• The Magazine of the IEIE
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• v.20 no.11
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• pp.46-53
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• 1993

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.11a
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• pp.131-135
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• 1999

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.2
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• pp.168-173
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• 2008

In this paper, we have designed transmit/receive Module for X band which can be applied to active phase array radar system. AESA(active electrically beam steered array) is able to transmit high power as like TWTA with composition of TH Module and steer a main beam faster than mechanically steering system. The proposed structure of T/R Module for X band is brick type for physical structure, common leg structure electrically and small size design as MCM(multi chip module). The results show that the characteristic of proposed T/R module can fully cover the specification of required military radar application.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.8
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• pp.940-945
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• 2008

In this paper, we have designed the Brick Transmit/Receive Module for K-band which can be applied to active phase array radar system. The proposed structure of T/R Module for K band is brick type for MCM(Multi Chip Module) form and the satisfaction of tile type T/R Module can apply to structure of cavity and main characteristic. The fabricated brick type T/R Module confirmed the main characteristic for electrical goal performance in test and this structure can be applied to active phase array radar.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.774-782
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• 2004

This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules. In the numerical analysis, a parametric study was carried out for the parameters affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular micro-channels. In the experimental study, the cooling performance of the micro heat exchanger was tested on prototypes of stacked multi-chip modules with difference channel dimensions. The simulation results and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.8
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• pp.433-437
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• 2000

We fabricated switch module of ATM(Asynchronous Transfer Mode) exchange system with MCM-C(MultiChip Module Co-fired) technology and measured its electrical characteristics. Green tape was used as substrate and Au/Ag paste was used to form the interconnect layers. The via holes were made by drill and filled with metal paste usign screen method. After manufacturing the substrate, chips and passive components were assembled on the substrate. In electrical test, the module showed the output signal of 46.9MHz synchronized with input signal. In the view of substrate size reduction, the area of MCM switch module was 35% of conventional hybrid switch module.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.67-67
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• 2002

패키지 기술의 개발은 저비용, 고성능, 높은 패키징 효율의 추세로 가고 있다. 이러한 추세에 따라 기판재료의 개발 및 구조의 변형이 요구된다. 패키지의 한 형태인 MCM(Multi-Chip Module)에 연성기판을 사용할 경우 fine pattern이 가능하고 부피가 작기 때문에 패키지의 효율이 좋고 또한 reel to reel process에 적용이 가능하기 때문에 대량생산의 이점을 가지고 있다. 연성기판은 좋은 전기적 특성을 가진 polyimide와 구리 층으로 구성된다. 그러나 polyimide와 구리 계층 사이에 약한 접착력과 구리로의 polyamic acid의 diffusion, 다층 기판의 제조의 어려움 등의 문제점을 남겨두고 있다. 본 연구는 일반적인 polyimide/copper가 구조가 가지고 있는 문제점을 해결하고 구리 패턴을 제작하기 위해 에칭을 쓰는 것을 배제함으로 fine pattern을 이루어 내었으며 전기도금으로 완전하게 채워진 pluged via을 사용함으로 각층간의 연결에 신뢰성을 부여하였다. 또한, 연성기판의 구조적인 문제점인 해결하여 다층 연성기판을 제조하려고 한다.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.49-53
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• 1999

In this study, the characteristics of the structure of buried type capacitor for RF multi- chip-module are investigated. We developed many kinds of structures to minimize the space of capacitor in module and the value of parastic series inductance without any loss in capacitance, and in this procedure the effect of vias especially position, size, number length are analyzed and optimized. This characteristics of structures are checked through HFSS(high frequency structure simulator) of HP, and the value of parastic series inductance is calculated by equivalent circuit analysis. And ensuing the result of simulation, we made buried type capacitors using LTCC (low temperature cofired ceramic) material. In measurement of this sample, we found out the effective and precise method can be applied to buried type and characteristics of vias and striplines added for measuring are quantified.

• Progress in Superconductivity
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• v.3 no.1
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• pp.17-22
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• 2001

Practical implementation of the SFQ technology in most application requires more than single-chip-level circuit complexity. Multiple chips have to be integrated with a technology that is reliable at cryogenic temperatures and supports an inter-chip data transmission speed of tens of GHz. In this work, we have studied two basic issues in building large RSFQ circuits. The first is the reliable inter-chip SFQ pulse transfer technique using Multi-Chip-Module (MCM) technology. By noting that the energy contained in an SFQ pulse is less than an attojoule, it is not very surprising that the direct transmission of a single SFQ pulse through MCM solder bump connectors can be difficult and an innovative technique is needed. The second is the recycling of the bias currents. Since RSFQ circuits are dc current biased the large RSFQ circuits need serial biasing to reduce the total amount of current input to the circuit.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.3
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• pp.12-24
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• 2001

The key advantage of LTCC(low temperature co-fired ceramics) technology is the ability to integrate passive components such as resistors, capacitors, and inductors. More compact circuits with an increased scale of integration are needed with the development for advanced telecommunication system such as IMT-2000. LTCC technology can be obtained by removing these elements from the substrate surface to inside of ceramic body. And it can miniaturize the wireless phone through integration of planar patch antenna, duplexer, band pass filter, bias line, circuit of impedance matching and RF choke etc. Futhermore, with the multilayer chip process and its outstanding electrical material characteristics, LTCC is predestined for highly-integrated, cost effective wide band applications. This paper focuses on the general description of LTCC MCM technologies and the fabrication of the multilayer VCO module.