with time. Surface color changed from metallic white of the base plate to gray, black, red, and green-blue, gradually, as the treating time increased. The reflectivity of colored surface measured by UVVIS-NIR spectrophotometer was reduced from max 38% of basis metal to min 3.5%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05b
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• pp.58-61
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• 2003

ITO (indium tin oxide) thin films on PET (polyethylene terephthalate) substrate have been deposited by a dc reactive magnetron sputtering without heat treatments such as substrate heater and post heat treatment. Each sputtering parameter during the sputtering deposition is an important factor for the high quality of ITO thin films deposited on polymeric substrate. Particularly, the material, electrical and optical properties of as-deposited ITO oxide films are dominated by the ratio of oxygen partial pressure. As the experimental results, the excellent ITO films are prepared on PET substrate at the operating conditions as follows: operating pressure of 5 mTorr,target-substrate distance of 45 mm, dc power of 20-30 W, and oxygen gas ratio of 10 %. The optical transmittance is above 80 % at 550 nm, and the sheet resistance and resistivity of films are $24\;{\Omega}$/square and $1.5{\times}10^{-3}\;cm$, respectively.

• Journal of the Korean Ceramic Society
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• v.40 no.1
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• pp.69-76
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• 2003

For lithium secondary microbattery anode, the tin oxide thin films with Si addition (0, 2, 6, 10, 20 ㏖%) were prepared with R.F. magnetron sputtering at substrate temperature of 30$0^{\circ}C$ and Ar:O$_2$=7:3 atmosphere. As Si addition amount increased, Si-O bonding density increased and Sn-O bonding density decreased. The addition of optimum Si amount led the decrease of Sn oxidation state so that the irreversible capacity reduced and cycle characteristic enhanced during charge-discharge test. SnO$_2$films with 6 ㏖% Si had the highest reversible capacity of 700 mAh/g after 100 cycles.

• Journal of Korean Society for Atmospheric Environment
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• v.22 no.3
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• pp.373-381
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• 2006

The catalytic combustion of toluene was investigated on the Cu-Mn oxide catalysts prepared by the deposition-precipitation method. Experiment of toluene combustion was performed with a fixed bed flow reactor in the temperature range of $100{\sim}280^{\circ}C$. Among the catalysts, 1.29Cu/Mn showed the most activity at $260^{\circ}C$. The deposition-precipitation method may be showed the potential to enhance the activity of catalysts. The catalysts were characterized by BET, scanning electron microscopy (SEM), temperature-programmed reduction (TPR), X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD) techniques. On the basis of catalyst characterization data, the results showed that the surface of catalysts by deposition-precipitation method had uniform distribution and smaller particle size, which enhanced the reduction capability of catalysts. The XRD results showed that $Cu_{1.5}Mn_{1.5}O_{4}$ spinel phase was made by deposition-precipitation method, and increased catalyst activity and redox characteristic. It was assumed that the reduction step of $Cu_{1.5}Mn_{1.5}O_{4}$ spinel phase progressed $Cu_{1.5}Mn_{1.5}O_{4}\;to\;CuMnO_{2},\;and\;Cu_{2}O\;to\;CuMn_{2}O_{4}\;and\;Cu$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.134-135
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• 2008

Ultra-thin $SiO_2/ZrO_2$ dielectrics were deposited by atomic layer chemical vapor deposition (ALCVD) method for non-volatile memory application. Metal-oxide-semiconductor (MOS) capacitors were fabricated by stacking ultra-thin $SiO_2$ and $ZrO_2$ dielectrics. It is found that the tunneling current through the stacked dielectric at the high voltage is lager than that through the conventional silicon oxide barrier. On the other hand, the tunneling leakage current at low voltages is suppressed. Therefore, the use of ultra-thin $SiO_2/ZrO_2$ dielectrics as a tunneling barrier is promising for the future high integrated non-volatile memory.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.821-825
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• 2013

Effect of multi-stacked layer (MSL), 0.1 mol (M) and 0.3 mol (M) hafnium oxide ($HfO_2$) alignment layers were fabricated via a solution-process for LCs orientation. The solutions were spin-coated and annealed in a furnace. MSL consists of three sub-layers using 0.1 M solution, mono-layer (ML) is composed of 0.3 M $HfO_2$ solution. Then ion-beam irradiation was treated with 1.8 keV for 2 min. $HfO_2$-based LC cells were investigated through photographs, pre-tilt angle using crystal rotation method, X-ray photoelectron spectroscopy (XPS) measurement, and surface roughness using atomic force microscopy(AFM) for their characteristic research. Good LC orientation characteristics were observed on MSL $HfO_2$ surface. The LC alignment mechanism on MSL $HfO_2$ and ML $HfO_2$ surfaces was attributed to van der Waals (VDW) interaction between the LC molecular and substrate surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.468-470
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• 1999

One of the most critical problem in etching of platinum was generally known that the etch slope was gradual. therefore, the addition of $N_2$ gas into the Ar/C1$_2$ gas mixture, which has been proposed the optimized etching gas combination for etching of platinum in our previous article, was performed. The selectivity of platinum film to oxide film as an etch mask increased with the addition of N2 gas, and the steeper etch slope over 75 $^{\circ}$ could be obtained. These phenomena were interpreted the results the results of a blocking layer such as Si-N or Si-O-N on the oxide mask. Compostional analysis was carried out by X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). Moreover, it could be obtained the higher etch rate of Pt film and steeper profile without residues such as p.-Cl and Pt-Pt ant the addition N\ulcorner of 20 % gas in Ar(90)/Cl$_2$(10) Plasma. The Plasma characteristic was extracted from optical emissionspectroscopy (OES).