Improvement of Sensitivity to In-plane Strain/Deformation Measurement by Micro-ESPI Technique

마이크로 ESPI 기법에 의한 면내 변형 측정 민감도 향상

Several test methods, including micro strain/deformation measurement techniques, have been studied to more reliably measure the micro properties in micro/nano materials. Therefore, in this study, the continuous measurement of in-plane tensile strain in micro-sized specimens of thin film materials was introduced using the micro-ESPI technique. TiN and Au thin films 1 and $0.47\;\mu{m}$ thick, respectively, were deposited on the silicon wafer and fabricated into the micro-sized tensile specimens using the electromachining process. The micro-tensile loading system and micro-ESPI system were developed to measure the tensile strain during micro-tensile test. The micro-tensile stress-strain for these materials was determined using the algorithm for continuous strain measurement. Furthermore, algorithm for enhancing the sensitivity to measurement of in-plane tensile strain was suggested. According to the algorithm for enhancement of sensitivity, micro-tensile strain data between interfringe were calculated. It is shown that the algorithm for enhancement of the sensitivity suggested in this study makes the sensitivity to the in-plane tensile strain increase.