• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.905-909
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surfaces. One of the available front metal contacts is Ni/Cu plating, which can be mass produced via asimple and inexpensive process. A selective emitter, meanwhile, involves two different doping levels, with higher doping (${\leq}30{\Omega}/sq$) underneath the grid to achieve good ohmic contact and low doping between the grid in order to minimize the heavy doping effect in the emitter. This study describes the formation of a selective emitter and a nickel silicide seed layer for the front metallization of silicon cells. The contacts were thickened by a plated Ni/Cu two-step metallization process on front contacts. The experimental results showed that the Ni layer via SEM (Scanning Electron Microscopy) and EDX (Energy dispersive X-ray spectroscopy) analyses. Finally, a plated Ni/Cu contact solar cell displayed efficiency of 18.10% on a $2{\times}2cm^2$, Cz wafer.

• Journal of Surface Science and Engineering
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• v.43 no.2
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• pp.64-72
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• 2010

CuSnZn electroplating was investigated as alternative to Ni plating. Evaluation of electrolyte and plating process was performed to control physical characteristics of the film, and to collect practical data for application. Hull-cell test was conducted for basic comparison of two commercialized products and developed product. Based on hull-cell test results, long term test of three electrolytes was performed. Various analysis on long term tested electrolyte and samples have been done. Reliable and practical data was collected using FE-SEM (FEI, Sirion), EDX (ThermoNoran SIX-200E), ICP Spectrometer (GBC Scientifi c, Integra XL), FIB (FEI, Nova600) for anlysis. Physical analysis and reliability test of the long term tested film were also carried out. Through this investigation plating time, plating speed, electrolyte composition, electrolyte metal consumption, hardness and corrosion resistance has been compared. This set of data is used to predict and control the chemical composition of the film and modify the physical characteristics of the CuSnZn alloy.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.123.1-123.1
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• 2017

Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.25.2-25.2
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• 2011

Recently, thin film capacitors used for vehicle inverters are small size, high capacitance, fast response, and large capacitance. But its applications were made up of liquid as electrolyte, so its capacitors are limited to low operating temperature range and the polarity. This research proposes using Ni-P alloys by electroless plating as the electrode instead of liquid electrode. Our substrate has a high aspect ratio and complicated shape because of anodic aluminum oxide (AAO). We used AAO because film thickness and effective surface area are depended on for high capacitance. As the metal electrode instead of electrolyte is injected into AAO, the film capacitor has advantages high voltage, wide operating temperature, and excellent frequency property. However, thin film capacitor made by electroless-plated Ni on AAO for full-filling into etched tunnel was limited from optimizing the deposition process so as to prevent open-through pore structures at the electroless plating owing to complicated morphological structure. In this paper, the electroless plating parameters are controlled by temperature in electroless Ni plating for reducing reaction rate. The Electrical properties with I-V and capacitance density were measured. By using nickel electrode, the capacitance density for the etched and Ni electroless plated films was 100 nFcm-2 while that for a film without any etch tunnel was 12.5 nFcm-2. Breakdown voltage and leakage current are improved, as the properties of metal deposition by electroless plating. The synthesized final nanostructures were characterized by scanning electron microscopy (SEM).

• Journal of Surface Science and Engineering
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• v.41 no.6
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• pp.312-324
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• 2008

In this study, the functional property as a super abrasive material was secured for CBN powder by the electroless Ni-P plating on the surface of the particle. The plating solution has been prepared to control the surface morphology by regulating surfactants and process conditions. The effects of processing parameters on the surface morphology of CBN powder was discussed. The results are summarized as follows; A stable plating tendency was achieved from 1 hour after quantitatively dropping reducing agent. It was observed that more than 50% of the weight gain was obtained by Ni-P coating on the surface of CBN super abrasive powder. The morphology of the Ni-P coating layer is consisted of botryoidal and spiky type and it could be controlled by regulating processing parameters. Superior characteristic in terms of surface morphology was found in the nonionic surfactant XL-80N. It was found that XL-80N considerably decreased surface tension of CBN powder and Ni-P alloy surface then enhance wettability as well as plating rate. Metal coated CBN powder as a raw material of resin bond wheel has been developed through this investigation.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.314-317
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• 2006

Electroformed part is widely used in modem manufacturing industries, especially semi-conductor division. It is basically a specialized form of electroplating. So, it has very similar parameters with electroplating. The object of this study is development of the fine metal mask by electroforming process. In this paper considered two parameters. The first is relationship of UV exposure and soft baking time. The other one is thickness uniformity of electroformed parts by distance of between electrodes. This paper presents the fabrication method of fine metal mask by electroforming process.

