• Journal of the Korea Society of Computer and Information
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• v.8 no.2
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• pp.57-63
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• 2003

In this paper, we propose the hardware architecture of a scale converter which is to convert a variety range of scale into a target scale and a time sequential color control driver for LOCS (Liquid Crystal On Silicon) micro display devices which are considered advanced micro display technology in the next generation. The driver has been implemented and tested with ASIC chips.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.18-21
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• 2021

This paper analyzes the distortion correction of the in the micro DMD(digital micro mirror device) projector system using 0.25 or less optical throwing distance ratio. The distortion of projected image occurs depending on the performance of the optical lens, the installation location of the projection system, and the tilt of the screen. This study analyzed the physical tilt values influencing of the distortion of projected image, removed the tilt distortion of throwing distance ratio optical lens, and adjusted the distortion image by the simulation of calibration displacements. The results of this study demonstrated within 5% TV distortion reference. Moreover, the correction method reduced the pin-distortion correction of projection system.

• Design & Manufacturing
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• v.9 no.2
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• pp.1-5
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• 2015

Recently, as small-sized display products such as mobile phones and digital cameras have become lighter and smaller, the size of electric signal delivery part, connector for the mobile display products, also, needs to become smaller, so high-density integration like shortening the distance between signal delivery media, conductors is necessary. With the micro and high-density integration of the connector, it is necessary to maintain contact to a certain degree for keeping intensity and delivering electric signal smoothly to prevent a defect with a specific impact. Accordingly, this study carried out a structural analysis according to the operating mechanisms of 0.16CHP Class Bottom Contact FPC Connector and 0.24CHP Class BTB Connector mostly used in small-sized mobile display products such as mobile phones and digital cameras. As a result of the analysis, both connectors had lower than 997MPa, yield strength of connector material C5240-XSH, so it is judged that permanent plastic deformation would not occur, and that a contact force between the connector and FPC film occurs to a certain degree, so that there would not be any defect in electric signal delivery.

• Transactions on Electrical and Electronic Materials
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• v.7 no.1
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• pp.30-35
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• 2006

We have studied the motion of charged micro-particles that are immersed in a nematic liquid crystal (LC) and controlled by in-plane field. The LC is an anisotropic liquid such that the viscosity of the LC depends on flow direction, phase of the LC, and temperature, which affects the motion of the charged particles under the influence of electric field. This study shows that the motion of charged particles mainly depends on the applied voltage and the LC phase, but does not show any significant influence from the initial alignment of LC, although one may expect directional difference in drag force due to interaction between LC and particle. The viscosity changes due to temperature variations in nematic phase also show no signification influence on particle velocity when compared to the effect from varying in-plane field strength.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.32-38
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• 2021

We developed an inductively coupled plasma (ICP) etcher for GaN etching using a parallel plasma electrode source with a multifunctional chuck matched to it in order for the low power consumption and low process cost in comparison with the conventional ICP system with a helical-type plasma electrode source. The optimization process condition using it for the micro light-emitting diode (µ-LED) chip fabrication was established, which is an ICP RF power of 300 W, a chuck power of 200 W, a BCl₃/Cl₂ gas ratio of 3:2. Under this condition, the mesa structure with the etch depth over 1 ㎛ and the etch angle over 75° and also with no etching residue was obtained for the µ-LED chip. The developed ICP showed the improved values on the process pressure, the etch selectivity, the etch depth uniformity, the etch angle profile and the substrate temperature uniformity in comparison with the commercial ICP. The µ-LED chip fabricated using the developed ICP showed the similar or improved characteristics in the L-I-V measurements compared with the one fabricated using the conventional ICP method

• Journal of Institute of Control, Robotics and Systems
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• v.11 no.5
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• pp.451-456
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• 2005

This paper describes three kinds of experiments and analysis of their results related to human tactile sensitivity using an integrated tactile display system. The device can provide vibration, normal pressure and lateral slip/stretch which are important physical quantities to sense texture. We have tried to find out the efficient method of stimulating, limitation of surface discrimination by kinesthetic farce feedback and the effectiveness of the combination of kinesthetic force and tactile feedback. Seven kinds of different stimulating methods were carried out and they are single or combination of the kinesthetic force, normal static pressure, vibration, active/passive shear and moving wave. Both prototype specimen and stimulus using tactile display were provided to all examinees and they were allowed to answer the most similar sample. The experimental results show that static pressure is proper stimulus for the display of micro shape of the surface and vibrating stimulus is more effective for the display of fine surface. And the sensitivities of active touch and passive touch are compared. Since kinesthetic force feedback is appropriate to display shape and stiffness of an object, but roughness display has a limitation of resolution, the concurrent providing methods of kinesthetic and tactile feedback are applied to simulate physical properties during touching an object.

• Tribology and Lubricants
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• v.38 no.3
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• pp.93-100
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• 2022

Micro-light emitting diode (micro-LED) displays offer numerous advantages such as high brightness, fast response, and low power consumption. Hence, they are spotlighted as the next-generation display. However, defective LEDs may be created due to non-uniform contact loads or LED alignment errors. Therefore, a repair process involving the replacement of defective LEDs with favorable ones is necessitated. The general repair process involves the removal of defective micro-LEDs, interconnection material transfer, as well as new micro-LED transfer and bonding. However, micro-LEDs are difficult to repair since their size decreases to a few tens of micron in width and less than 10 ㎛ in thickness. The conventional nozzle-type dispenser for fluxes and the conventional vacuum chuck for LEDs are not applicable to the micro-LED repair process. In this study, transfer conditions are determined using a micro stamp for repairing micro-LEDs. Results show that the aging time should be set to within 60 min, based on measuring the aging time of the flux. Additionally, the micro-LEDs are subjected to a compression test, and the result shows that they should be transferred under 18.4 MPa. Finally, the I-V curves of micro-LEDs processed by the laser and hot plate reflows are measured to compare the electrical properties of the micro-LEDs based on the reflow methods. It was confirmed that the micro-LEDs processed by the laser reflow show similar electrical performance with that processed by the hot plate reflow. The results can provide guidance for the repair of micro-LEDs using micro stamps.

• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.251.2-251.2
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• 2007

• Proceedings of the Optical Society of Korea Conference
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• 2009.02a
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• pp.385-386
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• 2009

• Proceedings of the Optical Society of Korea Conference
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• 2006.02a
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• pp.355-356
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• 2006