• 한국정밀공학회지
• /
• 제9권2호
• /
• pp.52-60
• /
• 1992

In this study on the development of the heat flux sensor, unlike the common heat-flux sensor with thermocouple, the heat-treated adhesive-tupe film nickel-gauge was used in measuring temperature. The proposed its Ni-gauge is bound to be compatible with platinum gauge(Pt-Gauge) in its linearity. It is also considered to be cheap in economical sense. In the evaluation of it's performance, the numerical analysis is essential to investigate charateristics of proper sensor and the adequate analsis is depended upon boundary conditions and actual conditions. There are many types of heat flux sensor in the market, and adhexive type flux sensor is most common. In the present investigation, this type of heat flux sensor had been chosen. The figure of the sensor under consideration is an open cavity type, which is calculated numerically by SIMPLER algorithm. The temperature distributions of the sensor predicted by numerical calculation for steady and unsteady states are able to give the chacteristics of the adhesive type heat flux sensor(1st heat flux sensor) according to the heat flux. It means that the outvoltage, the sensitivity, and the performances of responsibility could be evaluated as a result. Through this analysis improved heat flux sensor(2nd heat flux sensor) could be predicted with the reflection of proper operating temperature($150^{\circ}C$) of the Ni-gauge.

• 전기화학회지
• /
• 제6권2호
• /
• pp.103-112
• /
• 2003

리튬이차전지 음극활물질로 사용되는 합성흑연입자에 여러종류금속을 코팅하여 그 전기화학적특성을 조사하였으며, 구체적인 코팅방법으로는 가스분산스프레이 코팅법을 적용하였다. 본 연구범위내에서 금속을 코팅한 입자로 제조된 전극은 충방전시 형성되는 계면저항을 감소시킴으로서 결과적으로 원시료에 비해서 높은 방전용량을 나타내었다. CV실험을 통해서 은과 주석은 리튬과의 합금반응을 확인할 수 있었으나, 2.5 중량$\%$ 이하의 낮은 코팅량을 고려했을 때, 높은 분산도를 지닌 금속 물질의 코팅을 통한 전극 활물질 표면의 균일한 전도도의 증가가 주요원인인 것으로 사료되었다. 단일계 금속으로 코팅하였을 경우 은코팅한 전극활물질이 가장 높은 방전용량과 사이클특성을 나타내었고, 은을 기본으로 하는 이성분계에서는 은-니켈전극이 가장 높은 고율특성을 나타내었다.

• Transactions on Electrical and Electronic Materials
• /
• 제14권3호
• /
• pp.133-138
• /
• 2013

Acrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films.

• 한국재료학회지
• /
• 제5권7호
• /
• pp.794-801
• /
• 1995

LCD 모듈을 위한 실장 기술인 Chip on Glass 공정 기술을 개발함에 있어 구동 IC와 기판d의 Al 전극을 연결하기 위하여 기존의 기술과의 연관성 및 공정의 연속성, 제조단가등을 고려하여 Pb-Sn 범프를 사용하고자 하였으며 이를 위해 Al 금속 박막위에 니켈 무전해 도금하는 방법을 연구 하였다. Al 전극에 무전해 니켈 도금하기 위해서는 광레지스트 차폐막을 손상하지 않는 전처리 방법이 필요하기 때문에 전처리 방법으로서 알칼리 아연산염 처리법과 불화물을 이용한 아연산염 처리법을 선택하여 실시하였다. 이 가운데 산성불화암모늄(NH$_4$HF)을 1.5 g/$\ell$ 함유하고 황산아연(ZnSO$_4$)을 100 g/$\ell$ 함유한 산성 아연산염 용액에서는 광레지스트 차폐막이 손상되지 않았으며 처리시간을 적절히 조절함으로써 알루미늄 박막상에 선택적으로 니켈 무전해 도금을 할 수 있었다. 아연산염 응액중의 첨가제와 무전해 도금액 중의 억제제인 Thiourea는 도금층의 평활도를 높이는 역할을 하였다. 또한 아연산염 처리를 하기 전에 산세 처리를 함으로써 도금층의 균일성을 향상시킬 수 있었다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
• /
• pp.208-208
• /
• 2013

Graphene has emerged as a fascinating material for next-generation nanoelectronics due to its outstanding electronic properties. In particular, graphene-based field effect transistors (GFETs) have been a promising research subject due to their superior response times, which are due to extremely high electron mobility at room temperature. The biggest challenges in GFET applications are control of carrier concentration and opening the bandgap of graphene. To overcome these problems, three approaches to doping graphene have been developed. Here we demonstrate the decoration of Ni nanoparticles (NPs) on graphene films by simple annealing for p-type doping of graphene. Ni NPs/graphene films were fabricated by coating a $NiCl2{\cdot}6H2O$ solution onto graphene followedby annealing. Scanning electron microscopy and atomic force microscopy revealed that high-density, uniformly sized Ni NPs were formed on the graphene films and the density of the Ni NPs increased gradually with increasing $NiCl2{\cdot}6H2O$ concentration. The formation of Ni NPs on graphene films was explained by heat-driven dechlorination and subsequent particlization, as investigated by X-ray photoelectron spectroscopy. The doping effect of Ni NPs onto graphene films was verified by Raman spectroscopy and electrical transport measurements.

