• Title/Summary/Keyword: Non-adhesive

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An Experimental Study on the Adhesion Property of Self Adhesive Rubberized Asphalt Waterproofing Sheet (자착식 고무화 아스팔트 방수시트의 접착특성에 관한 실험적 연구)

  • Jeoung Hyoun-Sang;Kang Hyo-Jin;Song Je-Young;Oh Sang-Keun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2005.05a
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    • pp.1-4
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    • 2005
  • This study is to examine adhesion the characteristics of self adhesive asphalt to minimize of the construction periods and the environmental problems through the performance estimation of materials to reduce waterproof problem and the long durability maintenance of building structures. This study tested the estimation items of self rubberized adhesive asphalt to examine the sheet discovered the most important problem in the construction site and the connection stability in the sheet joint. Besides, this study examined the material characteristics such as tension property, tear property, temperature dependence, heat resistance, adhesion stability and so on. Test results of the separative items satisfied in the reference figure of connection stability and adhesion stability which could confirm adhesion performances and other items also satisfied in the reference.

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First Report of Two Nematode-trapping Fungi, Monacrosporium ullum sp. nov. and Arthrobotrys amerospora, from Korea

  • Kim, Dong-Geun;Ryu, Young-Hyun;Hwang, Hyung-Gue
    • The Plant Pathology Journal
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    • v.22 no.2
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    • pp.174-178
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    • 2006
  • Monacroporium ullum sp. nov. the captures nematodes on adhesive spherical knobs was isolated from soil around Codonopsis lanceolata at Ulleung island, Korea. The spindle-shaped conidia sized $17-44{\mu}m\;(26.5{\mu}m)\;long,\;7-10{\mu}m\;(8.1{\mu}m)$ wide, containing from 1 to 4 cross-walls but most often divided by 2 septa (47%). Resting bodies sized $57{\times}30{\mu}m$. Arthrobotrys amerospora has almost spherical non-septate conidia with a small truncate protuberance at the base and sized $20-27{\mu}m\;(23.3){\mu}m$ long and $11-17{\mu}m\;(14.1){\mu}m$ wide. Conidiophores are somewhat longer $362.8{\mu}m\;(311-418{\mu}m)$ than its original description ($75-250{\mu}m$).

Nondestructive Strength Evaluation of Adhesive-Bonded Single-Lap Joints by Signal Processing Method (신호처리기법을 이용한 단순겹치기 접착이음의 비파괴적 강도평가)

  • Jeong, Il-Hwa;O, Seung-Kyu;Hwang, Yeong-Taik;Jang, Chul-Seob;Jeong, Eui-Seob;Yi, Won
    • Proceedings of the KSME Conference
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    • 2001.06a
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    • pp.541-546
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    • 2001
  • Application of bonding by adhesives can be found in many industries, particularly in advanced technological domains such as the aeronautical and space industries, automobile manufacture, and electronics. Periodic inspection with conventional ultrasonic NDE techniques is capable of indicating the presence and possible location of crack. Continuous ultrasonic attenuation monitoring has potential to supply information. This study used adhesive-bonded single-lap joints specimen to evaluate such possibility by ultrasonic signal processing method.

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Stability of Tip in Adhesion Process on Atomic Force Microscopy Studied by Coupling Computational Model

  • Senda, Yasuhiro;Blomqvist, Janne;Nieminen, Risto M.
    • Applied Science and Convergence Technology
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    • v.26 no.1
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    • pp.6-10
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    • 2017
  • We investigated the stability of ionic configurations of the tip of the cantilever in non-contact AFM.; For this, we used a computational model that couples the ionic motion of the MgO surface and the oscillating cantilever. The motion of ions was connected to the oscillating cantilever using a coupling method that had been recently developed. The adhesive process on the ionic MgO surface leads to energy dissipation of the cantilever. It is shown that limited types of ionic configurations of the tip are stable during the adhesive process. Based on the present computational model, we discuss the adhesive mechanism leading to energy dissipation.

Recent Advances in Conductive Adhesives for Electronic Packaging Technology (전도성 접착제를 이용한 패키징 기술)

  • Kim, Jong-Woong;Lee, Young-Chul;Noh, Bo-In;Yoon, Jeong-Won;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.2
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    • pp.1-9
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    • 2009
  • Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental friendliness, finer pitch feasibility and lower temperature processing. This review focuses on the recent research trends on the reliability and property evaluation of anisotropic and non-conductive films that interconnect the integrated circuit component to the printed circuit board or other types of substrate. Major topics covered are the conduction mechanism in adhesive interconnects; mechanical reliability; thermo-mechanical-hygroscopic reliability and electrical performance of the adhesive joints. This review article is aimed at providing a better understanding of adhesive interconnects, their principles, performance and feasible applications.

