• 제목/요약/키워드: Micro Etching

검색결과 425건 처리시간 0.022초

집속 이온빔 가공변수에 따른 Au 에칭 특성 연구 (The ocused Ion Beam Etching Characteristic of Au)

  • 박진주;김성동
    • 한국공작기계학회논문집
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    • 제16권5호
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    • pp.129-133
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    • 2007
  • Focused Ion Beam(FIB) systems is a useful tool for the fabrication of micro-nano scale structures. In this study, the effects of FIB etching on the Au microstructure are systematically investigated. As the fabrication parameters, ion dose, dwell time and beam overlap ratio are studied. First, the increases of Ga ion dose makes the milling yield higher and the sidewall of milling profile steeper. Dwell time is found to have little effects on the milling profile due to the relatively large milling area of $1\times1{\mu}m^2$ used in this study. However, beam overlap significantly affects not only milling rate but also milling profile. As the beam overlap ratio changes from positive to negative, the development of regular cross-stripe patterns at the bottom with low milling rate is observed.

표면 미세 가공된 구조체를 이용한 박막의 응력 측정 (Stress Measurement of films using surface micromachined test structures)

  • 이창승;정회환;노광수;이종현;유형준
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 추계학술대회 논문집
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    • pp.721-725
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    • 1996
  • The microfabricated test structures were used in order to evaluate the stress characteristics in films. The test structures were fabricated using surface micromachining technique, including HF vapor phase etching as an effective release method. The fabricated structures were micro strain gauge, cantilever-type vernier gauge and bridge for stress measurement, and cantilever for stress gradient measurement. The strain was measures by observing the deformation of the structures occurred after release etching and the amount of deformation can be detected by micro vernier gauge, which has gauge resolution of 0.2${\mu}{\textrm}{m}$. The detection principles and the degree of precision for the measured strain were also discussed. The characteristics of residual stress in LPCVD polysilicon films were studied using these test structures. The stress gradient due to the stress variation through the film thickness was calculated by measuring the deflection at the cantilever free end.

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Nanohole Fabrication using FIB, EB and AFM for Biomedical Applications

  • Zhou, Jack;Yang, Guoliang
    • International Journal of Precision Engineering and Manufacturing
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    • 제7권4호
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    • pp.18-22
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    • 2006
  • Although many efforts have been made in making nanometer-sized holes, there is still a major challenge in fabricating individual single-digit nanometer holes in a more controllable way for different materials, size distribution and hole shapes. In this paper we describe our efforts to use a top down approach in nanofabrication method to make single-digit nanoholes. There are three major steps towards the fabrication of a single-digit nanohole. 1) Preparing the freestanding thin film by epitaxial deposition and electrochemical etching. 2) Making sub-micro holes ($0.2{\mu}\;to\;0.02{\mu}$) by focused ion beam (FIB), electron beam (EB), atomic force microscope (AFM), and others methods. 3) Reducing the hole size to less than 10 nm by epitaxial deposition, FIB or EB induced deposition and micro coating. Preliminary work has been done on thin films (30 nm in thickness) preparation, sub-micron hole fabrication, and E-beam induced deposition. The results are very promising.

멤브레인 구조 제작은 위한 단결정 실리콘의 이방성 습식 식각 (Anisotropic Wet Etching of Single Crystal Silicon for Formation of Membrane Structure)

  • 조남인;강창민
    • 반도체디스플레이기술학회지
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    • 제2권4호
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    • pp.37-40
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    • 2003
  • 반도체 장비의 기능성과 신뢰성을 높이기 위하여 부품의 제조기술은 점차 마이크로 머신 기술을 요구하고 있다. 마이크로머신 기술 중 hot junction이 위치하는 멤브레인 구조는 각종 센서와 히터의 미세부품에서 가장 이용도가 큰 구조이다. 실험에서는 마이크로머신의 기본 구조인 멤브레인 형태를 만들기 위해 KOH 용액과 TMAH 용액으로 단결정 실리콘을 이방성 습식식각 하였다. 실험결과, 식각액의 온도와 농도, 마스크 패턴과 웨이퍼의 결정성의 일치 등을 고려해야 하며, 식각 속도는 KOH 농도 및 온도에 따라 크게 변함을 알 수 있었다. KOH 용액은 30 wt% 80~$90^{\circ}C$ 온도 범위에서 가장 좋은 특성을 나타냈다. 한편, TMAH용액이 실리콘을 식각하는 용액으로 관심을 끄는 것은 단결정에서 상대적으로 $SiO_2$ 박막을 마스크로 사용할 수 있을 뿐 아니라 $SiO_2$ 박막을 마스크로 사용할 수 있을 뿐 아니라 다른 식각액보다 찌꺼기가 적다는 장점 때문이다. 그러나, 다른 용액에 비해 가격이 고가이며 식각 속도가 낮다는 것이 실용적인 측면에서 큰 단점이다. 실험결과를 종합적으로 고려할 때 KOH 용액 농도 30wt%와 온도 $90^{\circ}C$가 마이크로머신 기술에 의한 멤브레인 구조 제작에서 적합한 공정조건이라고 할 수 있다.

