• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.26-32
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• 2012

Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.1-6
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• 2008

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very important. However, most of these investigation was experiment less than 300mm diameter. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study reports the machining variables that has major influence on the characteristic of wafer polishing. It was adapted to polishing pressure, machining speed, and the slurry mix ratio, the optimum condition is selected by ultra precision wafer polishing using load cell and infrared temperature sensor. The optimum machining condition is selected a result data that use a pressure and table speed data. By using optimum condition, it achieves a ultra precision mirror like surface.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.2
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• pp.59-65
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• 2006

The purposes of using cutting fluid during cutting have been cooling, lubricating, chip washing and anti-corroding. However, the present manufacturing industry restricts the use of cutting fluid because cutting fluid contains poisonous substances which are harmful to the human body. Therefore environmentally conscious machining and technology have more important position in machining process because cutting fluids have significant influence on the environment in milling process. In this study, environmentally conscious machining can be obtained by the way of selecting the optimum machinig conditon using the design of experiment. Cutting using oil-mist showed better cutting characteristics than dry, air and fluid cutting with respect to by cutting force, tool wear and surface roughness. Also, the optimum machining condition for cutting using oil-mist could be selected through Taguchi method.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.9
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• pp.43-49
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• 1998

The deep hole drilling has an increasing demands because of its wide range applications and its good productivity. The BTA drills are capable of machining for having a large length to diameter ratio in single pass to higher degree of accuracy and surface finish. It's really necessary that the investigation for the deep hole drilling by the BTA drill because its required quality should be satisfied with single pass. This thesis deal with the experimental results obtained during single tube BTA system machining on SM55C steel for different machining conditions. The results of the investigation on the optimum cutting condition selecting and tool life reveals as follows. (1) The optimum cutting condition was cutting speed, V = 42 m/min and feed speed. F = 90 mm/min and the tool life was about 10 meters. (2) Surface roughness was $12\mum$ and the roundness was less using $16mum$single edge BTA drill in testing cutting condition.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.29-34
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• 2012

This study describes the selection of optimum machining conditions for a high-hardness resin by using a large 5-axis machine. The experiments were conducted to examine the main factors that affect the surface roughness, such as the spindle speed, axial and radial depths of the cut, and pattern of the cutter path. To analyze the experiment results, the factor with the biggest impact on machining was determined using the smaller-the-better characteristic of the Taguchi method; the effectiveness of the experiment was then confirmed by verifying the selected optimum machining condition.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.111-112
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• 2010

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.6
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• pp.48-54
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• 2012

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon. However, for many companies, it is hard to produce 400mm or 450mm wafers, because of excesive funds for exchange the equipments. Therefore, it is necessary to investigate 300mm wafer to obtain a better efficiency and a good property rate. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This research investigated the surface characteristics that apply variable machining conditions and Taguchi Method was used to obtain more flexible and optimal condition. In this study, the machining conditions have head speed, oscillation speed and polishing time. By using optimum condition, it achieves a ultra precision mirror like surface.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1996.03a
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• pp.41-46
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• 1996

In this study, unsintered and pre-sintered low purity alumina ceramics were machined with various tools to clarify the machinability, optimum tool materials and optimum cutting conditions. The main conclusions obtained were as follows. (1)In the case of dry cutting, the sintered diamond and natural diamond tools exhibit better performance in machining of the ceramic pre-sintered at lower temperature, and the tool lives of both tools in machining the ceramics pre-sintered at high temperature becomes extremely short. (2)The performance of CBN tool becomes better in dry machining of the ceramics pre-sintered at higher temperature. (3)When the pre-sintered ceramics were wet machined with sintered diamond, the tool life becomes considerably long, and higher cutting speed can be used than in the case of the CBN and ceramic tools, the tool lives becomes shorter at wet cutting than at dry cutting, especially exhibiting extremely short tool life in wet cutting with ceramic tool.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.141-144
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• 2003

This paper proposes an analytical model of off-line feed rate scheduling to obtain an optimum feed rate for high speed machining. Off-line feed rate scheduling is presented as an advanced technology to regulate cutting forces through change of feed per tooth, which directly affects variation of uncut chip thickness. In this paper, the feed rate scheduling model was developed using a mechanistic cutting force model using cutting-condition-independent coefficients. First, it was verified that cutting force coefficients are not changed with respect to cutting speed. Thus, the feed rate scheduling model using the cutting-condition-independent coefficients can be applied to set the proper feed rates for high speed machining as well as normal machining. Experimental results show that the developed fred rate scheduling model makes it possible to maintain the cutting force at a desired level during high speed machining.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.223-226
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• 2002

Appropriate design/manufacturing conditions, to give outstanding material properties to the $Si_3$$N_4$-BN and AIN-BN based composite materials, will be investigated using the experimental design methods. Ultra-precision machinability of the developed ceramics will be systematically studied in the viewpoint of microstructure and material properties. Also, finite element methods will be applied to define basic principles to significantly improve machinability and various properties. Basic experiments will be performed to develop optimum ultra-precision machining technologies for the developed ceramics. For ultra-precision lapping machining, need to develop a ultra-precision lapping system, suitable metal bonded diamond wheel, and appropriate condition of ultra-precision lapping machining.