• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1700-1702
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• 2004

Diamond films including nanocrystallites are grown by microwave plasma chemical vapor deposition using $O_2$ additives and negative substrate bias at growth step. Effects of growth parameters on film properties are characterized by Raman spectra, SEM, and AFM images. It is found that the surface roughness and the microstructure of grown films can be controlled by changing $O_2$ gas ratio. The I-V characteristics are also investigated in terms of growth conditions of diamond films. The surface roughness and the $sp^2$ phase of the grown diamond films turn out to be crucial factors for reducing leakage currents at diamond/metal interfaces.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.93.2-93.2
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• 2010

Recently, printing and coating technologies application fields have been expanded to the energy field such as solar cell. One of the main reasons, why many researchers have been interested in printing technology as a manufacturing method, is the reduction of manufacturing cost. In this paper, We fabricated CIGS solar cell thin film layer by doctor blade methods using synthesis of CIS precursor nanoparticles ink on molybdenum (Mo) coated soda-lime glass substrate. Synthesis CIS precursor nanoparticles ink fabrication was mixed Cu, In, Se powder and Ethylenediamine, using microwave and centrifuging. Using multi coating process as we could easily fabrication a fine flatness CIS thin-film layer ($0.7{\sim}1.35{\mu}m$), and reduce a manufacture cost and process steps. Also if we use printing and coating method and solution process in each layer of CIGS solar cell (electrode, buffer), it is possible to fabricate all printed thin-film solar cell.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.3 no.2 s.5
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• pp.85-93
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• 2004

In this paper, microstrip stepped-impedance hairpin resonator (SIR) lowpass filter f.PF) by surface rnicromachining on GaAs substrate is sugsested. This filter has the advantages of compact side, easy fabrication, and sharp cutoff frequency response. The new SIR LPF shows the 3 dB passband of dc to 33 GHz, the insertion loss of 0.82 dB, and the return loss of better than 17 dB up to 25.57 GHz. This filter is useful for many microwave system applications.

• ETRI Journal
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• v.40 no.3
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• pp.389-395
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• 2018

A novel class of planar metamaterial unit-cells consisting of a peace logo pattern is presented. A significant advantage of the proposed peace-logo planar metamaterial (PLPM) unit-cell over existing designs is its tunability, simplicity, and compatibility with microstrip structures. The theoretical analysis is founded on the famous transmission-line theory for the metamaterial concept. Then, the tunable dual-band two-sided PLPM (TSPLPM) unit-cell is designed by printing a similar PLPM pattern at the bottom of the substrate. The influence of the bottom PLPM pattern on the resonance frequencies of the unit-cell was analyzed by performing numerical simulations using CST Microwave Studio 2017 and HFSSv15 simulators. The results of the numerical simulations demonstrated that the proposed TSPLPM has the ability to control the resonance frequencies over 50 GHz-75 GHz for millimeter-wave applications.

• Journal of electromagnetic engineering and science
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• v.3 no.1
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• pp.12-16
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• 2003

In this paper, low noise amplifiers with coplanar waveguide structure are presented for Wireless LAN data communication application. For comparison of microwave performance, LNAs of cascode type and balanced type using cascode cell with the same substrate and same bias conditions are designed and implemented. A cascode type of LNA shows the gain of 12.45 ㏈, input return loss of 11.63 ㏈, and noise figure of 1.52㏈. A balanced type of LNA using cascode cell shows the gain of 6.58 ㏈, input return loss of 16.6 ㏈, and noise figure of 1.18 ㏈.

• Proceedings of the Korean Vacuum Society Conference
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• 2002.06a
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• pp.109-109
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• 2002

• Journal of the Korean Vacuum Society
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• v.1 no.2
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• pp.277-285
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• 1992

플라즈마 화학기상증착법과 저압 화학기상증착법을 사용하여 실리콘 기판 위에 텅 스텐 박막을 증착하였다. 반응기체로 WF6를 사용하였으며 환원기체로는 SiH4를 사용하였다. 플라즈마 증착법에 의한 텅스텐 박막의 성장은 환원기체의 유무에 상관없이 주로 기상 반응 에 의한 텅스텐 덩어리들의 증착에 의하여 이루어졌으며 비교적 균일도가 낮은 박막표면을 이루었다. 저압 화학증착법의 경우 환원기체를 사용하지 않았을 때에는 실리콘 기판에 의한 제한된 환원반응에 의해 텅스텐이 증착되었으나, 환원기체를 사용했을 때에는 초기의 실리 콘 기판에 의한 환원반응과 이어 일어나는 SiH4 기체와의 불균일계 환원반응의 두 단계반응 에 의하여 텅스텐 박막 증착이 이루어졌다. 저압 화학증착법의 경우 텅스텐 박막의 특성은 플라즈마 증착법에서 보다 우수하였으며 박막 성장은 island by island 양식을 따르는 것으 로 추정되었다. 박막은 $\alpha$-W의 체심입방 구조로 이루어졌으며 박막이 성장함에 따라 단결정 구조가 증가하였다.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.39-43
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• 2001

$SiC_{x}N$_{y}$ film is deposited by electron cyclotron resonance plasma chemical vapor deposition system using $SiH_4$(5% in Ar), $CH_4$ and $N_2$. Ternary phase $SiC_{x}N$_{y}$ thin film deposited at the microwave power of 600 W and substrate temperature of 700 contains considerable amount of strong C-N bonds. Change in $CH_4$flow rate can effectively control the residual film stress, and typical surface roughness of 34.6 (rms) was obtained. Extreme]y high hardness (3952 Hv) and optical transmittance (95% at 633 nm) was achieved, which is suitable for a LIGA mask membrane application.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.855-858
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• 2003

Carbon nanotubes (CNTs) were grown on Ni-coated TiN/Si substrate by microwave plasma chemical vapor deposition using mixture gas of $H_2/CH_4$ at low temperature of 500 $^{\circ}C$. Average diameter of CNTs could be easily controlled by $H_2$ plasma pretreatment time before CNTs growth. The turn-on voltages of CNT emitters were varied from 3.5 $V/{\mu}m$ to 9 $V/{\mu}m$ according to the hydrogen pretreatment conditions. The close relationship between electron emission characteristics and pretreatment time indicates that pretreatment condition can be a key process parameter in CNTs growth for field emission displays..

• Electrical & Electronic Materials
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• v.9 no.6
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• pp.626-631
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• 1996

현재 선진국에서는 전자기기에서 복사되는 전자파 및 이에 노출되었을 때의 내성에 대해서 동시에 규제하고 있다. 따라서 전자기기에서 사용하는 신호의 주파수가 점점 높아지고 회로가 집적화되므로 회로설계에 포함되지 않는 기생 소자의 영향도 연구되어져야 한다. 그러므로 이러한 조건을 모두 고려하여 초고주파 회로를 완전하게 설계제작할 수 있다면 이는 이상적인 기술이라 할 수 있을 것이다. 이것을 이루려면 많은 시간 동안의 연구와 분석을 통해 최종 생산물이 되기까지 대단한 노력이 요구된다. 본문에서는 초고주파 인쇄 회로 기판을 설계할 때 고려해야 할 점, 즉, 유전율 및 유전체의 두께, 소자 실장, 접지면 부착 및 회로의 패키지화에 관해서 소개하고자 한다.