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다이아몬드 와이어에 의해 절단된 다결정 실리콘 태양전지의 나노텍스쳐링 및 후속 식각 연구 (Nanotexturing and Post-Etching for Diamond Wire Sawn Multicrystalline Silicon Solar Cell)

  • 김명현;송재원;남윤호;김동형;유시영;문환균;유봉영;이정호
    • 한국표면공학회지
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    • 제49권3호
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    • pp.301-306
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    • 2016
  • The effects of nanotexturing and post-etching on the reflection and quantum efficiency properties of diamond wire sawn (DWS) multicrystalline silicon (mc-Si) solar cell have been investigated. The chemical solutions, which are acidic etching solution (HF-$HNO_3$), metal assisted chemical etching (MAC etch) solutions ($AgNO_3$-HF-DI, HF-$H_2O_2$-DI) and post-etching solution (diluted KOH at $80^{\circ}C$), were used for micro- and nano-texturing at the surface of diamond wire sawn (DWS) mc-Si wafer. Experiments were performed with various post-etching time conditions in order to determine the optimized etching condition for solar cell. The reflectance of mc-Si wafer texturing with acidic etching solution showed a very high reflectance value of about 30% (w/o anti-reflection coating), which indicates the insufficient light absorption for solar cell. The formation of nano-texture on the surface of mc-Si contributed to the enhancement of light absorption. Also, post-etching time condition of 240 s was found adequate to the nano-texturing of mc-Si due to its high external quantum efficiency of about 30% at short wavelengths and high short circuit current density ($J_{sc}$) of $35.4mA/cm^2$.

글라스 주형을 이용한 폴리머 미세 형상 핫-엠보싱 공정 연구 (Development of a Hot-Embossing Process using Ceramic Glass Molds for Polymer Micro Structures)

  • 김주한;신기훈
    • 한국공작기계학회논문집
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    • 제16권6호
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    • pp.168-174
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    • 2007
  • A ceramic glass mold was developed for micro hot-embossing and replicated polymer parts are fabricated. The glass-ceramic micro mold could be fabricated with a laser process and a wet etching process and the fabrication time could be saved a lot. Various polymer micro structures can be obtained by hot-embossing. The process parameters such as ho-embossing temperatures or pressures were investigated and optimized. This process can be applied for fabrication of micro structures for flip-chips or micro fluidic channels for bio-engineering. The advantages and disadvantages of this process are discussed, too.

친수성 마이크로 기둥 구조 표면에서의 표면 지형적 특성에 따른 퍼짐성 현상에 대한 실험적 연구 (Experimental study of spreading phenomena on hydrophilic micro-textured surfaces depending on surface geometrical features)

  • 장문영;박세현;유동인
    • 한국가시화정보학회지
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    • 제16권3호
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    • pp.35-39
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    • 2018
  • In multiphase systems, surface wettability is one of dominant design parameters to enhance system performance. Since surface wettability can be maximized and minimized with micro-textured surfaces, therefore micro-textured surfaces are widely countered in various research and engineering fields. In this study, for better understanding of micrometer scaled surface wettability, spreading phenomena is experimentally investigated on the hydrophilic micro-textured surfaces. By photolithography and conventional dry etching method, there are prepared the surfaces with uniformly arrayed micro-pillars. The interfacial motions of a water droplet on the test sections are visualized by high speed camera in top view. On the basis of visualization data, it is analyzed the relation between dynamic coefficient and geometrical features on micro-textured surfaces.

나노스크래치와 HF 식각을 병용한 보로실리케이트 요/철형 구조체 패턴 제작 기술 (Fabrication Technique of Nano/Micro Pattern with Concave and Convex Structures on the Borosilicate Surface by Using Nanoscratch and HF etching)

  • 윤성원;강충길
    • 한국정밀공학회지
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    • 제21권4호
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    • pp.24-31
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    • 2004
  • The objective of this work is to suggest a mastless pattern fabrication technique using the combination of machining by Nanoindenter(equation omitted) XP and HF wet etching. Sample line patterns were machined on a borosilicate surface by constant load scratch (CLS) of the Nanoindenter(equation omitted) XP with a Berkovich diamond tip, and they were etched in HF solution to investigate chemical characteristics of the machined borosilicate surface. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

Aluminum Thin Film Capacitor Using Micro Pore Patterning and Electroless Ni-P plating

  • 이창형;;김태유;서수정
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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    • pp.113-113
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    • 2011
  • 알루미늄 박막 커패시터 제작을 위해 선택적인 알루미늄 etching과 anodizing을 이용한 유전체($Al_2O_3$) 형성, 전극층 형성을 위한 무전해 Ni-P 도금을 진행하였다. $5{\mu}m$ patterns/$10{\mu}m$ space를 가지는 dot patterns을 알루미늄 기판에 patterning하고, 이를 각각의 전류밀도 조건에서 etching한 후, barrier type anodizing을 진행하였다. 유전체에 전극층은 무전해 Ni-P 도금을 통해 형성하였으며, 이렇게 제작된 알루미늄 박막 커패시터 특성을 평가하였다.

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