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Ultrastructure of the fertilized egg envelopes in Ancistrus cirrhosus, Loricariidae, Teleostei

  • Dong Heui Kim
    • Applied Microscopy
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    • v.50
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    • pp.13.1-13.7
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    • 2020
  • We examined the morphology of fertilized egg and ultrastructures of fertilized egg envelopes of Ancistrus cirrhosus belong to Loricariidae using light and electron microscopes. The fertilized eggs formed a mass on the spawning place and were yellowish, spherical, non-transparent, demersal, adhesive, and a narrow perivitelline space. But, the adhesiveness of fertilized eggs was disappeared after spawning excluding contact parts. The micropyle with funnel shape was surrounded by 15-19 furrow lines of egg envelope in a spoke-like pattern. The outer surface of egg envelope has smooth side and inner surface of egg envelope was rough with grooves. Also, the total thickness of the fertilized egg envelope was about 32.58 ± 0.85 ㎛ (n = 20), and the fertilized egg envelope consisted of three layers, an outer adhesive electron-dense layer, a middle layer with low electron density and an inner electron-dense layer with grooves in counter structure from other most teleost. Collectively, these morphological characteristics and adhesive property of fertilized egg, and ultrastructures of micropyle, outer surface, and section of fertilized egg envelope are showed species specificity.

A Study on Tensile Shear Characteristics of Dissimilar Joining Between Pre-coated Automotive Metal Sheets and Galvanized Steels with the Self-Piercing Rivet and Hybrid Joining (Self-Piercing Rivet과 Hybrid Joining을 이용한 자동차용 선도장 칼라강판과 용융아연도금강판의 접합부 기계적 성질 평가)

  • Bae, Jin-Hee;Kim, Jae-Won;Choi, Ildong;Nam, Dae-Geun;Kim, Jun-Ki;Park, Yeong-Do
    • Journal of Welding and Joining
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    • v.34 no.1
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    • pp.59-67
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    • 2016
  • The automotive manufactures increase their use of lightweight materials to improve fuel economy and energy usage has a significant influence on the choice of developing materials. To meet this requirements manufacturers are replacing individual body parts with lightweight metals, for these the process treating and painting surfaces is changing. The pre-coated steels are newly developed to avoid the conventional complex and non-environmental painting process in the body-in-white car manufacturing. The development of new joining techniques is critically needed for pre-coated steel sheets, which are electrically non-conductive materials. In the present study, dissimilar combination of pre-coated steel and galvanized steel sheets were joined by the self-piercing rivet, adhesive bonding and hybrid joining techniques. The tensile shear test and free falling high speed crash test were conducted to evaluate the mechanical properties of the joints. The highest tensile peak load with large deformation was observed for the hybrid joining process which has attained 48% higher than the self-piercing rivet. Moreover, the hybrid and adhesive joints were observed better strain energy compared to self-piercing rivet. The fractography analyses were revealed that the mixed mode of cohesive and interfacial fracture for both the hybrid and adhesive bonding joints.

Clinical Analysis of Adhesive Ileus in Children (소아의 유착성 장폐쇄증에 대한 임상적 고찰)

  • Lee, Jong-Jae;Youn, Hyun-Jo;Jeong, Yeoun-Jun;Kim, Jae-Chun
    • Advances in pediatric surgery
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    • v.7 no.2
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    • pp.118-125
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    • 2001
  • The effectiveness of operative and non-operative management for postoperative adhesive ileus in children has been discussed. This study reviews the clinical characteristics and the treatment consequences of adhesive ileus in our institution. Department of Surgery of Chunbuk National University Hospital, retrospectively. A total of 62 cases of post-operative small bowel obstruction treated between January 1975 and December 1998 under the 15 years of age are included in this study. The patients were divided into two groups, operative(n=26) and non-operative(n=36) groups. The prevalent age was between 11 and 15 years(28 cases; 45.2 %), and the most common previous operation was appendectomy(28 cases; 45.2 %). The most common operative procedures were adhesiolysis(17 cases; 65.4 %). The interval between admission and operation was 1 day in 11 cases(42.3 %). The most common site of adhesion was the ileum in 13 cases(50.0 %) and band constriction was the most frequent pattern(8 cases; 30.8 %). Intestinal resection was significantly high in delayed operations of more than four days, in the patients with three or more classical signs of strangulation(fever, tachycardia, leukocytosis, abdominal pain, rebound tenderness), and in the cases of complete obstruction on plain abdomen film(p < 0.05). In conclusion, operation should be considered in cases with three or more signs of strangulation, no clinical improvement for over four days of conservative treatment, and signs of complete obstruction on plain abdomen film during the observation periods.

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Shear Performance Evaluation of Composite Thermal Insulation with Quasi-Non-Combustible according to Adhesive Type (부착 유형에 따른 준불연 복합단열판 전단성능평가)

  • Choi, Ki-Sun;Oh, Keunyeong;Park, Keum-Sung;Ha, Soo-Kyung
    • Journal of the Korea Institute of Building Construction
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    • v.22 no.5
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    • pp.507-518
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    • 2022
  • The purpose of this research is to obtain experimental data for developing a structural design of an external insulation system by evaluating the shear performance of a composite insulation system according to the adhesive type. The shear performance of the composite insulation system was experimentally evaluated by considering a simultaneous placement method, full and spot/edge coverage using adhesive mortar. As a result of the test, the shear strength of simultaneous placement and full coverage method was almost similar, the spot/edge coverage method was about 80% of them. Also, the simultaneous placement method is considered to be constructively advantageous when applied as an external insulation system to a high-rise building compared to using an adhesive mortar.