• 제목/요약/키워드: Non-hygroscopic property

검색결과 5건 처리시간 0.1초

$CO_2$ 냉동시스템용 PAG오일과 POE오일의 항흡습성에 관한 실험적 연구 (An Experimental Study on Non-hygroscopic Propertiy of PAG and POE Oils for a $CO_2$ Refrigeration System)

  • 이성광;강병하
    • 설비공학논문집
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    • 제20권6호
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    • pp.388-393
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    • 2008
  • This study has been conducted to select the suitable refrigeration oil for a $CO_2$ refrigeration system. Non-hygroscopic property of refrigeration oils is one of the most important properties for refrigeration oils. PAG and POE oils are considered as test oils in this study. Transient variation of water content of PAG and POE oils was measured for 3 different vessels in the environmental conditions, such as in the range of temperature $25^{\circ}C$ to $40^{\circ}C$ and relative humidity 40% to 85%. The results obtained that water content of both POE and PAG is increased with an increase in the contact area with ambient for 3 different vessels. It is also found that water content of both POE and PAG is increased as the ambient temperature and relative humidity is increased. Non-hygroscopic property of POE oil is found to be much superior than that of PAG oil.

불용성 오손물에 의한 절연물의 전기적 특성에 관한 연구 (The Electric Properties of Insulators Due to Non-soluble Contaminant)

  • 최남호;국연호;조성인;박강식;한상옥
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 하계학술대회 논문집
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    • pp.691-695
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    • 2000
  • This paper present the result of the investigation, the electric properties of insulators due to non-soluble contamination. In general, the humidity and the amount of soluble salts such as NaCl, MgCl$_2$are the most dominant factor. Though the non-soluble do not distribute on conductivity of contaminant layer, that has the hygroscopic property. For this study, we make a mini-fog chamber with transparent acryl and the kaoline was used for non-soluble contaminant. The kaoline was applied with sprayer to get the specific ESDD and NSDD value, then the specimen was dried and installed horizontally. And to measure the leakage current a DAS system was developed with LabView. With the result, we could know the influence of non-soluble content and the relationship between NSDD and ESDD.

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불용성 오손물에 의한 절연물의 전기적 특성에 관한 연구 (The Electric Properties of Insulators Due to Mon-soluble Contaminant)

  • 한상옥;장태인;강지원;조성배
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 하계학술대회 논문집 C
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    • pp.1785-1787
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    • 2000
  • This paper present the result of the investigation, the electric properties of insulators due to non-soluble contamination. In general, the humidity and the amount of soluble salts such as NaCl, $MgCl_2$ are the most dominant factor. Though the non-soluble do not distribute on conductivity of contaminant layer, that has the hygroscopic property. For this study, we make a mini-fog chamber with transparent acryl and the kaoline was used for non-soluble contaminant. The kaoline was applied with sprayer to get the specific ESDD and NSDD value, then the specimen was dried and installed horizontally. And to measure the leakage current a DAS system was developed with LabView. With the result, we could know the influence of non-soluble content and the relationship between NSDD and ESDD.

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오손조건에 따른 애자의 섬락 특성에 관한 연구 (A Study on the Flashover Properties of Insulators with Artifitial Pollution)

  • 송치훈;조성인;국연호;남궁도;한상옥
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 하계학술대회 논문집
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    • pp.679-682
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    • 2000
  • This paper present the result of the flashover properties of inulators due to artifitial pollution. For this study, a mini fog chamber has been fabricated with transparent acryl which has the merit in observasion and electrical insulation. All the experiment was carried in mini fog chamber. Though non-souble contaminant do not distribute on the electric conductivity of contaminant and contaminated insulator, that influence on the flashover characteristics of insulators. with the result, we assume phenomenon caused with the hygroscopic property of non-soluble contaminant.

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전도성 접착제를 이용한 패키징 기술 (Recent Advances in Conductive Adhesives for Electronic Packaging Technology)

  • 김종웅;이영철;노보인;윤정원;정승부
    • 마이크로전자및패키징학회지
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    • 제16권2호
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    • pp.1-9
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    • 2009
  • Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental friendliness, finer pitch feasibility and lower temperature processing. This review focuses on the recent research trends on the reliability and property evaluation of anisotropic and non-conductive films that interconnect the integrated circuit component to the printed circuit board or other types of substrate. Major topics covered are the conduction mechanism in adhesive interconnects; mechanical reliability; thermo-mechanical-hygroscopic reliability and electrical performance of the adhesive joints. This review article is aimed at providing a better understanding of adhesive interconnects, their principles, performance and feasible applications.

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