• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.89-96
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• 2004

Micro-tensile testing system, consisting of a micro tensile loading system and micro-ESPI(Electronic Speckle Pattern Interferometry) system, has been developed for measurement of micro-tensile properties of thin micro-materials. Micro-tensile loading system had a load cell with the maximum capacity of 50N and micro actuator with resolution of 4.5nm in stroke. The system was used to apply a tensile load to the micro-sized specimen. During tensile loading, the micro-ESPI system acquired interferornetric speckle patterns in the deformed specimen and measured the in-plane tensile strain. The ESPI system consisted of a CCD-camera with a lens and the window-based program developed for this experiment. Using this system, stress-strain curves for 4 kinds of electrolytic copper foil 18$\square$m thick were obtained. From these curves, tensile properties, including the elastic modulus. yielding strength and tensile strength, were determined and also values of the plastic exponent and coefficient based on Ramberg-Osgood relationship were evaluated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1442-1445
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• 2005

Several test methods, including micro strain/deformation measurement techniques, have been studied to more reliably measure the micro properties in micro/nano materials. Therefore, in this study, the continuous measurement of in-plane tensile strain in micro-sized specimens of thin film materials was introduced using the micro-ESPI technique. TiN and Au thin films 1 and $0.47\;\mu{m}$ thick, respectively, were deposited on the silicon wafer and fabricated into the micro-sized tensile specimens using the electromachining process. The micro-tensile loading system and micro-ESPI system were developed to measure the tensile strain during micro-tensile test. The micro-tensile stress-strain for these materials was determined using the algorithm for continuous strain measurement. Furthermore, algorithm for enhancing the sensitivity to measurement of in-plane tensile strain was suggested. According to the algorithm for enhancement of sensitivity, micro-tensile strain data between interfringe were calculated. It is shown that the algorithm for enhancement of the sensitivity suggested in this study makes the sensitivity to the in-plane tensile strain increase.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.240-245
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• 2004

Tensile properties of hard coating material, TiN, were evaluated using micro-tensile testing system. TiN has been known as a hard coating material commonly used today. Micro-tensile testing system consisted of a micro tensile loading system and a micro-ESPI(Electronic Speckle Pattern Interferometry) system. Micro-tensile loading system had a maximum load capacity of 500mN and a resolution of 4.5 nm in stroke. TiN thin film $1{\mu}m$ thick was deposited on the Si wafer pre-deposited of $Si_3N_4$ film substrate by the closed field unbalanced magnetron sputtering (CFUBMS) process. Three kinds of micro-tensile specimen with the respective width of $50{\mu}m$, $100{\mu}m$ and $500{\mu}m$ were fabricated by MEMS process. The mechanical properties including tensile strength and elastic modulus were determined using the micro-tensile testing system and compared by those obtained by nano-indentation

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.54-63
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• 2006

Enhancement methods of sensitivity to in-plane strain measurement by micro-ESPI(Electronic Speckle Pattern Interferometry) technique were proposed using TiN and Au thin films. Micro-tensile strain over the micro-tensile specimens, prepared in micro-scale by those films, was measured by micro-tensile loading system and micro-ESPI system developed in this study. The subsequent measurement of in-plane tensile strain in the micro-sized specimens was introduced using the micro-ESPI technique, and the micro-tensile stress-strain curves for these films were determined. To enhance the sensitivity to measurement of in-plane tensile strain, algorithms of the phase estimation by using curve fitting of inter-fringe and the discrete Fourier Transform with object-induced dynamic phase shifting were developed. Using these two algorithms, the micro-tensile strain-stress curves were generated. It is shown that the algorithms for enhancement of the sensitivity suggested in this study make the sensitivity to measurement of the in-plane tensile strain increase.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1059-1062
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• 2003

Micro-tensile testing system has been developed and micro-tensile tests for copper foil have been carried out. The system consisted of a micro tensile loading system and a micro-ESPI system for measuring strain. The loading system has a maximum loading capacity of 50N and a stroke resolution of 4.5nm. Stress-strain curves for the electro-deposited copper foil with the thickness of 18$\mu\textrm{m}$ were obtained, and tensile properties, including elastic modulus, yielding strength and tensile strength, were determined. The tensile properties obtained under three different conditions of testing speed showed a dependency on the speed.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.27-33
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• 2004

This paper is concerned with development of a micro tensile testing machine for optical functional materials such as single or poly crystal silicon and nickel film. Two micro tensile testers have been developed for various types of materials and dimensions. One of the testers is actuated by a PZT and the other is actuated by a servo motor for a precise displacement control. The specifications of PZT actuated micro tensile tester developed are as follows: the volumetric size of tester is desktop sized of 710$\times$200$\times$270 $mm^3$; the minimum load capacity and the load resolution in the load cell of 1N are 3 mN and 0.1 mN respectively; the full stroke and the stoke resolution of piezoelectric actuator are 1 mm and 10nm respectively. A special automatic specimen installing equipment is applied in order to prevent unexpected deformation and misalignment of specimens during handling of specimen for testing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.220-224
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• 2005

The technology trend of Flat Panel Display (FPD) equipments have been demanded that there are compact and multi-function. Therefore, nano/micro scale patterned on polymeric materials of Back Light Unit (BLU) in Liquid Crystal Display (LCD) that has been investigated. This paper describes a series of Horizontal Type Micro Tensile Tester that were carried out to investigate the load strain distance performance of typical polymeric material sheets. The polymeric materials film that micro size shaped specimens for tensile test are used by Cold-Isostatic-Press (CIP). Test equipment is Horizontal type Micro Tensile Tester that is presented to measure the micro scale mechanical property of thin film for FPD. This paper presents which easy testing tools measure for micro patterned on polyethylene (PET) specimens.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.245-248
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical property. This thin foil tensile specimen manufacturing technology is a method that can make a metal thin foil specimen for micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect that precision mechanical property of micro/nano material and component. Micro and Nano mechanical property can be measured using this technology and mechanical property data base of micro/nano material and component can be constructed.

• Transactions of Materials Processing
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• v.11 no.7
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• pp.561-568
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• 2002

Micro tensile test is the most direct and convenient method to measure material properties such as Young's modulus and fracture strength. It, however, needs more accurate measurement system, mote stable and repetitive alignment and more sensitive gripping than conventional tensile test. Many researchers have put their effort on overcoming these difficulties for tile development of micro tensile tester, fabricating micro specimens of functional materials and measuring their properties. This paper will review the related vigorous researches over the world in the recent decade and explain how to apply them to a design of the fester which is under our own development.

• Transactions of Materials Processing
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• v.14 no.6 s.78
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• pp.509-513
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical properties using micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect precision mechanical property of micro/nano material and component.