Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2001.06a
- /
- Pages.541-546
- /
- 2001
Nondestructive Strength Evaluation of Adhesive-Bonded Single-Lap Joints by Signal Processing Method
신호처리기법을 이용한 단순겹치기 접착이음의 비파괴적 강도평가
Abstract
Application of bonding by adhesives can be found in many industries, particularly in advanced technological domains such as the aeronautical and space industries, automobile manufacture, and electronics. Periodic inspection with conventional ultrasonic NDE techniques is capable of indicating the presence and possible location of crack. Continuous ultrasonic attenuation monitoring has potential to supply information. This study used adhesive-bonded single-lap joints specimen to evaluate such possibility by ultrasonic signal processing method.
Keywords
- Adhesive-Bonded Single-Lap Joints;
- NDE(Non-Destructive Evaluation);
- Ultrasonic Wave;
- Strength Evaluation;
- Signal Processing Method
- 단순겹치기 접착이음;
- 비파괴평가;
- 초음파;
- 강도평가;
- 신호처리기법;