Proceedings of the KSME Conference (대한기계학회:학술대회논문집)

The Korean Society of Mechanical Engineers (대한기계학회)
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Nondestructive Strength Evaluation of Adhesive-Bonded Single-Lap Joints by Signal Processing Method

신호처리기법을 이용한 단순겹치기 접착이음의 비파괴적 강도평가

  • 정일화 (숭실대 기계공학과 대학원) ;
  • 오승규 (숭실대 기계공학과 대학원) ;
  • 황영택 (숭실대 기계공학과 대학원) ;
  • 장철섭 (숭실대 기계공학과 대학원) ;
  • 정의섭 (한국과학기술정보연구원) ;
  • 이원 (숭실대 기계공학과)
  • Published : 2001.06.27
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Abstract

Application of bonding by adhesives can be found in many industries, particularly in advanced technological domains such as the aeronautical and space industries, automobile manufacture, and electronics. Periodic inspection with conventional ultrasonic NDE techniques is capable of indicating the presence and possible location of crack. Continuous ultrasonic attenuation monitoring has potential to supply information. This study used adhesive-bonded single-lap joints specimen to evaluate such possibility by ultrasonic signal processing method.

Keywords