• Advances in environmental research
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• v.6 no.2
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• pp.147-158
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• 2017

This paper represents a set of experimental tests on remediation of nickel-contaminated kaolin by Electrokinetic method. For this purpose, we conducted unenhanced and EDTA-enhanced Electrokinetic tests in one, three, and five days of treatment. In unenhanced tests, we used deionized water as an electrolyte in the anode and the cathode compartments. In the EDTA-enhance tests, we used ethylenediaaminetetra acetic acid 0.1 Molar in the cathode and sodium hydroxide 0.1 Molar in the anode. The average nickel removal for unenhanced tests after three and five days of treatment was 19 and 23 percent, respectively. High buffer capacity of the soil is responsible for low removal efficiency in the unenhanced tests, which maintained pH close to the initial amount that restrained nickel as an adsorbed or precipitated forms. The average nickel removal for EDTA-unenhanced tests after three and five days of treatment was 22 and 12 percent, respectively. Lower ionic mobility of EDTA-Ni complex in comparison with $Ni^{+2}$, which is the main transportation mechanism for this complex, could be responsible for less removal efficiency in EDTA-enhanced test.

• Resources Recycling
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• v.17 no.2
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• pp.63-69
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• 2008

The adsorption features of $Ni^{2+}$ onto spent alkaline manganese batteries powder have been investigated with the adsorbent dose, initial concentration of adsorbate and temperature as the experimental variables. The adsorption reaction of $Ni^{2+}$ ion followed the pseudo-second order rate model, and the adsorption rate constants($k_2$) decreased with increasing initial concentration of nickel ion. The equilibrium adsorption data were fitted to the Langmuir and Freundlich models. The Freundlich model represents the equilibrium data better than the Langmuir model in this initial adsorbate concentration range. As the temperature increased, the adsorbed amount of nickel ion at equilibrium was also increased, which indicated that the adsorption reaction was endothermic. Based on the experimental results obtained along with temperatures, thermodynamic parameters such as ${\Delta}H^{\circ},\;{\Delta}G^{\circ},\;and\;{\Delta}S^{\circ}$ were calculated.

• Journal of the Korean Electrochemical Society
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• v.9 no.2
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• pp.95-99
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• 2006

Electrochemical properties were studied for a single particle of active material of hydrogen storage alloy $(MmNi_{3.55}Co_{0.75}Mn_{0.4}Al_{0.3})$ and nickel hydroxides $(NiOH)_2$ for the secondary Nickel Metal Hydride (Ni-MH) batteries using the microelectrode, which was manipulated to make electrical contact with an active material particle for cyclic voltammograms (CV) and potential-step experiments. As a result of CV test, it was found that three kinds of hydrogen oxidation peaks at -0.9, -0.75 and -0.65 V and hydrogen evolution peak at -0.98 V for hydrogen storage alloy were separately observed and two kinds of peaks of proton oxidation/reduction at 0.45 and 0.32 V and oxygen evolution reaction (OER) at 0.6 V for nickel hydroxides were also more clearly observed. Furthermore hydrogen diffusion coefficient within a single particle was also found to vary the order between $10^{-9}\;and\;10^{-10}cm^2/s$ over the course of hydrogenation and dehydrogenation process for potential-step experiments.

• Resources Recycling
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• v.29 no.4
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• pp.51-57
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• 2020

Separation of Co and Ni over Mg from the sulfuric acid solutions using Cyanex272, PC88A and Versatic acid 10 as an extractant was carried out. From the comparative studies about the extraction behavior of Co, Ni and Mg, Versatic acid 10 was superior to Cyanex272 and PC88A for the selective extraction of cobalt and nickel from the mixed solutions. About 98% of Ni and Co were extracted at equilibrium pH 7.0 and less than 5% of Mg was co-extracted by Versatic acid 10. McCabe-Thiele diagram indicated two stages requirement for Co and Ni extraction by 10% Versatic acid 10 at pH 7.0 and phase ratio (A/O) of 2.0. The loaded Co and Ni in organic phase was stripped effectively the sulfuric acid concentration above 70 g/L. 99.78% of cobalt and 98.42% of nickel were stripped.

• Journal of Marine Life Science
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• v.7 no.2
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• pp.102-112
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• 2022

Crucian carp, Carassius carassius (Weight 39.7±3.1 g, Length 14.8±0.5 cm) were exposed to waterborne nickel at 0, 10, 20, 40, 80 and 160 mg Ni²⁺/l. The lethal concentration 50 (LC₅₀) of C. carassius exposed to waterborne nickel was 117.69 mg Ni²⁺/l. In hematological parameters, RBC counts was significantly increased at 48 hours, whereas a significant decrease was observed at 96 hours. The MCV and MCH were significantly increased in the concentration of 80 mg Ni²⁺/l at 96 hours. The plasma components such as calcium, magnesium, glucose, cholesterol, total protein, AST, ALT and ALP were significantly changed by waterbonre nickel exposure. The results of this study suggest that the nickel exposure to C. carassius affects the survival rates, hematological parameters and plasma components as toxicity

• Korean Journal of Materials Research
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• v.14 no.6
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• pp.389-393
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• 2004

