• Korean Chemical Engineering Research
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• v.46 no.5
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• pp.868-874
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• 2008

The Ni based adsorbent was prepared by co-precipitation method and its performance for removing carbon monoxide was investigated. Here, silica, aluminium silicate and ${\gamma}$-alumina were used for carriers of catalyst. $Ni(NO_3)_2{\cdot}6H_2O$ and $Ni(CH_3COO)_2{\cdot}4H_2O$ were utilized for Ni precursors. Precipitants were urea and citric acid. After precipitation of Ni salt on the carrier and following reduction using $H_2$ gas, adsorbent was prepared and its performance was analyzed based on EDS, TPR and XRD experiments. In accordance with change of precipitation agents, Ni salts on carrier, carriers and reduction condition. Adsorbent performance for removing carbon monoxide was investigated. The adsorbent with 54.8 wt% Ni prepared using urea precipitant under reduction condition at $500^{\circ}C$ for 3 h exhibited the best CO removal performance.

• Journal of Surface Science and Engineering
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• v.51 no.5
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• pp.277-290
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• 2018

In this study, Pd-Ni-Ag alloy hydrogen separation membranes were fabricated by Pd/Ag/Pd/Ni/Pd multi-layer sputter deposition on the modified MIM(Metal Injection Molding)-PSS(Porous Stainless Steel) support and followed heat treatment. Nickel, used as an alloying element in Pd alloy membranes, is inexpensive and stable material in a hydrogen isotope environment at high temperature up to 1123 K. Hydrogen perm-selectivity of Pd-Ni-Ag alloy membranes is affected not only by composition of membrane films but also by other factors such as surface properties of PSS support, microstructure of membrane films and inter-diffused impurities from PSS support. In order to clarify the effect of surface Ni composition on hydrogen perm-selectivity of Pd-Ni-Ag alloy membranes, the other effects were significantly minimized by the formation of dense and homogeneous Pd-Ni-Ag alloy membranes. Hydrogen permeation test showed that hydrogen permeability decreased from $7.6{\times}10^{-09}$ to $1.02{\times}10^{-09}mol/m{\cdot}s{\cdot}Pa^{0.5}$ as Ni composition increased from 0 to 16 wt% and the selectivity for $H_2/N_2$ was infinite.

• Journal of the Korean Chemical Society
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• v.43 no.2
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• pp.28-231
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• 1999

• Journal of Welding and Joining
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• v.16 no.1
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• pp.25-37
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• 1998

본 해설에서는 Inconel계와 Hastelloy계로 구분되는 9%Ni강용 피복아크용접봉을 중심으로 LNG저장탱크 용접시공시 발생 가능한 문제점들을 검토하고, Ni합금 피복봉의 심선과 피복제와 관련한 일반적인 제조특성을 살펴보았다. 또한 현재 국내 현장에서 용접시공에 사용되는 용접재료의 화학적, 기계적 특성과 함께 용접작업성을 평가한 결과 이들 피복아크용접봉들은 규격이 정한 요구조건들을 만족하면서 비교적 양호한 용접작업성을 확보하고 있는 것으롤 판단되었다. 이상의 검토결과는 향후 9%Ni강용 Ni합금 피복아크용접봉의 국산화 개발에 기초자료로 활용될 것으로 기대된다.

• Bulletin of the Korean Chemical Society
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• v.23 no.12
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• pp.1724-1728
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• 2002

The adsorption of proteins on the surface of glass slides is essential for the construction of protein chips. Here, we report that a Histidine (His)-tagged protein protein has been efficiently adsorbed on glass coated with nickel. A variety of nickel chloride-coated plates were prepared by the spin-coating method and adsorbed to the His-tagged protein. When the protein was adsorbed onto the surface of a variety of nickel chloride-coated glass slides, the efficiency of protein adsorption was dependent upon the coating conditions such as nickel chloride concentration, the spin speed and the drying temperature. The slides appropriate for protein adsorption were obtained when the slides were coated with 11%(w/w) of $NiCl_2$ at the spin speed of 4000 rpm for 20 sec and then dried at higher than 40°C. The physical properties of their nickel chloride thin layer were characterized by scanning electron microscopy. x-ray diffraction and atomic force microscopy, finding that the nickel chloride particles were around 10 nm in diameter and uniformly crystallized at 101 faces. These results show that nickel chloride-coated slides prepared by the spin-coating method are utilizable for the construction of Histagged protein chips.

• Journal of Powder Materials
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• v.30 no.6
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• pp.502-508
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• 2023

With the increasing demand for electronic products, the amount of multilayer ceramic capacitor (MLCC) waste has also increased. Recycling technology has recently gained attention because it can simultaneously address raw material supply and waste disposal issues. However, research on recovering valuable metals from MLCCs and converting the recovered metals into high-value-added materials remains insufficient. Herein, we describe an electrospinning (E-spinning) process to recover nickel from MLCCs and modulate the morphology of the recovered nickel oxide particles. The nickel oxalate powder was recovered using organic acid leaching and precipitation. Nickel oxide nanoparticles were prepared via heat treatment and ultrasonic milling. A mixture of nickel oxide particles and polyvinylpyrrolidone (PVP) was used as the E-spinning solution. A PVP/NiO nanowire composite was fabricated via E-spinning, and a nickel oxide nanowire with a network structure was manufactured through calcination. The nanowire diameters and morphologies are discussed based on the nickel oxide content in the E-spinning solution.