• 한국결정성장학회지
• /
• 제16권6호
• /
• pp.256-259
• /
• 2006

Vapor phase epitaxy(VPE)법을 사용하여 amorphous $SiO_x$. nanowires를 성장시켰다. Ni thin film을 촉매로 사용하여 Si 기판위에 $800{\sim}1100^{\circ}C$ 범위의 온도에서 성장시켰으며, $SiO_x$ nanowires의 성장 메커니즘은 Vapor-liquid-solid(VLS)으로 확인되었다. $SiO_x$ nanowires의 shape와 morphology는 scanning electron microscope(SEM)으로 분석하였으며, cotton-like형태이고 길이는 $10{\mu}m$정도였다. 그리고 구조적 특징은 transmission electron microscope(TEM)으로 관찰하였고, $SiO_x$ nanowires의 성분 분석은 energy dispersed X-ray spectroscopy(EDS)로 하였다. EDX spectrum으로 nanowires가 Si와 O로 구성되어졌음을 확인하였다.

• 한국표면공학회지
• /
• 제51권4호
• /
• pp.231-236
• /
• 2018

We report p-type electrical characteristics of the amorphous $La_2NiO_{4+{\delta}}$ thin films which were sputtered on the glass substrates using an RF sputtering system. As-deposited thin films at room temperature and $300^{\circ}C$ were amorphous in nature. Post-annealing of the thin film samples over $400^{\circ}C$ resulted in the nano-crystallization of the $La_2NiO_{4+{\delta}}$. The electrical properties of the films were much dependent on the oxygen partial pressure, temperature of the post-annealing and sputtering ambient. The as-deposited samples at room temperature show a hole concentration of $7.82{\times}10^{13}cm^{-3}$, and it could be increased as high as $3.51{\times}10^{22}cm^{-3}$ when the films were post-annealed in an oxygen atmosphere at $500^{\circ}C$. Such p-type conductivity behavior of the $La_2NiO_{4+{\delta}}$ films suggests that the amorphous and nano-crystallized $La_2NiO_{4+{\delta}}$ films have potential for the application as p-type semiconductive or conductive materials at low temperatures where material diffusion is limited.

• 한국자기학회지
• /
• 제8권6호
• /
• pp.369-373
• /
• 1998

본 연구에서는 마그네트론 스퍼터링 법으로 제작한 Ni-Fe/NiO 이층 박에서, NiO 증착 중 Ar 압력에 따른 교환이 방성의 변화를 고찰하엿으며 이를 미세조작과 관련시켜 해석하고자 하였다. 낮은 Ar 압력에서 증착한 Ni-Fe/NiO 이층막은 우수한 교환이방성 특성을 나타내었으나 Ar 압력이 증가함에 따라 교환이방성은 급격하게 감소하였다. 낮은 Ar 압력에서 증착한 시편은 NiO와 Ni-Fe 계면에서 epitaxy 경향을 나타내었으며 그 계면은 평범하고 그 경계는 두렷하게 구분하였다. 그러나 높은 Ar 압력에서 증착한 시편은 NiO와 Ni-Fe의 경계가 뚜렷하게 구분되지 않고 그 계면 또한 평활하지 않았다. 한편 NiO의 조성은 Ar압력의 증가에 따라 산소의 조성이 점점 증가하였다.

• Current Photovoltaic Research
• /
• 제12권1호
• /
• pp.1-5
• /
• 2024

Perovskite solar cells have exhibited a remarkable increase in efficiency from an initial 3.8% to 26.1%, marking a significant advancement. However, challenges persist in the commercialization of perovskite solar cells due to their low stability with respect to humidity, light exposure, and temperature. Moreover, the instability of the organic charge transport layer underscores the need for exploring inorganic alternatives. In the manufacturing process of the perovskite solar cells' oxide charge transport layer, ultraviolet-ozone (UVO) treatment is commonly applied to enhance the wettability of the perovskite solution. The UVO treatment on metal oxides has proven effective in suppressing surface oxygen vacancies and removing surface organic contaminants. This study focused on the characterization of nickel oxide as the hole transport material in perovskite solar cells, specifically investigating the impact of UVO treatment on film properties. Through this analysis, changes induced by the UVO treatment were observed, and consequent alterations in the device characteristics were identified.

• 대한기계학회논문집A
• /
• 제30권11호
• /
• pp.1369-1375
• /
• 2006

In this work, mechanical characteristics of stainless steel diaphragm have been studied as a potential robust substrate and a diaphragm material for micromachined devices. Lamination process techniques combined with traditional micromachining processes have been adopted as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on a stainless steel diaphragm have been designed, fabricated and characterized. The fabrication process for stainless steel micromachined devices keeps the membrane and substrate being at the environment of 8.65MPa pressure and $175^{\circ}C$ for a half hour and then subsequently cooled to $25^{\circ}C$. Each sensor uses a stainless steel substrate, a laminated stainless steel film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The finite element method is adopted to investigate residual stresses formed in the process. Besides, out-of-plane deflections are calculated under pressures on the diaphragm. The sensitivity of the device fabricated using these technologies is 9.03 ppm $kPa^{-1}$ with a net capacitance change of 0.14 pF over a range 0$\sim$180 kPa.