• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.481-482
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• 2006

Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.

• Journal of Digital Contents Society
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• v.13 no.1
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• pp.129-139
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• 2012

Recently, the smart sensor technologies are rapidly developing in accordance with the technology of implementation in small-size, low-cost, and low power consumption. With these sensor technologies, especially with MEMS and NEMS, the researches on the WSN are actively performing. For the WSN, a network security function is essential even it requires high physical resource level. But the WSN with the smart sensor technologies could not be provided with enough resources for the function because of limited size, computing-power, low-power, and etc. In this paper, we introduce security and key-management protocols of WSN.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.2
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• pp.112-115
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• 2011

To stabilize the electric characteristic of Silicon Thin Film Transistor, reducing the current leakage is most important issue. To reduce the current leakage, many ideas were suggested. But the increase of mask layer also increased the cost. On this research Bird's Beak process was use to present element. Using Silvaco simulator, it was proven that it was able to reduce current leakage without mask layer. As a result, it was possible to suggest the structure that can reduce the current leakage to 1.39nA without having mask layer increase. Also, I was able to lead the result that electric characteristic (on/off current ratio) was improved compare from conventional structure.

• The KSFM Journal of Fluid Machinery
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• v.18 no.6
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• pp.27-30
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• 2015

In this study, we attempted to harvest energy using water droplet based on Reverse Electro Wetting On Dielectric (REWOD) phenomenon between water droplet and dielectric surface without external bias. REWOD device can be fabricated via simple coating process, which is highly economic and easy. We believe that our system is well-suited for IoT(Internet of Things) embedded electronics that require low but consistent electricity. Moreover, our device can be integrated with window to generate electricity upon raindrops.

• Proceedings of the KSME Conference
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• 2000.11b
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• pp.597-602
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• 2000

In a MEMS(micro-electro mechanical system), the fluid may slip near the surface of a solid and have a discontinuous temperature profile. A numerical prediction in this slip flow region can provide a reasonable guide for the design and fabrication of micro devices. The compressible Navier-Stokes equation with Maxwell/smoluchowski boundary condition is solved for two simple systems; couette flow and pressure driven flow in a long channel. We found that the couette flow could be regarded as an incompressible system in low speed regions. For the pressure driven flow system, we observed nonlinear distribution of pressure in the long channel and numerical results showed a good agreement with the experimental results.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.145-150
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• 2000

Micro punching is one of general methods to fabricate simple holes such as permanent ink-jet printer nozzles. A thin punch, that is need for micro punching, usually has been obtained by mechanical machining. There are some method to obtain a thin punch from a cylindrical rod, e.g., microgrinding and WEDG (Wire Electro-Discharge Grinding). Inefficiently, only one punch can be obtained from these machining methods. In contrast with these methods, many punches can be fabricated simultaneously by electrochemical process. Electrochemical process has usually aimed to obtain very sharp probe for atomic force microscopy (AFM) or scanning tunneling microscopy (STM), and it has not been considered the whole shape of a probe in spite of good merits. In this paper, an ultrathin punch with a tapered shape and a cylindrical tip is newly fabricated by electrochemical process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.154-154
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• 2006

Samsung Electro Mechanics ink jet has developed ultra high resolution alignment system. The alignment system has been developed for repeatable printing of conductive ink. The resolution of alignment system is 0.5um and the velocity of printing working plate is 1.5m/s. So far repeated printing results included sintering process have over 30um of drop mislocation data. In order to improve line thickness and conductivity of metal line, we need to develop the higher mechanical accurate align system. On the demand, this developed align system has under $1{\sim}2{\mu}m$ mispositioning performance and can measure of mechanical accuracy of inkjet printer, as well as the straightness of jetted drop from inkjet head. There is no kinds limit of substrate and ink to use SEM alignment system. By using this alignment system, we progress two experiment of reiterate printing drop and making conductive line on the glass and photo paper. Optical microscope and 3D profiler has been used for measurement of printed ink.

• Industrial Engineering and Management Systems
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• v.11 no.2
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• pp.148-154
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• 2012

Micro Electric Vehicles are considered as a solution for reducing $CO_2$ emissions, however, it is difficult to evaluate its impact in a local community when it has been introduced. In this study, we evaluated how to spread the Micro EV within the community, using the utility derived from a multinomial logit model, and analyze the effect on $CO_2$ emissions. The householder's utility model is based on an investigation about Kiryu citizen's activities of shopping, transportation methods, etc. Using the geographic information system, we get the distances of each householder and the stores, and estimate a multinomial logit model about the combination choices of shopping stores and transportation method.

• Journal of the KSME
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• v.52 no.8
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• pp.46-50
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• 2012

BioMEMS(Micro Electro Mechanical System）기술은 MEMS 기술을 바이오 분야에 적용함으로써 극소량의 체액(피 타액 등)으로 각종 진단 검사를 신속하게 처리할 수 있어, 기존 중대형 의료기기의 소형화, 고기능화 및 저렴화가 가능하게 하는 기술이다. 최근 유전자 정보가 규명되면서, 정보통신기술과 접목이 더욱 가속화되고 있고, 인간의 유전자 정보를 활용한 새로운 의약품 개발과 유전자 진단기기나 의료 시술이 눈부시게 발달하고 있다. 이 글에서는 바이오칩에서 큰 주목을 받고 있는 분야인 랩 온 어 칩, 특히 감염질환인 인플루엔자 등의 진단을 위한 연구 동향을 살펴본다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05a
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• pp.197-201
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• 2002

This paper presents optimized design, fabrication and thermal characteristics of micro-heaters for thermal MEMS (micro electro mechanical system) applications using SOI and trench structures. The micro-heaters are based on a thermal measurement principle and contains thermal isolation regions of 10 ${\mu}m$-thick Si membranes consisting of oxide-filled trenches in the SOI membrane rim. The micro-heaters were fabricated with Pt-RTD on the same substrate via MgO buff layer between Pt thin-film and $SiO_2$ layer. The thermal characteristics of micro-heater with trench-free SOI membrane structure was $280^{\circ}C$ at input power 0.9 W; in the presence of 10 trenches, it was $580^{\circ}C$ due to reduction of the external thermal loss. Therefore, a micro-heater with trenches in SOI membrane rim structure provides a powerful and versatile alternative technology for enhancing the performance of micro-thermal sensors and actuators.