• Journal of Biomedical Engineering Research
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• v.39 no.6
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• pp.284-296
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• 2018

Obesity is considered as a primary health problem over the past century in line with life environmental changes. It is mainly associated with increased risk of numerous chronic diseases which may significantly reduce health-related quality of life. Therefore, efforts to reduce weight should be performed. This study suggested a novel approach to reduce body fat by applying external stimulation which is micro-current stimulation (MCS). In this clinical study, we evaluated the potential effects of MCS for reduction of abdominal fat and weight loss. Prior to the clinical test, computational simulation was conducted to find the proper MCS conditions that allow externally applied stimulation to reach the internal fat section from the external skin. Particularly, the clinical study evaluated the unilateral effects of MCS for body fat loss and lipolysis without any additional limitations such as physical exercise and dietary therapy. The results showed that whole body fat, waist circumferences, and abdominal fat are gradually decreased after intervention in proportion to the time. From the results, we can estimate that MCS can be effective on the body fat loss by activation of lipolysis in human adipose.

• Proceedings of the KIEE Conference
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• 1999.07f
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• pp.2578-2580
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• 1999

In this paper, an embedded micro processor based resistance spot welding controller is introduced which has been recently developed by Hyosung Co. Ltd. The performance of rapid and constant high current control is tested experimentally. This paper shows configurations of measuring system for high current and realtime RMS conversion techniques of sampled discrete data. A digital proportional control is adopted for this system and the result shows that this new product is working well at wide range of welding current and the performance is improved compared with some other commercially available controllers that are widely used in our industries. User friendly MMI system and a computer network system to monitor each welding processes are also presented.

• Journal of Sensor Science and Technology
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• v.23 no.1
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• pp.42-45
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• 2014

Recently, tremendous application utilizing electrospun nanofibers have been actively reported due to its several advantages, such as high surface to volume ratio, simple fabrication and high-throughput manufacturing. In this paper, we developed highly sensitive and consistent nanofiber humidity sensor by electrospinning. The humidity sensor was fabricated by rapid electrospinning (~2 sec) $TiO_2$/PVP/LiCl mixed solution on the micro-interdigitated electrode. In order to evaluate the humidity sensing performances, we measured current response using DC bias voltage under various relative humidity levels. The results show fast response / recovery time and marginal hysteresis as well as long-term stability. In addition, with the aid of micro-interdigitated electrode, we can reduce a total resistance of the sensor and increase the total reaction area of nanofibers across the electrodes resulting in high sensitivity and enhanced current level. Therefore, we expect that the electrospun nanofiber array for humidity sensor can be feasible and promising for diverse humidity sensing application.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.484-485
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• 2008

A micro-grid (MG) is a new concept to aggregate distributed generations (DGs) and loads in a small area. The difference between MG and DG is that MG can supply power to loads even in islanding conditions. The magnitude of the fault current depending on interconnection between the MG and utility and the number of DGs in the MG. Therefore, the setting value of the OCR must be changed depending on operating conditions of the MG. This paper proposes the over-current relay considering operating conditions of the MG. In the proposed algorithm, the supervisory control and data acquisition decides the operating conditions of the MG and sends the proper setting values to each OCR. The performance of the algorithm was investigated in the case of the various operating conditions.

• Journal of the Korean institute of surface engineering
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• v.43 no.5
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• pp.224-229
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• 2010

$Ni-Si_3N_4$ nano-composite coatings were prepared by pulse current (PC) electrodeposition and direct current (DC) electrodeposition techniques. The micro-structure of the coatings was characterized by scanning electron microscopy (SEM), vickers microhardness, X-Ray Diffraction (XRD) and wear-friction tests. The results showed that the micro-structure and wear performance of the coatings were affected by the electrodeposition techniques. Pulse current electrodeposited $Ni-Si_3N_4$ composite coatings exhibited higher microhardness, smooth surface, and better wear resistance properties as compared to coatings prepared under DC condition. The $Ni-Si_3N_4$ composite coatings prepared at 50 Hz pulse frequency with 10% duty cycles has shown higher codeposition of nano-particles. Consequently, increased microhardness and less plastic deformations occurred in coatings during sliding wear test. The XRD patterns revealed that the increased pulse frequencies changed the preferred (100) nickel crystallite orientations into mixed (111) and (100) orientations.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1679-1681
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• 2000

