• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.462-462
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• 2013

Gallium Oxide (Ga2O3) has been widely investigated for the optoelectronic applications due to its wide bandgap and the optical transparency. Recently, with the development of fabrication techniques in nanometer scale semiconductor materials, there have been an increasing number of extensive reports on the synthesis and characterization of Ga2O3 nano-structures such as nano-wires, nanobelts, and nano-dots. In contrast to typical vaporliquid-solid growth mode with metal catalysts to synthesis 1-dimensional nano-wires, there are several difficulties in fabricating the nanostructures by using sputtering techniques. This is attributed to the fact that relatively low growth temperatures and higher growth rate compared with chemical vapor deposition method. In this study, Ga2O3 chestnut burr were synthesized by using radio-frequency magnetron sputtering method. In contrast to typical sputtering method with sintered ceramic target, a Ga2O3 powder (99.99% purity) was used as a sputtering target. Several samples were prepared with varying the growth parameters, especially he growth time and the growth temperature to investigate the growth mechanism. Samples were characterized by using XRD, SEM, and PL measurements. In this presentation, the details of fabrication process and physical properties of Ga2O3 nano chestnut burr will be reported.

• Journal of Industrial Technology
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• v.25 no.B
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• pp.121-126
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• 2005

Micro wires manufactured by the straightening process are used in the BT(Bio-Technology), IT(Information-Technology), NT(Nano-Technology). We have developed a novel wire straightener which uses the direct heating method(DHM) for straightening the micro wire and shearing device for burr-less cutting. In this study, we confirm the tendency of micro wire after the shearing process. It is impossible to remove the burr in the shearing process. However, the embodiment of minimum burr size after the shearing process is the best in-process method. In order to minimize the burr size, we have accomplished the various experiment condition such as the U-groove, the effect of the counter punch, the shear angle, clearance.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.6
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• pp.71-75
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• 2006

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its usage in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. The target of this paper is the analysis of FIB sputtering process according to tilt angle, dwell time and overlap for application of 3D micro and pattern fabrication and to find the effective beam scanning conditions using Taguchi method. Therefore we make the conclusions that tilt angle is dominant parameter for sputtering yield. Burr size is reduced as tilt angle is higher.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.245-248
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical property. This thin foil tensile specimen manufacturing technology is a method that can make a metal thin foil specimen for micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect that precision mechanical property of micro/nano material and component. Micro and Nano mechanical property can be measured using this technology and mechanical property data base of micro/nano material and component can be constructed.

• Transactions of Materials Processing
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• v.14 no.6 s.78
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• pp.509-513
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical properties using micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect precision mechanical property of micro/nano material and component.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.12
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• pp.1272-1278
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• 2012

The micro barrier rip array structures have been applied in a variety of areas including as privacy films, micro heat sinks, touch panel and optical waveguide. The increased aspect ratio (AR) of barrier rip array structures is required in order to increase the efficiency and performance of these products. There are several problems such as burr, defect of surface roughness and deformation and breakage of barrier rip structure with machining high-aspect ratio micro barrier rip array structure using orthogonal cutting method. It is essential to develop technological methods to solve these problems. The optimum machining conditions for machining micro barrier rip array structures having high-aspect ratio were determined according to lengths ($200{\mu}m$ and $600{\mu}m$) and shape angles ($2.89^{\circ}$ and $0^{\circ}$) of diamond tool, overlapped cutting depths ($5{\mu}m$ and $10{\mu}m$), feed rates (100 mm/s) and three machining processes. Based on the optimum machining conditions, micro barrier rib array structures having aspect ratio 30 was machined in this study.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.11
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• pp.885-891
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• 2016

3D images are generally manufactured by complex production processes. We suggested a simple method to make 3D images based on a mechanical machining technology in this study. We designed a tetrahedron consisted of many arcs having the depth of $100{\mu}m$ and the pitch of $500{\mu}m$, and machined them on an aluminum plate using end-milling under several conditions of feed-rate and depth of cut. The area of undeformed chip including depth of cut and feed-rate can predict quality of the machined arcs more precisely than the undeformed chip thickness including only feed rate. Moreover, a diamond tool can improve the quality than a CBN tool when many arcs are machined. Based on the analysis, the designed tetrahedron having many arcs was machined with no burr, and it showed different images when observed from the left and right directions. Therefore, it is verified that a 3D image can be designed and manufactured on a metal plate by end-milling under optimized machining conditions.

• Journal of Powder Materials
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• v.22 no.3
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• pp.169-174
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• 2015

The optical film for light luminance improvement of BLU that is used in LCD/LED and retro-reflective film is used as luminous sign consist of square and triangular pyramid structure pattern based on V-shape micro prism pattern. In this study, we analyzed machining characteristics of Cu-plated flat mold by shaping with diamond tool. First, cutting conditions were optimizing as V-groove machining for the experiment of micro prism structure mold machining with prism pattern shape, cutting force and roughness. Second, the micro prism structure such as square and triangular pyramid pattern were machined by cross machining method with optimizing cutting conditions. Burr and chip shape were discussed with material properties and machining method.

• Laser Solutions
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• v.11 no.4
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• pp.29-34
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• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.