• Journal of Welding and Joining
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• v.13 no.4
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• pp.147-154
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• 1995

In order to study the bonding mechanism of Ni/B/Ni transient liquid phase bonding system, width of liquid layers were calculated, where in this system melting point of insert material(B) is higher than bonding temperature and melting point of base metal(Ni). Caclulated values were compared with experimental ones which were measured by bonding Ni/B/Ni system at 1433-1474K under vacuum atmosphere. As results, the width of initial liquid layer of Ni/B/Ni system was calculated as $W_{IL}$ = $W_{o}$[1 + {2.100..rho.$_{S/}$ ( $X_{3}$ + $X_{4}$)..rho.$_{Ni}$ }-.rho.$_{S/}$.rho. Ni/], and it was nearly same with experimental values. Maximum width of liquid layer, width of liquid layer during isothermal solidification and isothermal solidification time were calculated also.o.o.o.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.8 no.2
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• pp.209-223
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• 1998

The aim of this study was to evaluate welders' exposure to hexavalent chromium (Cr(VI)) and nickel (Ni) during welding operations in a Korean shipyard. The airborne Cr(VI) and Ni concentrations were measured during metal inert gas (MIG) welding on mild and stainless steel, and manual metal arc (MMA) welding on mild steel. The geometric mean (GM) of Cr(VI) concentrations inside the welding helmet during MIG welding on mild steel were $0.0018mg/m^3$ inside a ship section, and $0.0015-0.0026mg/m^3$ at the welding shops. All of the personal breathing zone air samples were below the American Conference of Governmental Industrial Hygienists (ACGIH) Threshold Limit Value ($TLV^{(R)}$) of $0.01mg/m^3$. Conversely, eighty-eight percent(21 of 24) of the personal breathing zone air samples exceeded the National Institute for Occupational Safety and Health (NIOSH) recommended exposure limit of $0.001mg/m^3$. Ni was not detected on 20 of 23 air samples collected during MIG welding on mild steel. The three Ni samples above the limit of detection ranged from 0.015 to $0.044mg/m^3$. The GM of Cr(VI) concentrations during MMA welding on mild steel were $0.0013mg/m^3$, but Ni was not detected in the air samples during this operation. It is assumed that the airborne Cr(VI) and Ni during mild steel welding were derived from the base metals which contained about 0.03% Cr and 0.03% Ni. The GM of airborne total Cr, Cr(VI) and Ni concentrations during MIG welding on stainless steel were 4.02, 0.13 and $0.86mg/m^3$, respectively, and the levels of Cr(VI) and Ni were above the ACGIH-$TLV^{(R)}$. Cr(VI) comprised about 35.5% of the total chromium(Cr) from MIG welding on mild steel, and about 8.4% of total Cr from MIG welding on stainless steel. The ratios of Cr(VI) to total Cr were significantly different among welding shops. It was concluded that welders were exposed to high levels of Cr(VI) and Ni during welding on stainless steel, and were exposed to low levels of Cr(VI) even during welding on mild steel.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.16-22
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• 2008

We fabricated thermally-evaporated 10 nm-Ni/30 nm and 70 nm Poly-Si/200 nm-$SiO_2/Si$ structures to investigate the thermal stability of nickel silicides formed by rapid thermal annealing(RTA) of the temperature of $300{\sim}1100^{\circ}C$ for 40 seconds. We employed for a four-point tester, field emission scanning electron microscope(FE-SEM), transmission electron microscope(TEM), high resolution X-ray diffraction(HRIXRD), and scanning probe microscope(SPM) in order to examine the sheet resistance, in-plane microstructure, cross-sectional microstructure evolution, phase transformation, and surface roughness, respectively. The silicide on 30 nm polysilicon substrate was stable at temperature up to $900^{\circ}C$, while the one on 70 nm substrate showed the conventional $NiSi_2$ transformation temperature of $700^{\circ}C$. The HRXRD result also supported the existence of NiSi-phase up to $900^{\circ}C$ for the Ni silicide on the 30 nm polysilicon substrate. FE-SEM and TEM confirmed that 40 nm thick uniform silicide layer and island-like agglomerated silicide phase of $1{\mu}m$ pitch without residual polysilicon were formed on 30 nm polysilicon substrate at $700^{\circ}C\;and\;1000^{\circ}C$, respectively. All silicides were nonuniform and formed on top of the residual polysilicon for 70 nm polysilicon substrates. Through SPM analysis, we confirmed the surface roughness was below 17 nm, which implied the advantage on FUSI gate of CMOS process. Our results imply that we may tune the thermal stability of nickel monosilicide by reducing the height of polysilicon gate.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.