• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.20 no.6
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• pp.388-393
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• 2008

This study has been conducted to select the suitable refrigeration oil for a $CO_2$ refrigeration system. Non-hygroscopic property of refrigeration oils is one of the most important properties for refrigeration oils. PAG and POE oils are considered as test oils in this study. Transient variation of water content of PAG and POE oils was measured for 3 different vessels in the environmental conditions, such as in the range of temperature $25^{\circ}C$ to $40^{\circ}C$ and relative humidity 40% to 85%. The results obtained that water content of both POE and PAG is increased with an increase in the contact area with ambient for 3 different vessels. It is also found that water content of both POE and PAG is increased as the ambient temperature and relative humidity is increased. Non-hygroscopic property of POE oil is found to be much superior than that of PAG oil.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.691-695
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• 2000

This paper present the result of the investigation, the electric properties of insulators due to non-soluble contamination. In general, the humidity and the amount of soluble salts such as NaCl, MgCl$_2$are the most dominant factor. Though the non-soluble do not distribute on conductivity of contaminant layer, that has the hygroscopic property. For this study, we make a mini-fog chamber with transparent acryl and the kaoline was used for non-soluble contaminant. The kaoline was applied with sprayer to get the specific ESDD and NSDD value, then the specimen was dried and installed horizontally. And to measure the leakage current a DAS system was developed with LabView. With the result, we could know the influence of non-soluble content and the relationship between NSDD and ESDD.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1785-1787
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• 2000

This paper present the result of the investigation, the electric properties of insulators due to non-soluble contamination. In general, the humidity and the amount of soluble salts such as NaCl, $MgCl_2$ are the most dominant factor. Though the non-soluble do not distribute on conductivity of contaminant layer, that has the hygroscopic property. For this study, we make a mini-fog chamber with transparent acryl and the kaoline was used for non-soluble contaminant. The kaoline was applied with sprayer to get the specific ESDD and NSDD value, then the specimen was dried and installed horizontally. And to measure the leakage current a DAS system was developed with LabView. With the result, we could know the influence of non-soluble content and the relationship between NSDD and ESDD.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.679-682
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• 2000

This paper present the result of the flashover properties of inulators due to artifitial pollution. For this study, a mini fog chamber has been fabricated with transparent acryl which has the merit in observasion and electrical insulation. All the experiment was carried in mini fog chamber. Though non-souble contaminant do not distribute on the electric conductivity of contaminant and contaminated insulator, that influence on the flashover characteristics of insulators. with the result, we assume phenomenon caused with the hygroscopic property of non-soluble contaminant.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.1-9
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• 2009

Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental friendliness, finer pitch feasibility and lower temperature processing. This review focuses on the recent research trends on the reliability and property evaluation of anisotropic and non-conductive films that interconnect the integrated circuit component to the printed circuit board or other types of substrate. Major topics covered are the conduction mechanism in adhesive interconnects; mechanical reliability; thermo-mechanical-hygroscopic reliability and electrical performance of the adhesive joints. This review article is aimed at providing a better understanding of adhesive interconnects, their principles, performance and feasible applications.