Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
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A Study on the Optimal Machining of 12 inch Wafer Polishing by Taguchi Method

다구찌 방법에 의한 12인치 웨이퍼 폴리싱의 가공특성에 관한 연구

  • Choi, Woong-Kirl (Graduate School of Mechanical Engineering, Inha University) ;
  • Choi, Seung-Gun (Graduate School of Mechanical Engineering, Inha University) ;
  • Shin, Hyun-Jung (Graduate School of Mechanical Engineering, Inha University) ;
  • Lee, Eun-Sang (School of Mechanical Engineering, Inha University)
  • Published : 2012.12.31
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Abstract

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon. However, for many companies, it is hard to produce 400mm or 450mm wafers, because of excesive funds for exchange the equipments. Therefore, it is necessary to investigate 300mm wafer to obtain a better efficiency and a good property rate. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This research investigated the surface characteristics that apply variable machining conditions and Taguchi Method was used to obtain more flexible and optimal condition. In this study, the machining conditions have head speed, oscillation speed and polishing time. By using optimum condition, it achieves a ultra precision mirror like surface.

Keywords

References

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