The silicide layer used as a diffusion barrier in microelectronics is typically required to be below 50 nm-thick and, the same time, the silicides also need to have low contact resistance without agglomeration at high processing temperatures. We fabricated Si(100)/15 nm-Ni/15 nm-Co samples with a thermal evaporator, and annealed the samples for 40 seconds at temperatures ranging from $700^{\circ}C$ to $1100^{\circ}C$ using rapid thermal annealing. We investigated microstructural and compositional changes during annealing using transmission electron microscopy and auger electron spectroscopy. Sheet resistance of the annealed sample stack was measured with a four point probe. The sheet resistance measurements for our proposed Co/Ni composite silicide was below 8 $\Omega$/sq. even after annealing $1100^{\circ}C$, while conventional nickel-monosilicide showed abrupt phase transformation at $700^{\circ}C$. Microstructure and auger depth profiling showed that the silicides in our sample consisted of intermixed phases of $CoNiSi_{x}$ and NiSi. It was noticed that NiSi grew rapidly at the silicon interface with increasing annealing temperature without transforming into $NiSi_2$. Our results imply that Co/Ni composite silicide should have excellent high temperature stability even in post-silicidation processes.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.22.2-22.2
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• 2009

Currently, metal silicides become increasingly more essential part as a contact material in complimentary metal-oxide-semiconductor (CMOS). Among various silicides, NiSi has several advantages such as low resistivity against narrow line width and low Si consumption. Generally, metal silicides are formed through physical vapor deposition (PVD) of metal film, followed by annealing. Nanoscale devices require formation of contact in the inside of deep contact holes, especially for memory device. However, PVD may suffer from poor conformality in deep contact holes. Therefore, Atomic layer deposition (ALD) can be a promising method since it can produce thin films with excellent conformality and atomic scale thickness controllability through the self-saturated surface reaction. In this study, Ni thin films were deposited by thermal ALD using bis(dimethylamino-2-methyl-2-butoxo)nickel [Ni(dmamb)2] as a precursor and NH3 gas as a reactant. The Ni ALD produced pure metallic Ni films with low resistivity of 25 $\mu{\Omega}cm$. In addition, it showed the excellent conformality in nanoscale contact holes as well as on Si nanowires. Meanwhile, the Ni ALD was applied to area-selective ALD using octadecyltrichlorosilane (OTS) self-assembled monolayer as a blocking layer. Due to the differences of the nucleation on OTS modified surfaces toward ALD reaction, ALD Ni films were selectively deposited on un-coated OTS region, producing 3 ${\mu}m$-width Ni line patterns without expensive patterning process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.7
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• pp.575-579
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• 2010

The technologies of Ni/Cu plating contact is attributed to the reduced series resistance caused by a better contact conductivity of Ni with Si and the subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading was combined with the lower resistance of a metal silicide contact and an improved conductivity of the plated deposit. This improves the FF (fill factor) as the series resistance is reduced. This is very much requried in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A Selective emitter structure with highly dopeds regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing In this paper the formation of a selective emitter, and the nickel silicide seed layer at the front side metallization of silicon cells is considered. After generating the nickel seed layer the contacts were thickened by Cu LIP (light induced plating) and by the formation of a plated Ni/Cu two step metallization on front contacts. In fabricating a Ni/Cu plating metallization cell with a selective emitter structure it has been shown that the cell efficiency can be increased by at least 0.2%.

• Bulletin of the Korean Chemical Society
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• v.33 no.5
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• pp.1643-1646
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• 2012

Three Ni-based catalysts with different clay as support were prepared and tested in the hydrogenation of maleic anhydride, among which Ni/clay1 showed best activity and selectivity. Over Ni/clay1 catalyst prepared by impregnation method, 97.14% conversion of maleic anhydride and 99.55% selectivity to succinic anhydride were obtained at $180^{\circ}C$ under a pressure of 1 MPa. Catalytic activity was greatly influenced by the temperature and weighted hourly space velocity. Catalyst deactivation studies showed that this catalyst have a long life time, the yield of MA still higher than 90% even after a reaction time of 60 h. X-ray diffraction (XRD) and $H_2$ temperature programmed reduction (TPR) were use to investigate the properties of the catalyst. XRD and TPR studies showed that Ni was present as $Ni^{2+}$ on the support, which indicated that there was no elemental nickel ($Ni^0$) and $Ni_2O_3$ in the unreduced samples. The formation of Ni was strong impact on catalytic activity.

• Journal of the korean academy of Pediatric Dentistry
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• v.27 no.2
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• pp.274-282
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• 2000

Stainless steel crowns are widely used for restoration for primary molars. The material used for the crowns is an alloy of $70\sim80%$ nickel and $5\sim15%$ chromium. Nickel has been known to cause allergic reaction, cancer and cell toxicity. Little is known about nickel with respect to the relationship between Ni-contained SS crown and graining of Ni-resistance in oral microorganisms. The purpose of this study is to examine whether use of Ni-contained SS crown leads to occurrence of Ni-resistant microorganism, especially enterococci. The gingival crevicular fluid of two different groups was taken. Experimental group included patients wearing SS crown, and control group comprised individuals without SS crown. The samples were plated in BHI agar, BHI agar supplemented with nickel chloride at the concentration of 3mM and bile esculin azide (BEA) agar. The cultured enterococci on BEA agar medium were tested their Ni-resistance in nickel-containing media increasing concentrations from 3mM to 50mM. The results were as follows: 1. In experimental group, a total of 507,350 strains were isolated on BHI agar, of which 53,864(10.62%) strains were found to be resistant to 3mM nickel. In control group, of 414,590 isolates on BHI agar, 37,523 isolates were resistant to 3mM nickel. 2. A total of 95 enterococci were isolated on BEA agar in experimental group, while 20 were isolated in control group. of the enterococci, 68 and 12 isolates were found to be nickel-resistant in experimental and control group, respectively. 3. Of 68 nickel-resistant isolates in experimental group, one survived 50mM nickel. In contrast, none of the isolates in control group was observed to grow at the concentrations over 30mM nickel.