• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.3
• /
• pp.9-15
• /
• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Proceedings of the KSME Conference
• /
• 2004.11a
• /
• pp.1231-1235
• /
• 2004

The needs of micro scale thermal detecting technique are increasing in biology and chemical industry. For example, Thermal finger print, Micro PCR(polymer chain reaction), ${\mu}TAS$ and so on. To satisfy these needs, we developed a DTSA(Diode Temperature Sensor Array) for detecting and controlling the temperature on small surface. The DTSA is fabricated by using VLSI technique. It consists of 32 ${\times}$ 32 array of diodes (1,024 diodes) for temperature detection and 8 heaters for temperature control on a 8mm ${\times}$ 8mm surface area. The working principle of temperature detection is that the forward voltage drop across a silicon diode is approximately proportional to the inverse of the absolute temperature of diode. And eight heaters ($1K{\Omega}$) made of poly-silicon are added onto a silicon wafer and controlled individually to maintain a uniform temperature distribution across the DTSA. Flip chip packaging used for easy connection of the DTSA. The circuitry for scanning and controlling DTSA are also developed

• Transactions on Electrical and Electronic Materials
• /
• v.15 no.4
• /
• pp.221-225
• /
• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• Journal of the Korean Society for Precision Engineering
• /
• v.29 no.1
• /
• pp.109-113
• /
• 2012

The LED failure rate greatly depends on the physical properties of packaging materials (epoxy). The glass transitions temperature (Tg) of the epoxy is one of the most important physical properties. Therefore, in the present study, various epoxies with high Tg were prepared and their failure shapes were analyzed. In addition, the failure shapes depending on the amount of epoxy and the wire bonding structure were measured. As a consequence, the lower failure rate was obtained with the smaller amount of epoxy. The safety of LED was improved with increasing the Tg of the epoxy.

• Proceedings of the KWS Conference
• /
• 2006.10a
• /
• pp.190-192
• /
• 2006

The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2003.07a
• /
• pp.1005-1008
• /
• 2003

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

• Journal of the Korean institute of surface engineering
• /
• v.29 no.6
• /
• pp.709-713
• /
• 1996

Mechanical solderless chip packaging with small gold bumps or metal balls has increased in the electronic devices. The preparation of conductive particles (5~7 $\mu\textrm{m}$ diamiter) by electroless nickel plating have been investigated. Generally, batch type electroless plating is applied to provide conductivity on the nonconductors. Since the surface areas of particles are much larger than the bulk substrate, accordingly the electroless plating bath becomes unstable. Thus, we applied the continuous dropping method for the preparation of conductive particles. The uniform coverage of deposited nickel on the particles was obtained by using ammonium acetate as a complexing agent, and surface coverage is further improved without coagulation of particles by the surface active agent treatment before enter the plating bath.

• Journal of the Korean Society for Precision Engineering
• /
• v.17 no.7
• /
• pp.45-51
• /
• 2000

지난 세기부터 MEMS 제작 기술을 이용하여 만들어진 시스템들을 의학이나 생물학적인 용도로 응용하기 위한 많은 연구가 활발히 이루어져 왔다. 기술적인 측면에서 이러한 연구들은 MEMS 분야의 초창기에 강조되어 온 표면 및 몸체 미세 가공 기술(surface ＆ bulk micromachining)과 같은 미세 구조물 제작 기술의 발전에 힘입은 바 크다. 그러나 MEMS 기술이 점차 발전되어 오면서, 가공 기술이 고도화되고 미세 시스템의 구조가 점차 복잡해짐에 따라, 많은 연구들이 단순한 가공기술을 넘어 미세 시스템을 조립하고 집적화할 수 있는 기술, 접합 (bonding) 기술, 패키징 (packaging) 기술, 3차원 형상의 제작 기술, 실리콘(silicon)이나 유리(glass)가 아닌 다른 재료를 이용한 미세 가공 기술 등의 개발을 중심으로 이루어지고 있다.(중략)

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.71-71
• /
• 2009

Recently several LCD TV makers including Samsung, LG and Sony actively have released LED LCD TV models on market. LED LCD TV is just which applied LED BLUs so that its color contrast ratio fairly enhance up to 1 million:1 and its thickness minimize to a few mm. Even this aspect seems somewhat to be each panel maker's strategies for prior market occupations on whole TV market. Without regard to the reasons, we do obviously meet a new era of technically advanced LCD TV. However we have still lots of problems or issues which we must overcome technically including LED chip/packaging process, secondary optics treatment, heat managements and cost reduction issues. Here I would like to forecast market volume and trend of LED LCD TV first and then discuss above almost of technical issues and suggest their possible solutions. Even these solutions looks better technologies and if they may increase production cost significantly, we will not prefer to choice that technology since lower cost policy can open the market. Finally I'm trying to suggest how well LED, as future light source, can apply to future LCD TV technologies.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.34 no.3
• /
• pp.251-258
• /
• 2010

This paper presents the technology for the design, fabrication, and characterization of a microfluidic system interface (MSI); the purpose of this technology is to enable the integration of complex microfluidic systems. The MSI technology can be applied in a simple manner for realizing complex arrangements of microfluidic interconnects, integrated microvalves for fluid control, and optical windows for on-chip optical processes. A microfluidic system for the preparation of genetic samples was used as the test vehicle to prove the effectiveness of the MSI technology for packaging complex microfluidic systems with multiple functionalities. The miniaturized genetic sample preparation system comprised several functional compartments, including compartments for cell purification, cell separation, cell lysis, solid-phase DNA extraction, polymerase chain reaction, and capillary electrophoresis. Additionally, the functional operation of the solid-phase extraction and PCR thermocycling compartments was demonstrated by using the MSI.