Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 29 Issue 6
- /
- Pages.709-713
- /
- 1996
- /
- 1225-8024(pISSN)
- /
- 2288-8403(eISSN)
PREPARATION OF ANISOTROPIC CONDUCTIVE FINE PARTICLES BY ELECTROLESS NICKEL PLATING.
- Fujinami, T. (Faculty of Engineering Kanto Gakuin University) ;
- Watanabe, J. (Faculty of Engineering Kanto Gakuin University) ;
- Motizuki, I. (Faculty of Engineering Kanto Gakuin University) ;
- Honma, H. (Faculty of Engineering Kanto Gakuin University)
- Published : 1996.12.01
Abstract
Mechanical solderless chip packaging with small gold bumps or metal balls has increased in the electronic devices. The preparation of conductive particles (5~7
Keywords