Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
권호 표지

The Study on the Wafer Surface and Pad Characteristic for Optimal Condition in Wafer Final Polishing

최적조건 선정을 위한 Pad 특성과 Wafer Final Polishing의 가공표면에 관한 연구

  • 원종구 (인하대학교 기계공학과) ;
  • 이은상 (인하대학교 기계공학과) ;
  • 이상균 (인하대학교 대학원 기계공학과)
  • Published : 2012.02.29
⟨ Previous Next ⟩

Abstract

Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.

Keywords

References

  1. Doi, T., Kasai, T. and Nakagawa, T., 2001, CMP Technology for Semiconductor Planarization, Books-Hill.
  2. Hahn, P. 2001, "The 300mm silicon wafer - a cost and technology challenge", Microelectronic Engineering, Vol. 56, pp. 3-13 https://doi.org/10.1016/S0167-9317(00)00499-8
  3. Won, J. K., Lee, J. T., Lee, J. H. and Lee, E. S., 2007, "The Study on the Machining Characteristics of 4 inch Wafer for the Optimal Condition", Transactions of the Korean Society of Machine Tool Engineers, Vol. 16, No. 5, pp. 90-95.
  4. Kim, H. Y., Kim, H. J. and Jeong, H. D., 2000, "Development of an Abrasive Embedded Pad for Dishing Reduction and Uniformity Enhancement", Journal of the Korean Physical Society, Vol. 37, No. 6, pp. 945-951. https://doi.org/10.3938/jkps.37.945
  5. Won, J.K., Lee, J.T. and Lee, E.S., 2006, "The study on the optimum Machining characteristic of 12 inch wafer polishing", Proceesdings of the KSME 2006 Spring Annual Meeting, p 282.
  6. Z.J. Pei, "A study on surface grinding of 300mm silicon wafers", International Journal of Machine Tools & Manufacture 42(2002) 385-393l. https://doi.org/10.1016/S0890-6955(01)00122-5
  7. R. Ristelhueber, First 300mm wafers rolls off fab line-Siemens Motorola joint venture bears fruit after one year, Electronics News, 15 February 1999.
  8. Effects of conditioning temperature on polishing pad for oxide chemical mechanical polishing process, Microeletronic Engineering, Vol. 82, Issues 3-4, December 2005, pp. 680-685, https://doi.org/10.1016/j.mee.2005.07.080
  9. Nam-Hoon Kim, Gwon-Woo Choi, Jin-Seong Park, Yong-Jin Seo and Woo-Sun Lee, Madow, M.J., 2001, "Fundamentals of microfabrication", 2nd ed. CRC Press.
  10. Polishing pad surface characterisation in chemical mechanical planarisation, Journal of Materials Processing Technology, Vol. 153-154. 10 November 2004, pp. 666-673, John McGrath and Chris Davis. https://doi.org/10.1016/j.jmatprotec.2004.04.094
  11. Tae-Hee, Shin, Jong-Koo, Won, Jung-Taik, Lee, Eun-Sang, Lee, "A Study on the Characteristics of Surface on the Wafer Polishing according to Machining Velocity and Processing Temperature of Slurry", Transactions of the Korean Society of Machine Tool Engineers, Vol. 17, No. 4, pp. 30-35, 2008. 8.