• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.39-42
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• 2005

For mass production, usually injection mold has multi-cavity which is filled through geometrical balanced runner system. Despite geometrical balanced runner system, filling imbalances between cavity to cavity have always been observed. These filling imbalances are one of the most significant factors to affect quality of plastic parts when molding plastic parts in multi-cavity injection mold. Filling imbalances are results from non-symmetrical shear rate distribution within melt as it flows through the runner system. It has been possible to decrease filling imbalance by optimizing processing conditions, but it has not completely eliminated this phenomenon during injection molding processing. This paper presents a solution of these filling imbalances through using 'runner core pin'. The runner core pin which is developed in this study creates a symmetrical shear distribution within runner. As a result of using runner core pin, a remarkable improvement in reducing filling imbalance was confirmed.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.42-46
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• 2006

For mass production, usually injection mold has multi-cavity which is filled through geometrical balanced runner system. Despite geometrical balanced runner system, filling imbalances between cavity to cavity have always been observed. These filling imbalances are one of the most significant factors to affect quality of plastic parts. Filling imbalances are results from non-symmetrical shear rate distribution within melt when it flows through tile runner system. It has been possible to decrease filling imbalance by optimizing processing conditions, but it has not completely eliminated this phenomenon during injection molding processing. This paper presents a solution for these filling imbalances by using Runner Core pin (RC pin). The Runner Core pin which is developed in this study creates a symmetrical shear distribution within runner. As a result of using Runner Core pin, a remarkable improvement in reducing filling imbalances was confirmed.

• Nuclear Engineering and Technology
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• v.49 no.6
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• pp.1339-1345
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• 2017

In the framework of the EU funded project NURESAFE, the subchannel code CTF and the neutronics code DYN3D were integrated and coupled on the NURESIM platform. The developments achieved during this 3-year project include assembly-level and pin-by-pin multiphysics thermal hydraulics/neutron kinetics coupling. In order to test this coupling, a PWR rod ejection transient was simulated on a MOX/UOX minicore. The transient is simulated using two different models of the minicore. In the first simulation, both codes model the core with an assembly-wise resolution. In the second simulation, a pin-by-pin fuel-centered model is used in CTF for the central assembly, and a pin power reconstruction method is applied in DYN3D. The analysis shows the influence of the different models on global parameters, such as the power and the average fuel temperature, but also on local parameters such as the maximum fuel temperature.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.13-16
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• 2005

For mass production, usually injection mold has multi-cavity which is filled through geometrical balanced runner system. Despite geometrical balanced runner system, filling imbalances between cavity to cavity have always been observed. These filing imbalances are one of the most significant factors to affect quality of plastic parts when molding plastic parts in multi-cavity injection mold. Filling imbalances are results from non-symmetrical shear rate distribution within melt as it flows through the runner system. It has been possible to decrease filling imbalance by optimizing processing conditions, but it has not completely eliminated this phenomenon during injection molding processing. This paper presents a solution of these filling imbalances through using 'runner core pin'. The runner core pin which is developed in this study creates a symmetrical shear distribution within runner. As a result of using runner core pin, a remarkable improvement in reducing filling imbalance was confirmed.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.5
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• pp.971-978
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• 2018

This paper deals with the design and implementation of a limiter, which is a key component of the Ku-band radar system. The limiter design with the multi-pin diode switch was complemented by wideband signal attenuation, and realized the physical implementation. In the test result of implemented limiter, when the pin diode switch is all off, it is possible to transmit the incoming signal without distortion. Also when the pin diode switch is turned on sequentially, the input signal is attenuated about 20dB or more step by step. Finally when all of them were turned on, attenuation about 50dB or more were measured for a wide bandwidth(1000MHz) in Ku-band.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.706-709
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• 2005

Despite geometrical balanced runner system, filling imbalances between cavity to cavity have always been observed in multi-cavity injection mold. These filling imbalances are results from non-symmetrical shear rate distribution within melt as it flows through the runner system. It has been possible to decrease filling imbalance by optimizing processing conditions, but it has not completely eliminated this phenomenon during the injection molding processing. This paper presents a solution of these filling imbalances by using runner core pin which creates a symmetrical shear distribution within runner and the effects on filling imbalance when modifying a shape of runner core pin. As a result of using runner core pin, a remarkable improvement in reducing filling imbalance was confirmed. In addition we investigated how filling imbalances were affected by shape of runner core pin.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.7
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• pp.1-12
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• 2014

This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.04a
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• pp.74-78
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• 2003

Stress analysis was conducted with finite element method to study the stress distributions in both single-pin and multi-pin loaded composite laminates. The various parameters involved in the design of the joint method were considered. The stress distributions in the vicinity of the holes were predicted considering the effects of various parameters such as the lay-ups, number of pins, number of rows, row spacing, and hole patterns. The results show that the performance of joint is greatly affected by these parameters.

• Journal of the Korea Society of Computer and Information
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• v.20 no.1
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• pp.143-151
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• 2015

Biometric technology has been proposed as a new means to replace conventional PIN or password because it is hard to be lost and has the low possibility of illegal use. However, unlike a PIN, password, and personal information there is no way to modify the exposure if it is exposed and used illegally. Therefore, the existing single modality with single biometrics is critical when it expose. However in this paper, we use a multi-modality and multi-biometrics to authenticate between users and TTP or between users and financial institutions. Thereby, we propose a more reliable method and compared this paper with existed methods about security and performance in this paper.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.225-226
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• 2010