Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Recent Advances in Conductive Adhesives for Electronic Packaging Technology

전도성 접착제를 이용한 패키징 기술

  • 김종웅 (성균관대학교 마이크로 전자 패키징 연구소) ;
  • 이영철 (성균관대학교 신소재공학과 대학원) ;
  • 노보인 (성균관대학교 신소재공학과) ;
  • 윤정원 (성균관대학교 마이크로 전자 패키징 연구소) ;
  • 정승부 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
  • Published : 2009.06.30
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Abstract

Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental friendliness, finer pitch feasibility and lower temperature processing. This review focuses on the recent research trends on the reliability and property evaluation of anisotropic and non-conductive films that interconnect the integrated circuit component to the printed circuit board or other types of substrate. Major topics covered are the conduction mechanism in adhesive interconnects; mechanical reliability; thermo-mechanical-hygroscopic reliability and electrical performance of the adhesive joints. This review article is aimed at providing a better understanding of adhesive interconnects, their principles, performance and feasible applications.

Keywords

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