• Journal of Korean Society of Water and Wastewater
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• v.19 no.2
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• pp.200-208
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• 2005

In this study, a new submerged membrane bioreactor process packed with granular sulfur (MBR-GS) was operated to identify the biological nitrogen removal behaviors with plating wastewater containing high-strength $NO_3{^-}$ concentration. The continuous denitrification was carried out at $20^{\circ}C$ with various nitrogen loading rates using synthetic wastewater, which composed of $NO_3{^-}$ and $HCO_3{^-}$, but also actual plating wastewater, which was collected from the effluent of the H metal plating company. As a result, high-rate denitrification in the range of $0.8kg\;NO_3{^-}-N/m^3\;day$ was accomplished at nitrogen loading rate of $0.9kg\;NO_3{^-}-N/m^3\;day$ using synthetic wastewater. Also, higher-rate denitrification with actual plating wastewater was achieved up to $0.91kg\;NO_3{^-}-N/m^3\;day$ at the loading rate of $1.11kg\;NO_3{^-}-N/m^3\;day$. Additionally, continuous filtration was possible during up to 30 days without chemical cleaning in the range of 20 cmHg of transmembrane pressure. On the basis of the proposed stoichiometry, ${SO_4}^{2-}$ production could be estimated efficiently, while observed alkalinity consumption was somewhat lower than theoretical value. Consequently, a new process, MBR-GS is capable of high-rate autotrophic denitrification by compulsive flux and expected to be utilized as an alternative of renovation techniques for nitrogen removal from not only plating wastewater but also municipal wastewater with low C/N ratio.

• Resources Recycling
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• v.32 no.2
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• pp.12-18
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• 2023

In 2018, the demand for silver (referred to as Ag) in the electrical and electronics sector was 249 million tons. The demand stood at 81 million tons in the solar module production sector. Currently, due to the rapid increase in solar module installation, the demand for silver is increasing drastically in Korea. However, Korea's natural metal resources and reserves are insufficient in comparison to their consumption, and the domestic silver ore self-sufficiency rate was as low as 2.2% as of 2021. This implies that a recycling technology is necessary to recover valuable metal resources contained in the waste plating solution generated in the metal industry. Therefore, this study compared and analyzed, the results of the impact evaluation through life cycle assessment according to an improvement in the process of recovery of valuable metals in the waste plating solution. The process improvement resulted in reducing GWP (Global Warming Potential) and ADP(Abiotic Depletion Potential) by 50% and 67%, respectively. The GWP of electricity and industrial water was reduced by 98% and 93%, respectively, which significantly contributed to the minimization of energy and water consumption. Thus, the improvement in recycling technology has a high potential to reduce chemical and energy use and improve resource productivity in the urban mining industry.

• Journal of Surface Science and Engineering
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• v.49 no.6
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• pp.530-538
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• 2016

There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina ($Al_2O_3$), aluminium nitride (AlN), and silicon nitride ($Si_3N_4$). In this study, the plating of metal layers on an insulating silicon nitride ($Si_3N_4$) ceramic substrate was developed. We formed a Pd-$TiO_2$ adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating $Si_3N_4$ substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the $TiO_2$ layer. The electrical resistivity of Ni and Cu layers is $7.27{\times}10^{-5}$ and $1.32{\times}10^{-6}ohm-cm$ by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.

• Journal of Technologic Dentistry
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• v.22 no.1
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• pp.49-55
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• 2000

In manufacturing the all-ceramic crown whick look close to natural teeth, the effectiveness of the improved technique is expectected the technique of the heat treatment of gold plating coating die was experimented of a refractory cast model. The following results were obtainde 1. An advantage of build up on east die with out manufacturing veneer, crown, core, or masking(reduction of technical process, and retrenchment of time and money) 2. Esthetically more close to natural teeth than other technique 3. Easy to remove a refractors cast die 4. In manufacturing ceramo-metal crown the enomous effectiveness was obtainde on applying in the areas of cervical margin, the metal surface, and in the treatment of pinhole.