• Applied Chemistry for Engineering
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• v.31 no.3
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• pp.237-257
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• 2020

The role of nano bio-composites precursor to chitosan are innumerable and are known for having different applications in various branches of physical sciences. The application to the sensor development is relatively new, where only few literature works are available to address the specific and critical analysis of nanocomposites in the subject area. The bio-composites are potential and having greater affinity towards the heavy metals and several micro-pollutants hence, perhaps are having wider implications in the low or even trace level detection of the pollutants. The nano-composites could show good selectivity and suitability for the detection of the pollutants as they are found in the complex matrix. However, the greater challenges are associated using the bio-composites, since the biomaterials are prone to be oxidized or reduced at an applied potential and found to be a hinderance for the detection of target pollutants. In addition, the materials could proceed with a series of electrochemical reactions, which could produce different by-products in analytical applications, resulting in several complex phenomena in electrochemical processes. Therefore, this review addresses critically various aspects of an evaluation of nano bio-composite materials in the electrochemical detection of heavy metals and micro-pollutants from aqueous solutions.

• Journal of Digital Contents Society
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• v.13 no.1
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• pp.129-139
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• 2012

Recently, the smart sensor technologies are rapidly developing in accordance with the technology of implementation in small-size, low-cost, and low power consumption. With these sensor technologies, especially with MEMS and NEMS, the researches on the WSN are actively performing. For the WSN, a network security function is essential even it requires high physical resource level. But the WSN with the smart sensor technologies could not be provided with enough resources for the function because of limited size, computing-power, low-power, and etc. In this paper, we introduce security and key-management protocols of WSN.

• Proceedings of the KIEE Conference
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• 2006.10c
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• pp.470-472
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• 2006

Sensor networks are the results of convergence of very important technologies such as wireless communication and micro electromechanical systems. In recent years, sensor networks found a wide applicability in various fields such as environment and health, industry scene system monitoring, etc. A very important step for these many applications is pattern classification and recognition of data collected by sensors installed or deployed in different ways. But, pattern classification and recognition are sometimes difficult to perform. Systematic approach to pattern classification based on modem learning techniques like Multivariate Gaussian mixture models, can greatly simplify the process of developing and implementing real-time classification models. This paper proposes a new recognition system which is hierarchically composed of many sensor nodes having the capability of simple processing and wireless communication. The proposed system is able to perform context classification of sensed data using the Multivariate Gaussian function. In order to verify the usefulness of the proposed system, it was applied to intelligent dust collecting system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.337-340
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• 2004

To develop the highly sensitive Magneto-Impedance sensor, the amorphous ribbon was micro-processed to meander type sensor pattern and the filter circuit was constructed with this pattern. Its external magnetic field dependence of impedance and the output properties of the filter circuit were investigated. The impedance of the pattern had a peak value at the magnetic field of 10 Oe and its changing ratio was about 280%. The impedance change per unit magnetic field was about 36%, in which the output with high sensitivity and linearity could be obtained. The output sensitivity was about 7%/Oe at bias field of 6 Oe..

• Journal of Power System Engineering
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• v.5 no.2
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• pp.36-42
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• 2001

This paper deals with finite element analyses of residual stresses causing popping up which are induced in micromachining processes of a microaccelerometer sensors. The paddle of the micro accelerometer sensor is designed symmetric with respect to the direction of the beam. After heating the tunnel gap up to 100 degree and get it through the cooling process and the additional beam up to 80 degree and get it through the cooling process. We learn the thermal internal stresses of each shape and compare the results with each other, after heating the tunnel gap up to 400 degree during the Pt deposition process. Finally we find the optimal shape which is able to minimize the internal stresses of microaccelerometer sensor. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer sensor by electrostatic force.

• Journal of Power System Engineering
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• v.5 no.4
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• pp.11-17
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• 2001

Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor, the size of the pressure sensor diaphragm have become smaller year by year, and a microaccelerometer with a size less than $200{\sim}300{\mu}m$ has been realized, In this paper, we study some of the bonding processes of SCS(single crystal silicon) insulator wafer for the microaccelerometer. and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in micro structural engineering discipline for design of SCS insulator wafers. Successful temperature distribution analysis and design of the SCS insulator wafers based on the tunneling current concept using microaccelerometer depend on the knowledge about normal mechanical properties of the SCS and $SiO_2$ layer and their control through manufacturing processes.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.257-258
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• 2006

This paper presents the displacement sensor based on astigmatic method that has a small measurement range. The sensor has the characteristic that the measuring range is changed easily by exchanging a objective lens or distance between a objective lens and a collimator lens. The measuring range and resolution is evaluated by a laser interferometer.

• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.17-21
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• 2005

High-density image sensors have microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using W transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.

• Journal of Korea Society of Industrial Information Systems
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• v.19 no.2
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• pp.51-58
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• 2014

As WSNs(Wireless Sensor Networks) are being deployed widely in diverse application areas, their management and maintenance become more important. Recent sensor node software takes modular software architectures in pursuit of flexible software management and energy efficient reprogramming. To realize an flexible and efficient modular architecture particularly on resource constrained mote-class sensor nodes that are implemented with MCUs(Micro-Controller Units) of a single address space. an appropriate module linking model is essential to resolve and bind the inter-module global symbols. This paper identifies a design space of module linking model and respectively their implementation frameworks. We then establish a taxonomy for module linking models by exploring the design space of module linking models. Finally, we suggest an implementation framework respectively for each module linking model in the taxonomy. We expect that this work lays the foundations for systematic innovation toward more flexible and efficient modular software architectures for WSNs.

• Transactions on Electrical and Electronic Materials
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• v.6 no.3
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• pp.87-90
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• 2005

$SiO_2$ via-hole etching with a high aspect ratio is a key process in fabricating ULSI devices; however, accumulated charge during plasma etching can cause etching stop, micro-loading effects, and charge build-up damage. To alleviate this concern, charge-up damage sensor was fabricated for the ultimate goal of real-time monitoring of accumulated charge. As an effort to reach the ultimate goal, fabricated sensor was used for electrical potential measurements of via holes between two poly-Si electrodes and roughly characterized under various plasma conditions using statistical design of experiment (DOE). The successful identification of potential difference under various plasma conditions not only supports the evidence of potential charge-up damage, but also leads the direction of future study.