휴대 전화 및 캠코더 등의 휴대기기의 보급이 급격히 확산됨에 따라 기기의 소형화와 경량화가 제품 개발의 가장 큰 과제로 떠오르게 되었다. 특히 전자기기들은 기능이 다양해질수록 필요로 하는 부품이 늘어나게 되고, 그 결과로 불가피하게 일차로 공급되는 단일 저압의 전원으로는 구동시킬 수 없는 부분이 생기게 된다. 따라서 그들 개별 소자 또는 부품들이 구동되기 위해서는 그에 필요한 전력이 공급되어야 한다. 이러한 역할을 담당하는 것이 SMPS이며 본 연구에서는 SMPS의 전원 안정화를 담당하는 인덕터의 평면화를 구현하고자 고주파 대역에서 우수한 자기적 특성 및 높은 포화 자화 값으로 소자의 load current를 증가시킬 수 있는 PeTaN 자성 박막과 전기 저항을 낮추기 위한 MEMS 기술을 응용한 높은 aspect을 지닌 Cu 코일부, 전기적 절연을 담당하는 절연막을 사용한 평면형 인덕터를 제조하였으며, 인덕터의 특성인 인덕턴스는 약 5MHz까지 1.5${\mu}H$를 나타내며 낮은 전기 저항($2\Omega$)을 보여주었다. 특히 최근 사용되어지는 전자 부품들의 저전력, 저전압, 높은 구동전류의 실현을 위해서는 높은 load current를 지녀야 한다. 측정된 인덕터의 load current에 따른 효율은 약 200mA까지 78%의 효율을 보여 주었다.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.7
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• pp.1001-1006
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• 2012

This paper presents a carbon nanotube (CNT) triode-structure field emitter as an ion source in a micro time-of-flight mass spectrometer(TOF-MS). In the ion source by field emission, the electrons emitted from cathodes under an electric field accelerated to the anode and ionize gas molecules by impact before arriving the anode. The generated positive ions are to be accelerated to the ion collector. Whereas most of ions are drawn to the cathodes in diode field emitters, a grid in the triode field emitter prevents the ions from being drawn to the cathodes. The triode field emitter is fabricated by micromachining. The cathode is composed of six CNT cylinders. The total size of the fabricated device is $8.0{\times}7.3{\times}1.9mm^3$. The anode and the grid current of the fabricated CNT field emitter were measured for various anode and grid voltages. When the anode and the grid voltages are 1000 V and 990 V, respectively, the emission current passing through the ionization region is 8.6 ${\mu}A$, which is a sufficient emission current for ionization and mass spectrometry.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2009.10a
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• pp.521-524
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• 2009

Response to nerve stimulation platform for implementing measures to detect finger movement has been functioning as an important factor. This stimulated finger on the nerve and muscle responses would vary. In other words, the finger movement of the muscle response to nerve stimulation and sensing Actuator for the H/W development is needed. In addition, a low power embedded CPU based on the top was used. H/W configuration portion of the isolation power, constant current control, High impedance INA, amplifier parts, and the stimulus mode and the Micro-control the status of current, AD converter Low Data obtained through the processing system is implemented.

• Current Photovoltaic Research
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• v.2 no.1
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• pp.8-13
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• 2014

ZnSe/$Zn_3P_2$ heterojunctions with a substrate configuration were fabricated using a series of cost-effective processes. Thin films of ZnTe and $Zn_3P_2$ were successively grown by close-spaced sublimation onto Mo-coated glass substrates. ZnSe layers thinner than 100nm were formed by annealing the $Zn_3P_2$ films in selenium vapor. Surface selenization generated a high density of micro-cracks which, along with voids, provided shunt paths and severely deteriorated the diode characteristics. Annealing the $Zn_3P_2$ film at $300^{\circ}C$ in a $ZnCl_2$ atmosphere before surface selenization produced a dense microstructure and prevented micro-crack generation. The mechanism of micro-crack generation by the selenization was described and the suppression effect of $ZnCl_2$ treatment on the micro-crack generation was explained. ZnSe/$Zn_3P_2$ heterojunctions with low leakage current ($J_0$ < $1{\mu}A/cm^2$) were obtained using an optimized surface selenization process with $ZnCl_2$ treatment. However, the series resistance was very high due to the presence of an electrical barrier between the ZnTe and $Zn_3P_2$ layers.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.482-488
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• 2012

To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.